UNISONIC TECHNOLOGIES CO., LTD
UF740
Power MOSFET
10A, 400V, 0.55Ω N-CHANNEL
POWER MOSFET
1
1
1
TO-220F1
TO-220F2
FEATURES
* 10A, 400V, R DS(ON) (0.55Ω)
* Single Pulse Avalanche Energy Rated
* Rugged - SOA is Power Dissipation Limited
* Fast Switching Speeds
* Linear Transfer Characteristics
* High Input Impedance
TO-220F
TO-220
DESCRIPTION
The N-Channel enhancement mode silicon gate power MOSFET
is designed for high voltage, high speed power switching
applications such as switching regulators, switching converters,
solenoid, motor drivers, relay drivers.
1
1
TO-263
SYMBOL
2.Drain
1.Gate
3.Source
ORDERING INFORMATION
Ordering Number
Lead Free
Halogen Free
UF740L-TA3-T
UF740G-TA3-T
UF740L-TF1-T
UF740G-TF1-T
UF740L-TF2-T
UF740G-TF2-T
UF740L-TF3-T
UF740G-TF3-T
UF740L-TQ2-T
UF740G-TQ2-T
UF740L-TQ2-R
UF740G-TQ2-R
Note: Pin Assignment: G: Gate D: Drain S: Source
Package
TO-220
TO-220F1
TO-220F2
TO-220F
TO-263
TO-263
Pin Assignment
1
2
3
G
D
S
G
D
S
G
D
S
G
D
S
G
D
S
G
D
S
Packing
Tube
Tube
Tube
Tube
Tube
Tape Reel
(1) R: Tape Reel, T: Tube
UF740L-TA3-T
(1)Packing Type
(2) TA3: TO-220, TF1: TO-220F1, TF2: TO-220F2,
(2)Package Type
(2) TF3: TO-220F, TQ2: TO-263
(3)Lead Free
(3) L: Lead Free, G: Halogen Free
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Copyright © 2013 Unisonic Technologies Co., Ltd
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QW-R502-078. G
UF740
Power MOSFET
ABSOLUTE MAXIMUM RATINGS (T C = 25°C, Unless Otherwise Specified)
PARAMETER
SYMBOL
RATINGS
Drain to Source Voltage (T J =25°C~125°C)
V DS
400
Drain to Gate Voltage (R GS = 20kΩ) (T J =25°C~125°C)
V DGR
400
Gate to Source Voltage
V GS
±20
Continuous
ID
10
Drain Current
T C = 100°C
ID
6.3
Pulsed
I DM
40
Avalanche Energy
Single Pulsed (Note 3)
E AS
520
TO-220/TO-263
125
Power Dissipation
TO-220F/TO-220F1
44
TO-220F2
46
PD
TO-220/TO-263
1.0
Derating above 25°C
TO-220F/TO-220F1
0.35
TO-220F2
0.37
Junction Temperature
TJ
+150
Operating Temperature
T OPR
-55 ~ +150
Storage Temperature
T STG
-55 ~ +150
Note: Absolute maximum ratings are those values beyond which the device could be permanently damaged.
Absolute maximum ratings are stress ratings only and functional device operation is not implied.
UNIT
V
V
V
A
A
A
mJ
W
W/°C
°C
°C
°C
THERMAL DATA
PARAMETER
Junction to Ambient
Junction to Case
TO-220/TO-263
TO-220F/TO-220F1
TO-220F2
UNISONIC TECHNOLOGIES CO., LTD
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SYMBOL
θ JA
θ Jc
RATINGS
62.5
1.0
2.86
2.72
UNIT
°C/W
°C/W
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QW-R502-078. G
UF740
Power MOSFET
ELECTRICAL CHARACTERISTICS (T C =25°C, Unless Otherwise Specified.)
