B048F320T30-EB

End of Life - Replaced by BCM48Bx320y300A00 BCM® Bus Converter B048F320T30 B 048 F 320 M 30 S C NRTL US Narrow Input Range Sine Amplitude Converter™ • 48 V to 32 V VI Chip® Bus Converter • Typical efficiency 96% • 300 Watt (450 Watt for 1 ms) • 125°C operation (TJ) • High density – 1017 W/in3 • 96%), narrow input range Sine Amplitude ConverterTM (SACTM) operating from a 38 to 55 Vdc primary bus to deliver an isolated 25.3 V to 36.7 V secondary. The bus converter may be used to power non-isolated POL converters or as an independent 25.3 – 36.7 V source. Due to the fast response time and low noise of the bus converter, the need for limited life aluminum electrolytic or tantalum capacitors at the load is reduced—or eliminated— resulting in savings of board area, materials and total system cost. The bus converter achieves a power density of 1017 W/in3 in a VI Chip package compatible with standard pick-andplace and surface mount assembly process. The VI Chip package provides flexible thermal management through its low junction-to-board and junction-to-case thermal resistance. Owing to its high conversion efficiency and safe operating temperature range, the bus converter does not require a discrete heat sink in typical applications. Low junction-to-case and junction-to-lead thermal impedances assure low junction temperatures and long life in the harshest environments. Parameter +In to -In Values Unit -1.0 to 60 Vdc 100 Vdc PC to -In -0.3 to 7.0 Vdc +Out to -Out Notes For 100 ms -0.5 to 48.0 Vdc Isolation voltage 2,250 Vdc Output current 11.3 A Continuous Peak output current 14.1 A For 1 ms Output power 300 W Continuous Peak output power 450 W For 1 ms 225 °C MSL 5 245 °C MSL 6, TOB = 4 hrs -40 to 125 °C T-Grade -55 to 125 °C M-Grade -40 to 125 °C T-Grade -65 to 125 °C M-Grade [a] Case temperature during reflow Operating junction temperature [b] Storage temperature Input to output Notes: [a] 245°C reflow capability applies to product with manufacturing date code 1001 and greater. [b] The referenced junction is defined as the semiconductor having the highest temperature. This temperature is monitored by a shutdown comparator. Part Numbering B Bus Converter 048 F 320 Output Voltage Designator (=VOUT x10) Input Voltage Designator Configuration F = J-lead T = Through hole BCM® Bus Converter Rev 2.9 vicorpower.com Page 1 of 12 01/2014 800 927.9474 T 30 Output Power Designator (=POUT /10) Product Grade Temperatures (°C) Grade Storage Operating (TJ) T -40 to125 -40 to125 M -65 to 125 -55 to 125 B048F320T30 End of Life - Replaced by BCM48Bx320y300A00 Specifications Input (Conditions are at 48 VIN, full load, and 25°C ambient unless otherwise specified) Parameter Input voltage range Input dV/dt Input undervoltage turn on Input undervoltage turn off Input overvoltage turn on Input overvoltage turn off Input quiescent current Inrush current overshoot Input current Input reflected ripple current No load power dissipation Internal input capacitance Internal input inductance Recommended external input capacitance Min Typ Max Unit 38 48 55 1 37.4 Vdc V/µs Vdc Vdc Vdc Vdc mA A Adc mA p-p W µF nH µF 33.6 55.0 59.2 2.58 5.5 6.8 310 3.9 1.9 5 47 5.2 Note PC low Using test circuit in Figure 20; See Figure 1 Using test circuit in Figure 20; See Figure 4 200 nH maximum source inductance; See Figure 20 Input Waveforms Figure 1 — Inrush transient current at full load and 48 VIN with PC enabled Figure 2 — Output voltage turn on waveform with PC enabled at full load and 48 VIN Figure 3 — Output voltage turn on waveform with input turn on at full load and 48 VIN Figure 4 — Input reflected ripple current at full load and 48 VIN BCM® Bus Converter Rev 2.9 vicorpower.com Page 2 of 12 01/2014 800 927.9474 B048F320T30 End of Life - Replaced by BCM48Bx320y300A00 Specifications (continued) Output (Conditions are at 48 Vin, full load, and 25°C ambient unless otherwise