LM4863G-N20-R

UNISONIC TECHNOLOGIES CO., LTD LM4863 CMOS IC DUAL 2.2W AUDIO AMPLIFIER PLUS STEREO HEADPHONE FUNCTION  DESCRIPTION The UTC LM4863 is a dual bridge-connected audio power amplifier. It combines dual bridge speaker amplifiers and stereo headphone amplifiers on one chip to simplify audio system design. In addition, the headphone input pin allows the amplifiers to operate in single-ended mode when driving stereo headphones. The IC could deliver different power by packages as below (when connected to a 5V supply with less than 1.0% THD+N.): HTSSOP-20, 4Ω load: 2.2W HTSSOP-20, 3Ω load: 2.5W(with forced-air cooled) SOP/DIP , 8Ω load: 1.1W. The UTC LM4863 features an externally controlled, low-power consumption shutdown mode, a stereo headphone amplifier mode, and thermal shutdown protection. It also utilizes circuitry to reduce “clicks and pops” during device turn-on.  FEATURES * “Click and pop” suppression circuitry * Thermal shutdown protection circuitry * Unity-gain stable * Stereo headphone amplifier mode  ORDERING INFORMATION Ordering Number Lead Free LM4863L-D16-T - Halogen Free LM4863G-D16-T LM4863G-S18-R LM4863G-N20-R www.unisonic.com.tw Copyright © 2016 Unisonic Technologies Co., Ltd Package Packing DIP-16 SOP-18 HTSSOP-20 Tube Tape Reel Tape Reel 1 of 12 QW-R107-027.E LM4863  CMOS IC MARKING Packing MARKING DIP-16 SOP-18 HTSSOP-20 UNISONIC TECHNOLOGIES CO., LTD www.unisonic.com.tw 2 of 12 QW-R107-027.E LM4863 CMOS IC PIN CONFIGURATION  SOP-18 DIP-16 SHUTDOWN 1 16 HP-IN 2 15 GND +OUT A 3 14 +OUT B GND 1 SHUTDOWN 18 HP-IN GND 2 17 GND +OUT A 3 16 +OUT B VDD 4 15 VDD -OUT A 5 14 -OUT B VDD 4 13 VDD -OUT A 5 12 -OUT B -IN A 6 11 -IN B -IN A 6 13 -IN B GND 7 10 BYPASS GND 7 12 BYPASS +IN A 8 9 +IN B +IN A 8 11 +IN B GND 9 10 GND PIN DESCRIPTION  PIN NO. PIN NAME DIP-16 SOP-18 HTSSOP-20 4,13 4,15 4,17 VDD 2,7,15 2,7,9,10,17 2,7,9,10,11,12,19 GND 10 12 14 BYPASS I/O PIN DESCRIPTION - Supply voltage Ground Internal mid-supply bias reference bypassing Entire IC into the shutdown mode when this pin connected to the VDD Output mode select, connected to the VDD for SE mode or GND for BTL mode Non-inverting input of channel A, connected to BYPASS pin inside the IC Inverting input of channel A Channel A + output in BTL mode, high impedance in SE mode Channel A - output in BTL mode, + output in SE mode Non-inverting input of channel B, connected to BYPASS pin inside the IC Inverting input of channel B Channel B + output in BTL mode, high impedance in SE mode Channel B - output in BTL mode, + output in SE mode 1 1 1 SHUTDOWN I 16 18 20 HP-IN I 8 8 8 +INA I 6 6 6 -INA I 3 3 3 +OUTA O 5 5 5 -OUTA O 9 11 13 +INB I 11 13 15 -INB I 14 16 18 +OUTB O 12 14 16 -OUTB O UNISONIC TECHNOLOGIES CO., LTD www.unisonic.com.tw 3 of 12 QW-R107-027.E LM4863  CMOS IC ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL RATINGS UNIT Supply Voltage VDD 6.0 V Recommended Supply Voltage Range VDD 2.0 ~ 5.5 V Input Voltage VIN -0.3 ~ VDD+0.3 V Power Dissipation PD Internally limited Junction Temperature TJ +125 °С Operating Temperature TOPR -40 ~ +85 °С Storage Temperature TSTG -65 ~ +150 °С Note Absolute maximum ratings are those values beyond which the device could be permanently damaged. Absolute maximum ratings are stress ratings only and functional device operation is not implied.  