MSL-518SW

Unity Opto Technology Co., Ltd. Technical Data µSideLEDs MSL-518SW PRELIMINARY 08/14/2003 Features l l Package : white micro-sideview PLCC-2 package with yellow silicon. Feature of the device : extremely wide viewing angle ideal for backlighting and coupling in light guides l l l l l l l color : x/y coordinate : 0.31/0.32 Viewing angle : Lambertian Emitter (X : 120o / Y : 120o) Technology : InGaN on sapphire with yellow phosphor (white) Grouping parameter : luminous intensity , Chromaticity Assembly methods : suitable for all SMT assembly methods Soldering methods : IR reflow soldering Taping : 8-mm tape with 3500/reel, φ180mm Applications l Backlighting : LCD Display, Key pads 1 Package Dimensions Unit : mm (inch) Notes : 1. All dimensions are in millimeters (inches) 2. Tolerance is ±0.1 unless other specified Recommended Solder Patterns 1.6 1.6 1.1 2.1 Method of Taping / Polarity and Orientation Packing unit 3500/reel 4.24±0.1 1.02±0.1 1.54±0.1 Notes : 1. All dimensions are in millimeters (inches) 2. Tolerance is ±0.1 unless other specified 2 Selection Guide Viewing Angle Luminous Part Number Bin R MSL-518SW S T Chromaticity Coordinates (Typ.) x y Typ. 0.32 0.32 0.32 2θ 1/2 (Degrees) x Typ. 120 120 120 Intensity Min. 360 500 720 y Typ. 120 120 120 Typ. - Max. 500 720 1000 Typ. 0.31 0.31 0.31 Forward Voltage Device Type Min. MSL-518SW Reverse Current IR (uA) @ VR = 5V Max 4.0 Thermal Resistance Rθ J-S (oC/W) Max 10 VF (Volts) @IF = 20mA Typ. 3.3 Min. Typ. Typ. 220 Maximum Ratings Parameter Operating Temp. range Storage Temp. range Symbol T OP T stg IF I FM VR P tot Tsid Value -30 ~ +85 -40 ~ +100 30 100 5 120 o Unit o o C Forward current Peak forward current Reverse Voltage Power dissipation Soldering Temperature C mA mA V mW Reflow Soldering : 260 C, for 10 sec Hand Soldering : 350oC, for 3 sec IFP Conditions : Pulse Width