DATA SHEET
Product Name Anti-Surge Thick Film Chip Resistors
Part Name AS Series
Uniroyal Electronics Global Co., Ltd.
88#, Longteng Road, Economic & Technical Development Zone, Kunshan, Jiangsu, China
Tel
Email
Manufacture Plant
+86 512 5763 1411 / 22 /33
marketing@uni-royal.cn
Uniroyal Electronics Industry Co., Ltd.
Aeon Technology Corporation
Royal Electronic Factory (Thailand) Co., Ltd.
Royal Technology (Thailand) Co., Ltd.
Anti-Surge Thick Film Chip Resistors
1. Scope
1.1 This datasheet is the characteristics of Anti-Surge Thick Film Chip Resistors manufactured by UNI-ROYAL.
1.2 Superior Anti-surge Voltage performance
1.3 Suitable for both wave& re-flow soldering
1.4 Application AV adapters,LCD back-light camera strobe etc.
2. Part No. System
Part No. includes 14 codes shown as below:
2.1 1st~4th codes: Part name. E.g.: AS02,AS05,AS06,AS07,AS10,AS12.
2.2 5th~6th codes: Power rating.
E.g.: W=Normal Size
“1~G” = “1~16”
Wattage
1/32
3/4
1/2
1/3
1/4
1/8
1/10
1/16
1/20
1
Normal Size
WH
07
W2
W3
W4
W8
WA
WG
WM
1W
If power rating is equal or lower than 1 watt, 5th code would be “W” and 6th code would be a number or letter.
E.g.: WA=1/10W
W4=1/4W
2.3 7th code: Tolerance. E.g.: D=±0.5%
F=±1%
G=±2%
J=±5%
K= ±10%
2.4 8th~11th codes: Resistance Value.
2.4.1 If value belongs to standard value of E-24 series, the 8th code is zero, 9th~10th codes are the significant figures of resistance value, and the
11th code is the power of ten.
2.4.2 If value belongs to standard value of E-96 series, the 8th~10th codes are the significant figures of resistance value, and the 11th code is
the power of ten.
2.4.311th codes listed as following:
0=100 1=101
2=102
3=103
4=104
5=105
6=106
J=10-1 K=10-2 L=10-3 M=10-4
th
th
2.5 12 ~14 codes.
2.5.1 12th code: Packaging Type. E.g.: C=Bulk
T=Tape/Reel
2.5.2 13th code: Standard Packing Quantity.
4=4,000pcs
5=5,000pcs
C=10,000pcs
D=20,000pcs
E=15,000pcs
Chip Product: BD=B/B-20000pcs
TC=T/R-10000pcs
2.5.3 14th code: Special features.
E = Environmental Protection, Lead Free, or Standard type.
3. Ordering Procedure
(Example: AS06 0.6W ±5% 10KΩ T/R-5000)
A
S
0
6
Product Type:
Fill-in 4 digits with
the chip resistor
type as follows:
AS02
AS03
AS05
AS06
AS07
AS10
AS12
0
Wattage:
W4=1/4W
W2=1/2W
06=0.6W
07=3/4W
1A=1.5W
2W=2W
6
J
0
1
0
3
T
Resistance Value:
5%,10%,20% (E-24 series):
1st code is zero, 2nd~3rd codes are
the significant figures of resistance
value, and the rest code is the
power of ten.
1% (E-96 series):
1st~3rd codes are the significant
figures of resistance value and the
rest code is the power of ten.
J=10-1; K=10-2; L=10-3
5
E
Packing
quantity:
1=1000PCS
2=2000PCS
3=3000PCS
4=4000PCS
5=5000PCS
C=10000PCS
Special Feature
E= Lead-Free
Tolerance:
J=±5%K=±10%
M=±20%
Apr.29,2020 V.5
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Packing Type:
T=Tape/Reel
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Anti-Surge Thick Film Chip Resistors
4. Marking
4.1 For AS02 size. Due to the very small size of the resistor’s
body, there is no marking on the body.
