40518

7 8 5 6 1 2 3 4 VICOR CONFIDENTIAL REV. THIS DOCUMENT AND THE DATA DISCLOSED HEREIN OR HEREWITH IS NOT TO BE REPRODUCED, USED OR DISCLOSED IN WHOLE OR IN PART TO ANYONE WITHOUT THE PERMISSION OF VICOR CORP. 1 DESCRIPTION RELEASED PER E141039 INTL DATE APVD SJW 09/03/14 RH F F SEE NOTE 4 3623 CHIP SHOWN HERE THERMAL INTERFACE SEE NOTE 3(A) OR 3(B) PUSH-PINS SEE NOTE 3,4 AND SELECTION TABLE E E GROUNDING TABS SOLDERED TO PCB D D 3.20 .126 BOTTOM HEATSINK APPLICATION SEE NOTE 3 ASSEMBLED FRONT VIEW SCREW (40578) INSTALLED FROM BOTTOM SIDE OF PCB. TORQUE TO 6 IN-LBS. (2) PL. TOP HEATSINK APPLICATION SEE NOTE 3 C C NOTES: 1. FOR PCB LAYOUT SEE VICOR APPLICATION DRAWING 40438. 1. 2. ROHS COMPLIANT PER CST-0001 LATEST REVISION. 3. THE SOLDERING METHOD USED FOR CHIPS (AND OPTIONAL HEATSINK GROUNDING) IS IMPORTANT WHEN SELECTING A THERMAL INTERFACE MATERIAL (TIM). THE PHASE-CHANGE TIM SHOWN IN THESE ILLUSTRATIONS MAY BE DAMAGED BY TEMPERATURES OVER 125C, SO TWO ASSEMBLY PROCEDURES ARE DESCRIBED BELOW: (A) FOR HAND-SOLDERING ONLY, (B) FOR WAVE-SOLDERING AND/OR HAND-SOLDERING. HEATSINK TYPE (A) PLACE BOTTOM-SIDE HEATSINK (WITH PRE-ATTACHED PHASE-CHANGE TIM) ON PCB. PLACE CHIP AND TOP-SIDE HEATSINK (WITH PRE-ATTACHED TIM AND GROUNDING TABS). WHILE SUPPORTING PCB, INSERT PLASTIC PUSH-PINS THROUGH BOTH HEATSINKS AND PCB. (SELECT PROPER PUSH-PIN LENGTH FROM TABLE ON THIS DRAWING.) IMPORTANT: TO SET FINAL THICKNESS OF PHASE-CHANGE TIM ENSURE THAT THE ENTIRE ASSEMBLY IS RAISED ABOVE 65C FOR SEVERAL MINUTES. HAND-SOLDER ALL CHIP AND GROUNDING PINS. ADDITIONAL SOLDERING IRON HEAT MAY BE REQUIRED TO COMPENSATE FOR LOSSES TO THE HEATSINKS. B 4. SOLDERING METHOD (SEE NOTE 2) - 2(A) HAND SOLDER ONLY 2(B) WITH VICOR 40325 THERMAL GEL 3623 DUAL 11MM DUAL 19MM 40518 TBD 40526 TBD HEATSINK SELECTION (B) WAVE SOLDERING TEMPERATURES ARE UNSUITABLE FOR PLASTIC PUSH-PINS AND PHASE-CHANGE TIM, SO VICOR TIM 40325 (PARKER CHOMERICS GEL8010) IS RECOMMENDED. APPLY A UNIFORM .003” (.076MM) LAYER OF TIM 40325 TO THE TOP AND BOTTOM SURFACE OF THE CHIP, OR TO THE CORRESPONDING HEATSINK SURFACES. PLACE BOTTOM-SIDE HEATSINK, CHIP, AND TOP-SIDE HEATSINK ON PCB. WITH A CUSTOM FIXTURE APPLY APPROX. 10 LBS LOAD TO THE TOP-SIDE HEATSINK AND THEN WAVE-SOLDER ALL PINS. REMOVE FIXTURE AND INSERT PLASTIC PUSH-PINS THROUGH BOTH HEATSINKS AND PCB. (SELECT PROPER PUSH-PIN LENGTH FROM TABLE ON THIS DRAWING.) A P/N HEATSINK, TIM AND P/N HEATSINK GROUND TAB W/GROUND TAB ONLY B PUSH-PINS W/ SPRINGS (100/BAG) COLOR PCB THK NOMINAL RANGE PCB THK MINIMUM PCB THK MAXIMUM 32436 BLUE 1.143 MM TO 1.854 MM [.045"] TO [.073"] 1.041 MM [.041"] 2.057 MM [.081"] 32437 GRAY 1.880 MM TO 2.438 MM [.074"] TO [.096"] 1.676 MM [.066"] 2.692 MM [.106"] PUSH-PIN SELECTION CARE SHOULD BE TAKEN TO AVOID FULLY COMPRESSING THE PUSH-PIN SPRING DURING INSTALLATION AS THIS WOULD EXPOSE THE CHIP TO FORCES GREATER THAN THE RECOMMENDED LIMIT OF 3.1 LBF (13.8 N) PER PUSH-PIN. DRAWN BY DATE Robert Wasik 09/06/2013 UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE : INCH / [MM] TOLERANCES ARE: DECIMALS ANGLES X.XX [X.X] = ±0.01 [0.25] ±1° X.XXX [X.XX] = ±0.005 [0.127] THIRD ANGLE PROJECTION DO NOT SCALE DRAWING 8 7 6 5 4 3 2 VICOR SWD A ASSY DWG DUAL HEATSINK 3623 SIZE CAGE CODE D 67131 SCALE 3:1 DWG NO REV 40190 SHEET 1 OF 1 1 1