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16. Through-Hole Socket-Mount System (InMate) Design Guide & Applications Manual Maxi, Mini, Micro Family DC-DC Converters and Configurable Power Supplies InMates are an innovative solution for through-hole socket requirements. Consisting of individual plastic carriers for the input and the output, each contains an array of sockets for either a full-, half- or quarter-brick sized module. The sockets are factory loaded into the carrier, which holds them rigidly in place throughout the assembly and soldering process. The carriers are later removed, leaving the sockets accurately positioned. Designed for use with pin-compatible Maxi, Mini and Micro Family converters, InMates are available for a wide range of PCB sizes and mounting styles. PCB thicknesses can range from 0.055in [1,39mm] to 0.1375in [3,49mm]. Sockets also allow for mounting modules either inboard, with a cutout in the PCB for the module, to minimize the height above the board or onboard. InMates are compatible with the ModuMate or RoHS pin style. InMates are available in standard recyclable JEDEC style trays for use with automated pick-and-place equipment and are compatible with most standard wave or hand solder operations. The sockets are soldered into the board as part of the PCB assembly process. The module can then be plugged into place at anytime later. NOTE: Please refer to Section 13 of the design guide for the InMate soldering procedure. Insert  Solder  Remove Carrier  Insert Module  Figure 16.1 — InMate carrier / socket assembly and soldering process Maxi, Mini, Micro Design Guide Rev 5.6 Page 77 of 87 07/2022 16. Through-Hole Socket-Mount System (InMate) Design Guide & Applications Manual Maxi, Mini, Micro Family DC-DC Converters and Configurable Power Supplies InMate: Through-Hole Sockets 1. 2. Board Thickness Full Brick [Maxi) 5. 4. 3. Half Brick [Mini) Quarter Brick [Micro) Normal [Min / Max) Mounting Style Input Output Five Sets Input Output Five Sets Input Output Five Sets Pin Style 0.062in (0.055in / 0.071in) 1,5mm (1,4mm / 1,8mm) Inboard 18374 18382 18362 18374 18384 18366 18376 18386 18370 S or F Onboard 18378 18388 18364 18378 18390 18368 18380 18392 18372 N or G Inboard 18375 18383 18363 18375 18385 18367 18377 18387 18371 S or F Onboard 18379 18389 18365 18379 18391 18369 18381 18393 18373 N or G Onboard 21539 21543 21510 21539 21544 21511 21540 21545 21512 N or G 0.093in (0.084in / 0.104in) 2,4mm (2,1mm / 2,6mm) 0.125in (0.1125in / 0.1375in) 3,1mm (2,8mm / 3,5mm) Table 16.1 — Guide to InMate selection 1. Select Board Thickness: Nominal 0.062in [1,5mm], 0.093in [2,4mm] or 0.125in [3,1mm]. 2. Select Mounting Style: Inboard requires a PCB cutout for the “belly” of the module. See dotted lines in PCB drawing links on Page 80 for cut-out area. 3. Identify Module Type: Full brick (Maxi), half brick (Mini) or quarter brick (Micro). 4. Select the Ordering Part Number: Order packages of five input / output sets or in higher quantities order input and output InMates separately. For individual input or output InMates, minimum orders of 35 for Maxi or Mini and 40 for Micro apply. 5. Verify Correct Pin Style for the Module: For predefined parts, “S” or “F”= short ModuMate and “N” or “G” = long ModuMate Maxi, Mini, Micro Design Guide Rev 5.6 Page 78 of 87 07/2022 See Table 16.4 for standoff recommendations. 16. Through-Hole Socket-Mount System (InMate) Design Guide & Applications Manual Maxi, Mini, Micro Family DC-DC Converters and Configurable Power Supplies Parameter Specification Value Reference F = short Au plated Short RoHS pins Short ModuMate pins Compatibility S = short Au plated Module Pin Styles G = long Au plated N = long Au plated Long RoHS pins Long ModuMate pins 100g EOL min GR-1217-CORE, R5-23 Number of Mating Cycles 5 max [h] Exception to GR-1217-CORE which specifies 25 mating cycle Module Engagement Force 32lbs per connector set max GR-1217-CORE, R5-31,32 Module Disengagement Force 32lbs per connector set max GR-1217-CORE, R5-31,32 50A Maxi [e] / 50A Mini / 25A Micro (Based on 248°F [120°C] max socket temp & 86°F [30°C] max temperature rise of contact) Gold plating standards and accepted industry standards such as IICIT, EIA, Bellcore guidelines Low-Level Contact Resistance 0.080in [2,03mm] dia socket (LLCR) 400μΩ max GR-1217-CORE, 6.2.1 Low-Level Contact Resistance 0.150in [3,81mm] dia socket (LLCR) 300μΩ max GR-1217-CORE, 6.2.1 Low-Level Contact Resistance 0.180in [4,57mm] dia sockets (LLCR) 200μΩ max GR-1217-CORE, 6.2.1 248°F [120°C] max Max continuous-use temperature for gold plating 86°F [30°C] max