PARAMETER
Drain to Source Breakdown Voltage
Gate to Threshold Voltage
On-State Drain Current (Note 1)
Zero Gate Voltage Drain Current
Gate to Source Leakage Current
Drain to Source On Resistance
Forward Transconductance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Gate Charge
(Gate to Source + Gate to Drain)
Gate to Source Charge
Gate to Drain “Miller” Charge
Input Capacitance
Output Capacitance
Reverse - Transfer Capacitance
SYMBOL
TEST CONDITIONS
BV DSS V GS = 0V, I D = 250μA
V GS(THR) V GS = V DS , I D = 250μA
I D(ON) V DS >I D(ON) x R DS(ON)MAX , V GS =10V
V DS = Rated BV DSS , V GS = 0V
I DSS
V DS =0.8 x Rated BV DSS ,
V GS =0V,T J =125°C
I GSS
V GS = ±20V
R DS(ON) V GS = 10V, I D = 5.2A (Note 1)
g FS
V DS ≥ 50V, I D = 5.2A (Note 1)
t DLY(ON) V DD = 200V, I D ≈ 10A,
tR
R GS = 9.1Ω, R L = 20Ω, V GS = 10V
t DLY(OFF) MOSFET Switching Times are Essentially
Independent of Operating Temperature
tF
Q G(TOT)
Q GS
Q GD
C ISS
C OSS
C RSS
MIN TYP MAX UNIT
400
V
2.0
4.0
V
10
A
25
μA
5.8
V GS = 10V, I D = 10A, I G(REF) = 1.5mA,
V DS = 0.8 x Rated BV DSS
Gate Charge is Essentially Independent of
Operating Temperature
V GS = 0V, V DS =25V, f = 1.0MHz
Measured From
Modified MOSFET
the Contact Screw Symbol Showing the
on Tab to Center Internal Devices
Inductances
of Die
Internal Drain Inductance
LD
Measured From
D
the Drain Lead,
6mm (0.25in)
LD
From Package to
Center of Die
G
Measured From
LS
the Source Lead,
6mm (0.25in)
S
Internal Source Inductance
LS
From Header to
Source Bonding
Pad
SOURCE TO DRAIN DIODE SPECIFICATIONS
Source to Drain Diode Voltage
V SD
T J = 25°C, I SD = 10A, V GS = 0V (Note 1)
D
Continuous Source to Drain Current
IS
Modified MOSFET
Symbol Showing
the Integral
Pulse Source to Drain Current
Reverse P-N
G
I SM
(Note 2)
Junction Diode
250
μA
±500
0.38 0.55
8.9
65
75
130 145
240 260
145 155
nA
Ω
S
ns
ns
ns
ns
138
nC
35
35
1170
160
26
nC
nC
pF
pF
pF
3.5
nH
4.5
nH
7.5
nH
2.0
10
V
A
40
A
790
8.2
ns
μC
S
Reverse Recovery Time
t rr
T J = 25°C, I SD = 10A, dI SD /dt = 100A/μs
Reverse Recovery Charge
Q RR
T J = 25°C, I SD = 10A, dI SD /dt = 100A/μs
Notes: 1. Pulse Test: Pulse width ≤ 300μs, Duty Cycle≤2%.
2. Repetitive rating: Pulse width limited by maximum junction temperature.
3. V DD =50V, starting T J =25°C, L=9.1mH, R G =25Ω, peak I AS = 10A
UNISONIC TECHNOLOGIES CO., LTD
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170
1.6
390
4.5
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Power MOSFET
TEST CIRCUITS AND WAVEFORMS
VDS
BVDSS
L
RG
VDS
VDD
IAS
VDD
D.U.T.
0
0.01Ω
tp
tAV
IAS
Unclamped Energy Test Circuit
Unclamped Energy Waveforms
VDS
90%
RL
10%
0
RG
90%
VDD
VGS
D.U.T.
