L4863L-S16-T

UNISONIC TECHNOLOGIES CO., LTD L4863 DUAL 2.2W AUDIO AMPLIFIER PLUS STEREO HEADPHONE FUNCTION DESCRIPTION The UTC L4863 is a dual bridge-connected audio power amplifier. It combines dual bridge speaker amplifiers and stereo headphone amplifiers on one chip to simplify audio system design. In addition, the headphone input pin allows the amplifiers to operate in single-ended mode when driving stereo headphones. The IC could deliver different power by packages as below (when connected to a 5V supply with less than 1.0% THD+N.): HTSSOP-20, 4Ω load: 2.2W HTSSOP-20, 3Ω load: 2.5W(with forced-air cooled) SOP/DIP , 8Ω load: 1.1W. The UTC L4863 features an externally controlled, low-power consumption shutdown mode, a stereo headphone amplifier mode, and thermal shutdown protection. It also utilizes circuitry to reduce “clicks and pops” during device turn-on. DIP-16 CMOS IC SOP-16 SOP-18 HTSSOP-20 *Pb-free plating product number: L4863L FEATURES * “Click and pop” suppression * Thermal shutdown protection * Unity-gain stable * Stereo headphone amplifier mode ORDERING INFORMATION Order Number Normal Lead Free Plating L4863-D16-T L4863L-D16-T L4863-S16-R L4863L-S16-R L4863-S16-T L4863L-S16-T L4863-S18-R L4863L-S18-R L4863-S18-T L4863L-S18-T L4863-N20-R L4863L-N20-R L4863-N20-T L4863L-N20-T Package DIP-16 SOP-16 SOP-16 SOP-18 SOP-18 HTSSOP-20 HTSSOP-20 Packing Tube Tape Reel Tube Tape Reel Tube Tape Reel Tube www.unisonic.com.tw Copyright © 2005 Unisonic Technologies Co., Ltd 1 of 10 QW-R107-050,A L4863 PIN CONFIGURATION CMOS IC THERMAL DATA PARAMETER Thermal resistance (Junction to Ambient) SOP-16 SOP-18 DIP-16 HTSSOP-20 SOP-16 SOP-18 DIP-16 HTSSOP-20 SYMBOL θJA RATINGS 80 90 63 90 20 2 20 2 UNIT ℃/W ℃/W ℃/W ℃/W ℃/W ℃/W ℃/W ℃/W Thermal resistance (Junction to Case) θJC UNISONIC TECHNOLOGIES CO., LTD www.unisonic.com.tw 2 of 10 QW-R107-050,A L4863 ABSOLUTE MAXIMUM RATING CMOS IC PARAMETER SYMBOL RATINGS UNIT Supply Voltage VDD 6.0 V Recommended Supply Voltage Range VDD 2.0 ~ 5.5 V Input Voltage VIN -0.3 ~ VDD+0.3 V Power Dissipation PD Internally limited Junction Temperature TJ +125 ℃ Operating Temperature TOPR -40 ~ +85 ℃ Storage Temperature TSTG -65 ~ +150 ℃ Note Absolute maximum ratings are those values beyond which the device could be permanently damaged. Absolute maximum ratings are stress ratings only and functional device operation is not implied. ELECTRICAL CHARACTERISTICS (Notes 1)(VDD=5V, Ta =25℃, unless otherwise specified) PARAMETER FOR ENTIRE IC SYMBOL VDD IDD ISD VIH VIL VIN=0V, IOUT=0A, HP-IN=0V VIN=0V, IOUT=0A, HP-IN=4V VDD applied to the SHUTDOWN pin TEST CONDITIONS MIN TYP MAX UNIT 2 6 2 4 5.5 20 V mA μA V V mV W Supply Voltage Quiescent Power Supply Current (Note 2) Shutdown Current High Headphone Input Voltage Low FOR BRIDGED-MODE OPERATION Output Offset Voltage HTSSOP-20 11.5 5.8 0.7 0.8 5 2.5 2.2 3.2 2.7 1.1 1.5 0.34 0.3 0.3 50 VO(OFF) VIN=0V THD=1%, f=1kHz RL=3Ω RL=4Ω RL=3Ω RL=4Ω RL=8Ω RL=8Ω Output Power (measured at the device terminals) POUT SOP/DIP THD+N=10%, f=1kHz