MSL-1947HB3

Surface Mount Chip LEDs Description The MSL-1947HB3, a BLUE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaN on Sapphire LED chip technology and water clear epoxy package. MSL-1947HB3 Package Dimensions Applications l l l l Small Size (Extra Thin) Industry Standard Footprint(0603) Compatible with IR Solder process Availalble in 8 mm Tape on 7"(178mm) Diameteer Reels Features l l l l Recommended Solder Patterns Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Panel Indicator NOTE: 1. All dimensions are in millimeter (inches) 2. Tolerance is ± 0.15mm (.006") unless otherwise specified. Absolute Maximum Ratings @ TA=25 C Parameter Peak Forward Current(1/10 Duty Cycle@1KHz ) DC Forward Current Power Dissipation Reverse Voltage Electrostatic Discharge Threshold (HBM) Note A Operating Temperature Range Storage Temperature Range Note A : HBM(Human Body Model) o Symbol IFP IF PD VR EOT TOPR TSTG Maximum Rating 100 30 125 5 300 -25 C to +80 C -30oC to +100oC o o Unit mA mA mW V V Unity Opto Technology Co., Ltd. 04/02/2003 MSL-1947HB3 Optical-Electrical Characteristics @ TA=25oC Item Luminous Intensity Forward Voltage Dominant Wavelength Threshould Voltage Reverse Voltage Reverse Current Dominant Wavelength Relative Luminous Intensity Conditions IF=10mA IF=20mA IF=20mA IF=10uA IR=10uA VR=5V IF=20mA Symbol IV VF λd Vth VR IR λd Min . 23 3.0 465 2.0 10.0 465 Typ . 468 - Max . 3.5 470 2.6 50.0 475 Unit . mcd V nm V V µA nm Typical Optical-Electrical Characteristic Curves Forward Current IF(mA) 1 30 25 20 15 10 5 0 0 1 2 3 4 0.5 0 380 450 520 590 660 Wavelength (nm) FIG.1 RELATIVE INTENSITY LUMINOUS VS. WAVELENGTH Forward Current IF (mA) 40 30 20 10 0 0 25 50 75 100 Forward Voltage (V) FIG.2 FORWARD CURRENT VS. FORWARD VOLTAGE Relative Luminous Intensity Normalized at IF=20mA 1.50 1.25 1.00 0.75 0.50 0.25 0.00 0 5 10 15 20 25 30 Ambient Temperature (oC) FIG.3 FORWARD CURRENT VS. AMBIENT TEMPERATURE Relative Luminous Intensity 10 Forward Current IF (mA) FIG.4 RELATIVE LUMINOUS INTENSITY VS. FORWARD CURRENT Relative Luminous Intensity 0o 10o 20o 30° 40° 1.0 0.9 0.8 0.5 0.3 0.1 0.2 0.4 0.6 50° 60° 70° 80° 90° 1 0.1 0 25 50 75 Ambient Temperature ( C) FIG.5 LUMINOUS INTENSITY VS. AMBIENT TEMPERATURE o FIG.6 RADIATION DIAGRAM Unity Opto Technology Co., Ltd. 04/02/2003 MSL-1947HB3 Sorting For Luminous Intensity And Dominant Wavelength Forward Voltage Rank Markings VF (Volts) @IF = 5mA Min A B 2.70 2.80 Max 2.80 2.90 Luminous Intensity Iv(mcd) IF=10mA Min 23.00 25.00 Max 35.00 35.00 Dominant Wavelength λd(nm) IF=20mA Min 465.0 465.0 Max 470.0 470.0 Remark Unity Opto Technology Co., Ltd. 04/02/2003 MSL-1947HB3 GaN LED HANDLING PRECAUTION The blue LED is a device that is very sensitive to serge voltage produced when static electricity is discharged.Handling with sufficient care is needed to prevent damage to a chip or a drop in its reliability. Also, the same handling care is needed when applying voltage over the absolute maximum rating. (Be aware of serge voltage produced when you turn the on-off switch) How to prevent electrical charge and discharge during operation If the person who is electrically charged touches the part, there is a possibility of electric discharge toward the semiconductor device which may destroy the part, if the part is electrically charged inductively by the surroundings,or the part is electrically charged by friction and touches metal, the part may discharge static and cause damage. During your operations,please take these countermeasures written below. 