specified) Parameter Min Typ 25.3 24.4 0 0 0 Output voltage Output power Rated DC current Peak repetitive power Current share accuracy Efficiency Half load Full load Internal output inductance Internal output capacitance Load capacitance Output overvoltage set point Output ripple voltage No external bypass 4.7 µF bypass capacitor Short circuit protection set point Average short circuit current Effective switching frequency Line regulation K Load regulation ROUT Transient response Voltage overshoot Response time Recovery time Output overshoot Input turn on PC enable Output turn on delay From application of power From release of PC pin 5 95.2 95.0 Max Unit Note 36.7 35.9 300 274 11.3 Vdc Vdc W W Adc 450 W 10 % No load Full load 41 - 55 VIN 38 - 55 VIN POUT ≤ 300 W Max pulse width 1ms, max duty cycle 10%, baseline power 50% See Parallel Operation on Page 10 96.5 96.2 1.1 12 100 36.7 175 14 335 11.5 2.4 0.18 2.8 3.2 0.6600 2/3 0.6733 79.0 98.0 % % nH µF µF Vdc See Figure 5 See Figure 5 Effective value Module will shut down mVp-p mVp-p Adc A MHz See Figures 7 and 9 See Figure 8 Module will shut down Fixed, 1.4 MHz per phase VOUT = K•VIN at no load mΩ 540 200 1 mV ns µs 100% load step; See Figures 10 and 11 See Figures 10 and 11 See Figures 10 and 11 0 0 mV mV No output filter; See Figure 3 No output filter; See Figure 2 255 68 ms ms No output filter; See Figure 3 No output filter Output Waveforms Efficiency vs. Output Power Power Dissipation 98 12 Power Dissipation (W) Efficiency (%) 96 94 92 90 88 10 8 6 4 2 0 30 60 90 120 150 180 210 240 270 300 0 30 Output Power (W) 60 90 120 150 180 210 240 Output Power (W) Figure 5 — Efficiency vs. output power Figure 6 — Power dissipation as a function of output power BCM® Bus Converter Rev 2.9 vicorpower.com Page 3 of 12 01/2014 800 927.9474 270 300 B048F320T30 End of Life - Replaced by BCM48Bx320y300A00 Specifications (continued) Output Waveforms Figure 8 — Output voltage ripple at full load and 48 VIN with 4.7 µF ceramic external bypass capacitor and 20 nH of distribution inductance. Figure 7 — Output voltage ripple at full load and 48 VIN without any external bypass capacitor. Ripple vs. Output Power Output Ripple (mVp-p) 180 150 120 90 60 30 0 30 60 90 120 150 180 210 240 270 300 Output Power (W) Figure 9 — Output voltage ripple vs. output power at 48 VIN without any external bypass capacitor. Figure 10 — 0 – 9.4 A load step with 100 µF input capacitor and no output capacitor. Figure 11 — 9.4 – 0 A load step with 100 µF input capacitor and no output capacitor. BCM® Bus Converter Rev 2.9 vicorpower.com Page 4 of 12 01/2014 800 927.9474 B048F320T30 End of Life - Replaced by BCM48Bx320y300A00 Specifications (continued) General Parameter Min MTBF MIL-HDBK-217F Isolation specifications Voltage Capacitance Resistance Typ Max Unit Note 3.5 Mhrs 25°C, GB 3,000 Vdc pF MΩ Input to output Input to output Input to output UL /CSA 60950-1, EN 60950-1 2,250 10 cTÜVus Agency approvals Mechanical Weight Dimensions Length Width Height Thermal Overtemperature shutdown Thermal capacity Junction-to-case thermal impedance (RθJC) Junction-to-board thermal impedance (RθJB) CE Marked for Low Voltage Directive and RoHS Recast Directive, as applicable See mechanical drawings, Figures 15 – 18 125 0.53/15 oz /g 1.28/ 32,5 0.87 / 22 0.265 / 6,73 in / mm in / mm in / mm 130 9.3 1.1 2.1 135 °C Ws /°C °C / W °C / W Junction temperature See Thermal Considerations on Page 10 Auxiliary Pins (Conditions are at 48 Vin, full load, and 25°C ambient unless otherwise specified) Parameter Min Typ Max Unit DC voltage 4.8 5.0 5.2 Module disable voltage 2.4 2.5 2.5 2.6 Vdc 2.4 2.5 2.9 mA Note Primary control (PC) Module enable voltage Current limit Vdc Vdc Enable delay time 68 ms Disable delay time 50 µs Source only See Figure 12, time from PC low to output low Figure 13 — PC signal during fault Figure 12 — VOUT at full load vs. PC disable BCM® Bus Converter Rev 