THD=1%, f=1kHz 1.0 W THD+N=10%, f=1kHz THD+N=1%, f=1kHz, RL=32Ω W 20Hz≤f≤20kHz, Total Harmonic HTSSOP-20 RL=4Ω, POUT=2W THD+N % AVD=2 Distortion + Noise SOP/DIP RL=8Ω, POUT=1W VDD=5V, VRIPPLE=200mVRMS, RL=8Ω, 67 dB Power Supply Rejection Ratio PSRR CB=1.0μF Channel Separation XTALK f=1kHz, CB=1.0μF 90 dB Signal To Noise Ratio SNR VDD=5V, POUT=1.1W, RL=8Ω 98 dB FOR SINGLE-ENDED OPERATION Output Offset Voltage VO(OFF) VIN=0V 5 50 mV THD=0.5%, f=1kHz, RL=32Ω 75 85 Output Power POUT THD+N=1%, f=1kHz, RL=8Ω mW 340 THD+N=10%, f=1kHz, RL=8Ω 440 AV=-1, POUT=75mW,20Hz≤f≤20kHz, Total Harmonic Distortion + Noise THD+N 0.2 % RL=32Ω Power Supply Rejection Ratio PSRR CB=1.0μF, VRIPPLE=200mVRMS, f=1kHz 52 dB Channel Separation XTALK f=1kHz, CB=1.0μF 60 dB Signal To Noise Ratio SNR VDD=5V, POUT=340mW, RL=8Ω 95 dB Note:1. All voltages are measured with respect to the ground (GND) pins, unless otherwise specified. 2. Depends on the offset voltage when a practical load is connected to the amplifier. 3. When driving 3Ω or 4Ω and operating on a 5V supply, the HTSSOP-20 package must be mounted to the circuit board that has a minimum of 2.5 in2 of exposed, uninterrupted copper area connected to the exposed-DAP. UNISONIC TECHNOLOGIES CO., LTD www.unisonic.com.tw 3 of 10 QW-R107-050,A L4863 TYPICAL APPLICATION CIRCUIT VDD CI RF 1μF 20KΩ + 6 4,13 - IN A +IN A Bypass CS 0.1µF TANT AMP 1A + 20KΩ -OUT A 5 20KΩ 20KΩ AMP 2A + +OUT A AMP 1B + 20KΩ CMOS IC Audio Input RI 8 20KΩ CB 10 50KΩ VDD/2 50KΩ CONTROL PIN RL 1kΩ RING 8Ω 3 To HP-IN Circuit CO 100µF + RL 8Ω SLEEVE TIP HEADPHONE JACK 1kΩ CO 100µF + Audio Input CI (CB size) 0.33μF 1μ F RI 20KΩ VDD RF 20KΩ 11 -IN B 9 +IN B 100kΩ 1 Shutdown To Control Pin on 16 HP-IN Headphone jack 100KΩ GND 2,7,15 -OUT B 12 20KΩ 20KΩ 14 AMP 2B + +OUT B Note: Pin out shown for DIP-16 and SOP-16 packages. Refer to the PIN CONFIGURATION for the pin out of other packages. Figure 1.Typical Audio Amplifier Application Circuit EXTERNAL COMPONENTS DESCRIPTION Components RI CI RF CS CB Functional Description The inverting input resistance, along with RF, set the closed-loop gain. RI, along with CI form a high pass filter with fc=1/(2πRICI) The input coupling capacitor blocks DC voltage at the amplifier’s input terminals. CI, along with RI, create a high pass filter with fc=1/(2πRICI). Refer to the section. Selecting Proper External Components, for an explanation of determine the value of CI. The feedback resistance, along with RI, set the closed-Ioop gain. The supply bypass capacitor. Refer to the Power Supply Bypassing section for information about properly placing and selecting the value of, this capacitor. The capacitor, CB, filters the half-supply voltage present on the Bypass pin. Refer to the Selecting Proper External Components section for information concerning proper placement and selecting CB’S value. UNISONIC TECHNOLOGIES CO., LTD www.unisonic.com.tw 4 of 10 QW-R107-050,A L4863 TYPICAL CHARACTERISTICS (For HTSSOP-20) CMOS IC THD+N (%) THD+N (%) 10 THD+N vs Output Power VDD=5V, RL=4Ω BW