MSL-518SB

Unity Opto Technology Co., Ltd. Technical Data µSideLEDs MSL-518SB PRELIMINARY 08/14/2003 Features l l Package : white micro-sideview PLCC-2 package with clear silicon. Feature of the device : extremely wide viewing angle ideal for backlighting and coupling in light guides l l l l l l l l Wavelength : Typical : 470nm Viewing angle : Lambertian Emitter (X : 120o / Y : 120o) Technology : InGaN on SiC with clear silicon Grouping parameter : luminous intensity , Chromaticity Assembly methods : suitable for all SMT assembly methods Soldering methods : IR reflow soldering Preconditioning : acc. to JEDEC Level 3 Taping : 8-mm tape with 3500/reel, φ180mm Applications l Backlighting : LCD Display, Key pads 1 Package Dimensions Unit : mm (inch) Notes : 1. All dimensions are in millimeters (inches) 2. Tolerance is ±0.1 unless other specified Recommended Solder Patterns 1.6 1.6 1.1 2.1 Method of Taping / Polarity and Orientation Packing unit 3500/reel 4.24±0.1 1.02±0.1 1.54±0.1 Notes : 1. All dimensions are in millimeters (inches) 2. Tolerance is ±0.1 unless other specified 2 Selection Guide Luminous Intensity Part Number Bin MSL-518SB R S T U Wavelength nm Min. 75 104 150 213 mcd Typ. - Max. 104 150 213 300 Min. 460 Typ. 470 Max. 475 Viewing Angle 2θ 1/2 (Degrees) x y Typ. Typ. 120 120 Device Type Min. MSL-518SB - Forward Voltage VF (Volts) @IF = 20mA Typ. 3.1 Max 4.0 Reverse Current IR (uA) @ VR = 5V Min. Typ. Max 50 Thermal Resistance o Rθ J-S ( C/W) Max 50 Maximum Ratings Value Unit o -30 ~ +85 Operating Temp. range C o -40 ~ +100 Storage Temp. range C 30 mA Forward current mA 100 Peak forward current 5 V Reverse Voltage 120 mW Power dissipation Reflow Soldering : 260oC, for 10 sec Tsid Soldering Temperature Hand Soldering : 350oC, for 3 sec IFP Conditions : Pulse Width