GR-1217-CORE [g] EIA-364-70A [f] Mechanical Contact Normal Force Electrical Current Rating for Output Pin Sockets Thermal Max Socket Temperature Temperature Rise Environmental Shock and Vibration InMate products are tested in random vibration environments to best simulate the broad spectrum of frequencies and amplitudes that may be encountered in typical applications. Actual system resonant frequencies will depend on PCB construction and mounting details. For critical or unusual shock and vibration environments, the performance of the system should be independently verified. Table 16.2 — InMate specifications and materials Materials Ratings Headers Material: Ryton™ R–7 PPS, 65% Glass Fiber and Mineral-Filled Compound Poly-Phenylene Sulfide Flammability UL94 V-0/5VA Thermal Stability (short term) 500°F [260°C] Thermal Stability (long term) 392°F [200°C] Solder Cap Material 305 stainless steel Plating Clear passivate to repel solder Sockets Material Brush Wellman Alloy #25 C17200 deep draw quality or equiv. 0.010in thick Plating Woods nickel strike followed by 50μin min low stress sulfamate-based electrolytic nickel, followed by 20μin min hard gold, followed by 10μin min soft gold Table 16.3 — Material properties of InMate components [e] For 80A operation with Maxi, contact Applications Engineering. GR-1217-CORE issue 1, November 1995 Generic requirements for separable electrical connectors used in telecommunications hardware. A module of NEBSFR, FR-2063 [g] ANSI/EIA-364 American National Standards Institute / Electronic Industries Association (Electronic Components, Assemblies & Materials Association) [h] The module and socket must be replaced after five mating cycles. [f] Maxi, Mini, Micro Design Guide Rev 5.6 Page 79 of 87 07/2022 16. Through-Hole Socket-Mount System (InMate) Design Guide & Applications Manual Maxi, Mini, Micro Family DC-DC Converters and Configurable Power Supplies Standoff Kits for InMate Mounted Modules Board Thickness Mounting Options Nominal (Min / Max] Mounting Style 0.062in (0.055in / 0.071in) 1,5mm (1,4mm /1,8mm) Inboard 0.093in (0.084in / 0.104in) 2,4mm (2,1mm /2,6mm) 0.125in (0.113in / 0.138in) 3,1mm (2,8mm / 3,5mm) Slotted Baseplate Through-Hole Heat Sink Onboard Inboard Onboard Through-Hole Baseplate Threaded Heat Sink Through-Hole Heat Sink Threaded Heat Sink Threaded Baseplate Through-Hole Heat Sink Kit -18153 Kit -18154 Kit -18148 Kit -18149 Kit -18148 Bag -19129 Bag -19130 Bag -19124 Bag -19125 Bag -19124 Kit -18158 Kit -18159 Kit -18153 Kit -18155 Kit -18153 Bag -19134 Bag -19135 Bag -19129 Bag -19131 Bag -19129 Kit -18153 Kit -18154 Kit -18148 Kit -18149 Kit -18148 Bag -19129 Bag -19130 Bag -19124 Bag -19125 Bag -19124 Kit -18156 Kit -18157 Kit -18150 Kit -18152 Kit -18150 Bag -19132 Bag -19133 Bag -19126 Bag -19128 Bag -19126 Kit - 24054 Kit -18157 Kit -24056 Kit - 18152 Kit-24056 Bag -19132 Bag -19133 Bag -19126 Bag - 19128 Bag-19126 Onboard Kits include six (6] standoffs and screws. Mini and Micro modules require a minimum of four (4] standoffs. Bags of one hundred (100] do not include screws; #4-40 thread hardware required. Table 16.4 — InMate standoff recommendations References InMate PCB layout drawing for Maxi Module https://asp.vicorpower.com/cadUtil/display_cad.asp?pn=18400&ct=PDF InMate PCB layout drawing for Mini Module https://asp.vicorpower.com/cadUtil/display_cad.asp?pn=18399&ct=PDF InMate PCB layout drawing for Micro Module https://asp.vicorpower.com/cadUtil/display_cad.asp?pn=18398&ct=PDF InMate and Socket outline drawing for Inboard Maxi Modules https://asp.vicorpower.com/cadUtil/display_cad.asp?pn=18483-XX&ct=PDF InMate and Socket outline drawing for Inboard Mini Modules https://asp.vicorpower.com/cadUtil/display_cad.asp?pn=18482-XX&ct=PDF InMate and Socket outline drawing for Inboard Micro Modules https://asp.vicorpower.com/cadUtil/display_cad.asp?pn=18481-XX&ct=PDF InMate and Socket outline drawing for Onboard Maxi Modules https://asp.vicorpower.com/cadUtil/display_cad.asp?pn=18480-XX&ct=PDF InMate and Socket outline drawing for Onboard Mini Modules https://asp.vicorpower.com/cadUtil/display_cad.asp?pn=20030-XX&ct=PDF InMate and Socket outline drawing for Onboard Micro Modules https://asp.vicorpower.com/cadUtil/display_cad.asp?pn=20029-XX&ct=PDF Module Exchange Tool Used in facilitating the proper extraction of modules from InMate or SurfMate sockets. Removal without using the Exchange Tool may cause damage to the sockets. Description Part Number Maxi Exchange Tool 22827 Mini Exchange Tool 22828 Micro Exchange Tool 22829 Maxi, Mini, Micro Design Guide Rev 5.6 Page 80 of 87 07/2022 22829 22827 22828