Unity Opto Technology Co., Ltd.
Technical Data µSideLEDs
MSL-518SW
PRELIMINARY
08/14/2003
Features
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Package : white micro-sideview PLCC-2 package with yellow silicon. Feature of the device : extremely wide viewing angle ideal for backlighting and coupling in light guides
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color : x/y coordinate : 0.31/0.32 Viewing angle : Lambertian Emitter (X : 120o / Y : 120o) Technology : InGaN on sapphire with yellow phosphor (white) Grouping parameter : luminous intensity , Chromaticity Assembly methods : suitable for all SMT assembly methods Soldering methods : IR reflow soldering Taping : 8-mm tape with 3500/reel, φ180mm
Applications
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Backlighting
: LCD Display, Key pads
1
Package Dimensions
Unit : mm (inch)
Notes : 1. All dimensions are in millimeters (inches) 2. Tolerance is ±0.1 unless other specified
Recommended Solder Patterns
1.6 1.6
1.1
2.1
Method of Taping / Polarity and Orientation Packing unit 3500/reel
4.24±0.1
1.02±0.1
1.54±0.1
Notes : 1. All dimensions are in millimeters (inches) 2. Tolerance is ±0.1 unless other specified
2
Selection Guide
Viewing Angle Luminous Part Number Bin
R MSL-518SW S T
Chromaticity Coordinates (Typ.) x y Typ.
0.32 0.32 0.32
2θ 1/2 (Degrees) x Typ.
120 120 120
Intensity Min.
360 500 720
y Typ.
120 120 120
Typ.
-
Max.
500 720 1000
Typ.
0.31 0.31 0.31
Forward Voltage Device Type Min.
MSL-518SW
Reverse Current IR (uA) @ VR = 5V Max
4.0
Thermal Resistance Rθ J-S (oC/W) Max
10
VF (Volts) @IF = 20mA Typ.
3.3
Min.
Typ.
Typ.
220
Maximum Ratings
Parameter
Operating Temp. range Storage Temp. range
Symbol T OP T stg IF I FM VR P tot Tsid
Value -30 ~ +85 -40 ~ +100 30 100 5 120
o
Unit
o o
C
Forward current Peak forward current Reverse Voltage Power dissipation Soldering Temperature
C mA mA V mW
Reflow Soldering : 260 C, for 10 sec
Hand Soldering : 350oC, for 3 sec IFP Conditions : Pulse Width
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