4.2 ±5%±10% ±20% tolerance products (E-24 series):
3 codes.
1st~2nd codes are the significant figures of resistance value,
and the rest code is the power of ten.
333 33K
4.3 5%±10% ±20%Tolerance:
below 10 Show as following, read alphabet”R”
as decimal point.
2R2 2.2
5. Dimension
Dimension(mm)
Type
AS02(0402)
L
1.00±0.10
W
H
0.50±0.05
0.35±0.05
A
0.20±0.10
B
0.25±0.10
AS03(0603)
1.60±0.10
0.80±0.10
0.45±0.10
0.30±0.20
0.30±0.20
AS05(0805)
2.00±0.15
1.25 +0.15/-0.10
0.55±0.10
0.40±0.20
0.40±0.20
AS06(1206)
3.10±0.15
1.55 +0.15/ -0.10
0.55±0.10
0.45±0.20
0.45±0.20
AS07(1210)
3.10±0.10
2.60±0.20
0.55±0.10
0.50±0.25
0.50±0.20
AS10(2010)
5.00±0.10
2.50±0.20
0.55±0.10
0.60±0.25
0.50±0.20
3.20±0.20
0.55±0.10
0.60±0.25
0.50±0.20
AS12(2512)
6.35±0.10
6. Resistance Range
Type
AS02
AS03
AS05
AS06
AS07
AS10
AS12
Power Rating
at 70℃
1/8W
1/4W
1/2W
0.6W
3/4W
1.5W
2W
5%
1Ω~10MΩ
1Ω~10MΩ
1Ω~10MΩ
1Ω~10MΩ
1Ω~10MΩ
1Ω~10MΩ
1Ω~10MΩ
Resistance Range
10%
1Ω~10MΩ
1Ω~10MΩ
1Ω~10MΩ
1Ω~10MΩ
1Ω~10MΩ
1Ω~10MΩ
1Ω~10MΩ
20%
1Ω~10MΩ
1Ω~10MΩ
1Ω~10MΩ
1Ω~10MΩ
1Ω~10MΩ
1Ω~10MΩ
1Ω~10MΩ
7. Ratings
Type
Max.
Working Voltage
AS02
AS03
AS05
AS06
AS07
AS10
AS12
50V
75V
150V
200V
200V
400V
500V
Apr.29,2020 V.5
Max.
Overload
Voltage
100V
150V
300V
400V
500V
800V
1000V
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Dielectric withstanding
Voltage
Operating Temperature
-300V
500V
500V
500V
500V
500V
-55℃~155℃
-55℃~155℃
-55℃~155℃
-55℃~155℃
-55℃~155℃
-55℃~155℃
-55℃~155℃
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Anti-Surge Thick Film Chip Resistors
8.
Soldering pad size recommended
Type
AS03
AS05
AS06
AS07
AS10
AS12
A
0.8±0.05
1.0±0.1
2.0±0.1
2.0±0.1
3.6±0.1
4.9±0.1
Dimension(mm)
B
C
0.65±0.05
0.8±0.05
1.0±0.1
1.4±0.1
1.1±0.1
1.8±0.1
1.1±0.1
3.0±0.1
1.4±0.1
3.0±0.1
1.35±0.1
3.7±0.1
D
2.4±0.05
3.0±0.1
4.2±0.1
4.2±0.1
6.4±0.1
7.6±0.1
9. Derating Curve
Power rating will change based on continuous load at ambient temperature from -55 to 155℃.
It is constant between -55 to 70℃, and derate to zero when temperature rise from 70 to 155℃.
Voltage rating:
Resistors shall have a rated direct-current (DC) continuous working voltage or an approximate sine-wave
root-mean-square (RMS) alternating-current (AC) continuous working voltage at commercial-line
frequency and waveform corresponding to the power rating, as determined from the following formula:
RCWV √
R
Remark: RCWV: Rating Continuous Working Voltage (Volt.) P: power rating (Watt)
R: nominal resistance (Ω)
In no case, the rated DC or RMS AC continuous working voltage must be greater than the applicable maximum value.