VGS
50%
10%
0
50%
PULSE WIDTH
tR
tD(ON)
tD(OFF) tF
tOFF
tON
Resistive Switching Waveforms
Switching Time Test Circuit
VDS
(ISOLATED
SUPPLY)
CURRENT
REGULATOR
12V
BATTERY
VDD
SAME TYPE
AS DUT
50kΩ
QG(TOT)
QGS
0.3µF
0.2µF
QGD
VGS
D
VDS
DUT
G
IG(REF)
0
0
S
IG(REF)
IG CURRENT
SAMPLING
RESISTOR
ID CURRENT
SAMPLING
RESISTOR
Gate Charge Test Circuit
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0
Gate Charge Waveforms
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UF740
Power MOSFET
TYPICAL PERFORMANCE CUVES
Output Characteristics
Forward Bias Safe Operating Area
100
15
OPERATION IN THIS
REGION IS LIMITED BY
RDS(ON)
1
0.1
10ms
DC
TC=25℃
TJ=MAX RATED
SINGLE PULSE
1
Drain Current, ID (A)
VGS = 5.5V
9
VGS = 5.0V
6
VGS = 4.5V
3
VGS = 4.0V
102
10
0
103
40
80
Drain to Source Voltage, VDS (V)
Saturation Characteristics
Transfer Characteristics
VGS=10V
12
100
VGS=6.0V
VGS=5.5V
9
VGS=5.0V
6
VGS=4.5V
3
VGS=4.0V
0
4
2
8
6
10
200
160
120
Drain to Source Voltage, VDS (V)
DUTY CYCLE = 0.5% MAX
PULSE DURATION=80μS
DUTY CYCLE = 0.5% MAX
VDS≥50V
10
TJ = 25℃
TJ = 150℃
1
0.1
0
4
2
6
8
10
Drain to Source Voltage, VDS (V)
Gate to Source Voltage, VSD (V)
Normalized Drain to Source Breakdown Voltage vs. Junction
Temperature
Capacitance vs. Drain to Source Voltage
1.25
2500
ID=250μA
1.15
Capacitance, C (pF)
Normalized Drain to Source
Breakdown Voltage
12
0
15 PULSE DURATION=80μS
0
Drain Current, ID (A)
1ms
Drain to Source Current, IDS (ON) (A)
Drain Current, ID (A)
100μs
10
PULSE DURATION=80μS
DUTY CYCLE = 0.5% MAX
VGS = 10V
VGS = 6.0V
10μs
1.05
0.95
0.85
0.75
2000
1500
0
20 40 60 80
100 120 140 160
Junction Temperature, TJ (℃)
UNISONIC TECHNOLOGIES CO., LTD
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CISS
1000
COSS
CRSS
500
0
-60 -40 -20
VGS=0V, f=1MHz
CISS=CGS+CGD
CRSS=CGD
COSS≈CDS+CGD
1
2
5
10
2
5
102
2
5
103
Drain to Source Voltage, VDS (V)
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Power MOSFET
TYPICAL PERFORMANCE CUVES (Cont.)
Source to Drain Diode Voltage
Transconduce vs. Drain Current
100
PULSE DURATION=80μS
DUTY CYCLE = 0.5% MAX
Source to Drain Current, ISD (A)
Transconductance, gFS (S)
15
12
TJ = 25℃
9
TJ = 150℃
6
3
10
TJ = 150℃
TJ = 25℃
1.0
0.1
0
0
4
8
12
Drain Current, ID (A)
16
0
20
Drain to Source on Resistance vs. Voltage and Drain
Current
5
4
VGS=10V
2
VGS=20V
1
0
25
10
20
0.6
1.2
0.9
1.5
Gate to Source Voltage vs. Gate Charge
20
Pulse Duration=80μs
Duty Cycle = 0.5% Max
3
0.3
Source to Drain Voltage, VSD (V)
Gate to Source Voltage, VGS (V)
Drain to Source on Resistance, RDS (ON) (Ω)
PULSE DURATION=80μS
DUTY CYCLE = 0.5% MAX
30
40
50
Drain Current, ID (A)
ID=10A
16
VDS=80V
12
VDS=200V
8
VDS=320V
4
0
0
12
36
24
Gate Charge, QG (nC)
48
60
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exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or
other parameters) listed in products specifications of any and all UTC products described or contained
herein. UTC products are not designed for use in life support appliances, devices or systems where
malfunction of these products can be reasonably expected to result in personal injury. Reproduction in
whole or in part is prohibited without the prior written consent of the copyright owner. The information
presented in this document does not form part of any quotation or contract, is believed to be accurate
and reliable and may be changed without notice.
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