1. Do not let material which is electrically chaged get close to the part. (Avoid contact with metal when the part is electrically charged) 2. Avoid any friction process with the part 3. Be sure to ground all manufacturing machines and measuring instruments if possible 4. Make an anti-static environment, such as placing electrically conductive mat (below 106Ω )or using anti-static equipment such as static blow Let the worker wear the anti-static wrist strap, (Electrical resistance of 250K-1MΩ must be placed in series to avoid an electric shock.) Working Environment In case of semiconductor device, static occurs easily in dry condition . Especially the surface mount led should be kept in a dry environment to avoid moisture absorbency .But a relative humidity of 50% or more is recommended for the process after the soldering . Static level should be kept under 300V at your working area. Unity Opto Technology Co., Ltd. 04/02/2003 MSL-1947HB3 RECOMMENDED SOLDERING CONDITION Reflow Soldering. Temperature-Profile Temp 2.5~5oC / sec. o 240oC Max. 5sec. Max. 40sec. Max. Above 200oC 2.5~5 C / sec. Pre-heating 120~150oC 120sec. Max. Time Unity Opto Technology Co., Ltd. 04/02/2003 MSL-1947HB3 Recommended Soldering Conditions 1.Reflow Soldering (1).The Fig. 1 temperature profile shall be at the surface of LED resin. (2).Number of reflow process shall be less than 2 times. If second reflow process would be performed,intervals between first and second process shall be as short as possible to prevent absorption of moisture to resin of LED Cooling process to nomal temp,shall be required between first and second refiow process (3).Temp,fluctuation to LED at pre-heat process shall be minimized.(Less than 6oC) 2.Dip Soldering (1).Preheat temp,for soldering:120-150oC ,60-120sec (2).Soldering temp:Temp of soldering pot 260 MAX.less than 5sec (3).Number of dip soldering process shall be less than 2 times and these process shall be performed in a row. Cooling process to normal temp, shall be required between first and second soldering process. 3.Other Caution (1).Manual soldering should be less than 280oC within 3 sec. (2).Heat or UV(or both)curing resin shall used for preliminary fixing. Curing condition or temp,:150oC MAX.less than 120sec (3).Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temp,after soldering (4).If manual soldering would be performed to repair LED by tweezers, mechanical force to resin should not be given Unity Opto Technology Co., Ltd. 04/02/2003 MSL-1947HB3 Tape Dimensions Pocessive direction φ1.5±0.1 0.059 4.0±0.1 0.158 Polarity 0.754 0.03 0.254 0.01 0.9 0.035 4.0±0.1 0.158 Units: mm / inch 2.0±0.05 0.079 REEL Dimensions φ13.5±0.2 φ 60±0.5 9.0±0.1 12.0±0.15 φ 178±2 Units: mm / inch Unity Opto Technology Co., Ltd. 04/02/2003 1.75 0.069 3.5±0.05 0.138 8.0±0.3 0.315 1.75±0.1 0.069 MSL-1947HB3 Packaging Product lable: Loaded quantity per reel : 4000 pcs / reel CUSTOMER: CUSTOMER P/N: DEVICE TYPE: BIN: LOT NO: Q'TY: DATE: STORAGE PERIOD: Damp-proofbag un-opened: 6 month max. Temperature: 5 to 30oC; humidity:70%RH, max; 6 month max. STORAGE PRECAUTIONS: After open the laminate bag the lamps should be storage in the follow condition: Temperature: 5 to 30oC; humidity:70%RH, max; storage time: 72hrs max Baking condition: If backing is necessary, we recommended the backing condition is 60+/- 5oC 10hours Packing Box Product lable: Loaded quantity per box : 20,000 pcs / box CUSTOMER: CUSTOMER P/N: DEVICE TYPE: BIN: LOT NO: Q'TY: DATE: Unity Opto Technology Co., Ltd. 04/02/2003 MSL-1947HB3 Reel Packing Direction of take out Items Cover Leader Tape Carrier Tape Traiier Empty Pockets Specifications Cover tape shall be longer than 200 mm without carrier tape There will be more than 10 empties There will be more than 15 empties There will be a maximum of 3 empty component pockets Remarks The end of the tape shall be adhered to tape The orientation of tape is as shown The end of the tape is inserted into a slit of the hub The maximum connecting pockets in the middle of carriertape Unity Opto Technology Co., Ltd. 04/02/2003