The overload voltage is 2.5 times RCWV or Max. Overload voltage whichever is lower.
10. One-pulse Limiting Electric Power
Curve of Pulse Duration :
Pulse Voltage Limit :
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Anti-Surge Thick Film Chip Resistors
11. Structure
12. Performance Specification
Characteristic
Temperature
Coefficient
Test Methods
(GB/T5729&JIS-C-5201&IEC60115-1)
Limits
1Ω≦R≤10Ω:±400PPM/℃
10Ω<R≤10M: ±100PPM/℃
4.8 Natural resistance changes per temp. Degree centigrade
R2-R1
× 106 (PPM/℃)
R1(t2-t1)
R1: Resistance Value at room temperature (t1);
R2: Resistance at test temperature
(Upper limit temperature or Lower limit temperature)
t1: +25°C or specified room temperature
t2: Upper limit temperature or Lower limit temperature test
temperature
Short-time
overload
±(1.0%+0.1Ω)
4.13 Permanent resistance change after the application of 2.5 times
RCWV for 5 seconds.
Terminal
bending
±(1.0%+0.05Ω)
4.33 Twist of test board: Y/X = 3/90 mm for 60Seconds
Solderability
Coverage must be over 95%.
4.17 The area covered with a new, smooth, clean, shiny and
continuous surface free from concentrated pinholes. Temperature of
solder:245±3°C; Dwell time in solder: 2~3 seconds.
Dielectric
withstanding
voltage
No evidence of flashover
mechanical damage, arcing or
insulation breakdown.
4.7 Clamped in the trough of a 90℃ metallic V-block and shall be
tested at ac potential respectively specified in the type for 60-70
seconds
Soldering heat
±(1.0%+0.05Ω)
4.18 Dipping the resistor into a solder bath having a temperature of
260℃5℃ and hold it for 10±1 seconds
Rapid change of
temperature
±(1.0%+0.05)
4.19 30 min at lower limit temperature and 30 min at upper limit
temperature,100 cycles.
Load life
in humidity
±(3.0%+0.1)
7.9 Resistance change after 1,000 hours (1.5 hours “ON”,0.5 hour
“OFF”) at RCWV in a humidity chamber controlled at 40℃±2℃ and
90 to 95% relative humidity.
Load life
±(3.0%+0.1)
4.25.1 Permanent resistance change after 1,000 hours operating at
RCWV with duty cycle 1.5 hours “ON”, 0.5 hour “OFF” at 70℃±2℃
ambient.
Humidity
( steady state )
±(3.0%+0.1)
4.24Temporary resistance change after 240 hours exposure in a
humidity test chamber controlled at 40±2℃ and 90-95% relative
humidity,
±(3.0%+0.1)
4.23.4
Lower limit temperature,for 2H.
±(3.0%+0.1)
4.23.2
Upper limit temperature ,for 1000H.
Low
Temperature
Storage
High
Temperature
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Anti-Surge Thick Film Chip Resistors
Exposure
Leaching
No visible damage
J-STD-002 Test D
Samples completely immersed for 30 sec in solder bath at 260℃
13. Soldering Condition
(This is for recommendation, please customer perform adjustment according to actual application)
13.1 Recommend Reflow Soldering Profile:(solder : Sn96.5 / Ag3 / Cu0.5)
Profile Feature
Lead (Pb)-Free solder
Preheat:
Temperature Min (Tsmin)
150℃
Temperature Max (Tsmax)
200℃
Time (Tsmin to Tsmax ) (ts)
60 -120 seconds
Average ramp-up rate:
(Ts max to Tp)
3℃ / second max.
Time maintained above :
Temperature (TL)
217℃
Time (tL)
60-150 seconds
Peak Temperature (Tp)
260℃
Time within
0
℃ of actual peak Temperature (tp)2
5
10 seconds
Ramp-own Rate
6℃/second max.