THERMAL DATA PARAMETER Junction to Ambient Junction to Case  SYMBOL SOP-18 DIP-16 HTSSOP-20 DIP-16/SOP-18 HTSSOP-20 RATINGS 80 63 90 20 2 θJA θJC UNIT °С/W °С/W °С/W °С/W °С/W ELECTRICAL CHARACTERISTICS (Notes 1)(VDD=5V, TA =25°С, unless otherwise specified) PARAMETER FOR ENTIRE IC Supply Voltage Headphone Input High Voltage Low Quiescent Power Supply Current (Note 2) Shutdown Current FOR BRIDGED-MODE OPERATION Output Offset Voltage SYMBOL VDD VIH VIL IDD ISD VO(OFF) HTSSOP-20 Output Power (measured at the device terminals) Total Harmonic Distortion + Noise POUT DIP-16 SOP-18 HTSSOP-20 DIP-16 SOP-18 TEST CONDITIONS THD+N Power Supply Rejection Ratio PSRR Channel Separation Signal To Noise Ratio XTALK SNR 2 4 VIN=0V, IOUT=0A, HP-IN=0V VIN=0V, IOUT=0A, HP-IN=4V VDD applied to the SHUTDOWN pin 6 RL=3Ω THD=1%, f=1kHz RL=4Ω THD+N=10%, RL=3Ω f=1kHz RL=4Ω THD=1%, f=1kHz RL=8Ω THD+N=10%, RL=8Ω f=1kHz THD+N=1%, f=1kHz, RL=32Ω 20Hz≤f≤20kHz, AVD=2 5.5 2 11.5 5.8 0.7 1.0 5 2.5 2.2 3.2 2.7 1.1 VIN=0V 1.5 0.34 RL=4Ω, POUT=2W 0.3 RL=8Ω, POUT=1W 0.3 0.8 20 V V V mA μA 50 mV W W W % VDD=5V, VRIPPLE=200mVRMS, RL=8Ω, CB=1.0μF f=1kHz, CB=1.0μF VDD=5V, POUT=1.1W, RL=8Ω UNISONIC TECHNOLOGIES CO., LTD www.unisonic.com.tw MIM TYP MAX UNIT 67 dB 90 98 dB dB 4 of 12 QW-R107-027.E LM4863  CMOS IC ELECTRICAL CHARACTERISTICS(Cont.) PARAMETER FOR SINGLE-ENDED OPERATION Output Offset Voltage SYMBOL TEST CONDITIONS MIM TYP MAX UNIT VO(OFF) VIN=0V 5 50 mV THD=0.5%, f=1kHz, RL=32Ω 75 85 Output Power POUT mW THD+N=1%, f=1kHz, RL=8Ω 340 THD+N=10%, f=1kHz, RL=8Ω 440 AV=-1, POUT=75mW,20Hz≤f≤20kHz, 0.2 % Total Harmonic Distortion + Noise THD+N RL=32Ω CB=1.0μF, VRIPPLE=200mVRMS, 52 dB Power Supply Rejection Ratio PSRR f=1kHz Channel Separation XTALK f=1kHz, CB=1.0μF 60 dB Signal To Noise Ratio SNR VDD=5V, POUT=340mW, RL=8Ω 95 dB Note:1. All voltages are measured with respect to the ground (GND) pins, unless otherwise specified. 2. Depends on the offset voltage when a practical load is connected to the amplifier. 3. When driving 3Ω or 4Ω and operating on a 5V supply, the HTSSOP-20 package must be mounted to the circuit board that has a minimum of 2.5 in2 of exposed, uninterrupted copper area connected to the exposed-DAP. UNISONIC TECHNOLOGIES CO., LTD www.unisonic.com.tw 5 of 12 QW-R107-027.E LM4863 CMOS IC TYPICAL APPLICATION CIRCUIT  VDD CI RF 1μF 20KΩ Audio Input + 6 RI 8 20KΩ CB CI (CB size) 0.33μF 1μF RI Audio Input 10 4,13 - IN A +IN A Bypass 11 -IN B 9 +IN B CS 0.1µF TANT 50KΩ AMP 1A + 20KΩ -OUT A 5 20KΩ 20KΩ AMP 2A + +OUT A VDD/2 CONTROL PIN RL 1kΩ RING 8Ω 3 To HP-IN Circuit 50KΩ 20KΩ VDD RF 20KΩ 100kΩ 1 Shutdown To Control Pin on 16 HP-IN Headphone jack 100KΩ AMP 1B + 20KΩ CO 100µF + -OUT B 12 20KΩ 20KΩ 14 AMP 2B + +OUT B CO 100µF + RL 8Ω SLEEVE TIP HEADPHONE JACK 1kΩ GND 2,7,15 Note: Pin out shown for DIP-16. Refer to the PIN CONFIGURATION for the pin out of other packages. Figure 1.Typical Audio Amplifier Application Circuit  EXTERNAL COMPONENTS DESCRIPTION Components RI CI RF CS CB Functional Description The inverting input resistance, along with RF, set the closed-loop gain. RI, along with CI form a high pass filter with fc=1/(2πRICI) The input coupling capacitor blocks DC voltage at the amplifier’s input terminals. CI, along with RI, create a high pass filter with fc=1/(2πRICI). Refer to the section. Selecting Proper External Components, for an explanation of determine the value of CI. The feedback resistance, along with RI, set the closed-Ioop gain. The supply bypass capacitor. Refer to the Power Supply Bypassing section for information about properly placing and selecting the value of, this capacitor. The capacitor, CB, filters the half-supply voltage present on the Bypass pin. Refer to the Selecting Proper External Components section for information concerning proper placement and selecting CB’S value. UNISONIC TECHNOLOGIES CO., LTD www.unisonic.com.tw 6 of 12 QW-R107-027.E LM4863 TYPICAL CHARACTERISTICS THD+N (%) THD+N (%) (For HTSSOP-20) 10 THD+N vs Output Power 10 VDD=5V, RL=4Ω POUT=2.0W, BW