Time 25℃ to Peak Temperature
8mimutes max.
Allowed Re-flow times : 2 times
Remark : To avoid discoloration phenomena of chip on terminal electrodes, please use N2 Re-flow furnace .
13.2 Recommend Wave Soldering Profile:(Apply to 0603 and above size)
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Anti-Surge Thick Film Chip Resistors
13. Packing
13.1 Dimension of Paper Taping :(Unit: mm)
Type
A
±0.10
B
±0.10
C
±0.05
AS02
0.65
1.20
2.00
TYPE
A
0.2
B
0.2
C
0.05
AS03
1.10
1.90
AS05
1.65
2.40
AS06
2.00
AS07
2.80
.
ΦD
1.50
E
±0.1
F
±0.05
G
±0.1
W
±0.2
T
±0.05
1.75
3.50
4.00
8.00
0.42
.
E
0.1
F
0.05
G
0.1
W
0.2
T
±0.10
2.00
1.50
1.75
3.50
4.00
8.00
0.67
2.00
1.50
1.75
3.50
4.00
8.00
0.81
3.60
2.00
1.50
1.75
3.50
4.00
8.00
0.81
3.50
2.00
1.50
1.75
3.50
4.00
8.00
0.75
ΦD
13.2 Dimension of plastic taping:(Unit: mm)
Type
A
0.2
B
0.2
C
0.05
AS10
2.90
5.60
2.00
AS12
3.50
6.70
2.00
ΦD
.
1.50
1.50
E
0.1
F
0.05
G
0.1
W
0.2
T
±0.1
1.50
1.75
5.50
4.00
12.00
1.00
1.50
1.75
5.50
4.00
12.00
1.00
C0.5
21.0
21.0
21.0
21.0
21.0
21.0
21.0
D1
60.0
60.0
60.0
60.0
60.0
60.0
60.0
ΦD1
.
13.3 Dimension of Reel:(Unit: mm)
Type
AS02
AS03
AS05
AS06
AS07
AS10
AS12
Taping
Paper
Embossed
Size
10,000pcs
5000pcs
4000pcs
A0.5
2.0
2.0
2.0
2.0
2.0
2.0
2.0
B0.5
13.0
13.0
13.0
13.0
13.0
13.0
13.0
M2
178.0
178.0
178.0
178.0
178.0
178.0
178.0
W1
10.0
10.0
10.0
10.0
10.0
13.8
13.8
14. Note
14.1. UNI-ROYAL recommend products store in warehouse with temperature between 15 to 35℃ under humidity between 25 to 75%RH.
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Anti-Surge Thick Film Chip Resistors
Even under storage conditions recommended above, solder ability of products will be degraded stored over 1 year old.
14.2. Cartons must be placed in correct direction which indicated on carton, otherwise the reel or wire will be deformed.
14.3. Storage conditions as below are inappropriate:
a. Stored in high electrostatic environment
b. Stored in direct sunshine, rain, snow or condensation.
c. Exposed to sea wind or corrosive gases, such as Cl2, H2S, NH3, SO2, NO2, etc.
15. Record
Version
Description
Page
Date
Amended by
Checked by
1
First version
1~7
Mar.20, 2018
Haiyan Chen
Nana Chen
2
Modify characteristic
5~6
Feb.13, 2019
Haiyan Chen
Yuhua Xu
7
July.29, 2019
Haiyan Chen
Yuhua Xu
7
July.29, 2019
Haiyan Chen
Yuhua Xu
6~7
Apr.29, 2020
Haiyan Chen
Yuhua Xu
3
4
5
Modify the High Temperature Exposure
conditions
Modify the High Temperature Exposure
conditions
Modify the reflow curve and add the wave
soldering curve
© Uniroyal Electronics Global Co., Ltd. All rights reserved. Specification herein will be changed at any time without prior notice.
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