2.9 vicorpower.com Page 5 of 12 01/2014 800 927.9474 B048F320T30 End of Life - Replaced by BCM48Bx320y300A00 Pin / Control Functions +In / -In – DC Voltage Input Ports The VI Chip module input voltage range should not be exceeded. An internal undervoltage /overvoltage lockout function prevents operation outside of the normal operating input range. The BCM® bus converter turns on within an input voltage window bounded by the “Input undervoltage turn on” and “Input overvoltage turn off” levels, as specified. The module may be protected against accidental application of a reverse input voltage by the addition of a rectifier in series with the positive input, or a reverse rectifier in shunt with the positive input located on the load side of the input fuse. 4 3 2 1 A A +Out B B C C D D E E -Out F G H H J J +Out The connection of the module to its power source should be implemented with minimal distribution inductance. If the interconnect inductance exceeds 100 nH, the input should be bypassed with a RC damper to retain low source impedance and stable operation. With an interconnect inductance of 200 nH, the RC damper may be 47 µF in series with 0.3Ω. A single electrolytic or equivalent low-Q capacitor may be used in place of the series RC bypass. -Out K K L L M M N N P P R R T T Bottom View PC – Primary Control Signal Name +In –In TM RSV PC The Primary Control port is a multifunction node that provides the following functions: Enable / Disable – If the PC port is left floating, the BCM module output is enabled. Once this port is pulled lower than 2.4 Vdc with respect to –In, the output is disabled. This action can be realized by employing a relay, opto-coupler, or open collector transistor. Refer to Figures 1-3, 12 and 13 for the typical enable /disable characteristics. This port should not be toggled at a rate higher than 1 Hz. The PC port should also not be driven by or pulled up to an external voltage source. +Out –Out Designation A1-E1, A2-E2 L1-T1, L2-T2 H1, H2 J1, J2 K1, K2 A3-D3, A4-D4, J3-M3, J4-M4 E3-H3, E4-H4, N3-T3, N4-T4 Primary Auxiliary Supply – The PC port can source up to 2.4 mA at 5.0 Vdc. The PC port should never be used to sink current. Alarm – The module contains circuitry that monitors output overload, input overvoltage or undervoltage, and internal junction temperatures. In response to an abnormal condition in any of the monitored parameters, the PC port will toggle. Refer to Figure 13 for PC alarm characteristics. Figure 14 — BCM® bus converter pin configuration TM and RSV – Reserved for factory use. +Out / -Out – DC Voltage Output Ports Two sets of contacts are provided for the +Out port. They must be connected in parallel with low interconnect resistance. Similarly, two sets of contacts are provided for the –Out port. They must be connected in parallel with low interconnect resistance. Within the specified operating range, the average output voltage is defined by the Level 1 DC behavioral model of Figure 21. The current source capability of the module is rated in the specifications section of this document. The low output impedance of the module reduces or eliminates the need for limited life aluminum electrolytic or tantalum capacitors at the input of POL converters. Total load capacitance at the output of the modules should not exceed the specified maximum. Owing to the wide bandwidth and low output impedance of the module, low frequency bypass capacitance and significant energy storage may be more densely and efficiently provided by adding capacitance at the input of the BCM module. BCM® Bus Converter Rev 2.9 vicorpower.com Page 6 of 12 01/2014 800 927.9474 +In TM RSV PC -In B048F320T30 End of Life - Replaced by BCM48Bx320y300A00 Mechanical Drawings NOTES: mm 1. DIMENSIONS ARE inch . 2. UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE: .X / [.XX] = +/-0.25 / [.01]; .XX / [.XXX] = +/-0.13 / [.005] 3. PRODUCT MARKING ON TOP SURFACE BOTTOM VIEW TOP VIEW ( COMPONENT SIDE ) DXF and PDF files are available on vicorpower.com Figure 15 — BCM® module J-Lead mechanical outline; onboard mounting RECOMMENDED LAND PATTERN NOTES: mm 1. DIMENSIONS ARE inch . 2. UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE: .X / [.XX] = +/-0.25 / [.01]; .XX / [.XXX] = +/-0.13 / [.005] 3. PRODUCT MARKING ON TOP SURFACE ( COMPONENT SIDE SH OWN ) DXF and PDF files are available on vicorpower.com Figure 16 — BCM module PCB land layout information BCM® Bus Converter Rev 2.9 vicorpower.com Page 7 of 12 01/2014 800 927.9474 B048F320T30 End of Life - Replaced by BCM48Bx320y300A00 Mechanical Drawings (continued) TOP VIEW ( COMPONENT SIDE ) NOTES: (mm) 1. DIMENSIONS ARE inch . 2. UNLESS OTHERWISE SPECIFIED TOLERANCES ARE: X.X [X.XX] = ±0.25 [0.01]; X.XX [X.XXX] = ±0.13 [0.005] 3. RoHS COMPLIANT PER CST-0001 LATEST REVISION DXF and PDF files are available on vicorpower.com Figure 17 — BCM® through-hole module mechanical outline NOTES: (mm) 1. DIMENSIONS ARE inch . 2. UNLESS OTHERWISE SPECIFIED TOLERANCES ARE: X.X [X.XX] = ±0.25 [0.01]; X.XX [X.XXX] = ±0.13 [0.005] RECOMMENDED HOLE PATTERN ( COMPONENT SIDE SHOWN ) 3. RoHS COMPLIANT PER CST-0001 LATEST REVISION DXF and PDF files are available on vicorpower.com Figure 18 — BCM through-hole module PCB layout information BCM® Bus Converter Rev 2.9 vicorpower.com Page 8 of 12 01/2014 800 927.9474 BOTTOM VIEW B048F320T30 End of Life - Replaced by BCM48Bx320y300A00 Configuration Options RECOMMENDED LAND PATTERN (NO GROUNDING CLIPS) TOP SIDE SHOWN NOTES: 1. MAINTAIN 3.50 [0.138] DIA. KEEP-OUT ZONE FREE OF COPPER, ALL PCB LAYERS. 2. (A) MINIMUM RECOMMENDED PITCH IS 39.50 [1.555], THIS PROVIDES 7.00 [0.275] COMPONENT EDGE-TO-EDGE SPACING, AND 0.50 [0.020] CLEARANCE BETWEEN VICOR HEAT SINKS. (B) MINIMUM RECOMMENDED PITCH IS 41.00 [1.614], THIS PROVIDES 8.50 [0.334] COMPONENT EDGE-TO-EDGE SPACING, AND 2.00 [0.079] CLEARANCE BETWEEN VICOR HEAT SINKS. 3. VI CHIP® MODULE LAND PATTERN SHOWN FOR REFERENCE ONLY; ACTUAL LAND PATTERN MAY DIFFER. DIMENSIONS FROM EDGES OF LAND PATTERN TO PUSH-PIN HOLES WILL BE THE SAME FOR ALL FULL SIZE VI CHIP PRODUCTS. RECOMMENDED LAND PATTERN (With GROUNDING CLIPS) TOP SIDE SHOWN 4. RoHS COMPLIANT PER CST-0001 LATEST REVISION. 5. UNLESS OTHERWISE SPECIFIED: DIMENSIONS ARE MM [INCH]. TOLERANCES ARE: X.X [X.XX] = ±0.3 [0.01] X.XX [X.XXX] = ±0.13 [0.005] 6. PLATED THROUGH HOLES FOR GROUNDING CLIPS (33855) SHOWN FOR REFERENCE. HEAT SINK ORIENTATION AND DEVICE PITCH WILL DICTATE FINAL GROUNDING SOLUTION. Figure 19 — Hole location for push pin heat sink relative to VI Chip® module BCM® Bus Converter Rev 2.9 vicorpower.com Page 9 of 12 01/2014 800 927.9474 B048F320T30 End of Life - Replaced by BCM48Bx320y300A00 Application Note Parallel Operation Input Impedance Recommendations The BCM® bus converter will inherently current share when operated in an array. Arrays may be used for higher power or redundancy in an application. To take full advantage of the BCM bus converter capabilities, the impedance presented to its input terminals must be low from DC to approximately 5 MHz. The source should exhibit low inductance and should have a critically damped response. If the interconnect inductance is excessive, the module input pins should be bypassed with an RC damper (e.g., 47 µF in series with 0.3 ohm) to retain low source impedance and proper operation. Given the wide bandwidth of the module, the source response is generally the limiting factor in the overall system response. Current sharing accuracy is maximized when the source and load impedance presented to each bus converter within an array are equal. The recommended method to achieve matched impedances is to dedicate common copper planes within the PCB to deliver and return the current to the array, rather than rely upon traces of varying lengths. In typical applications the current being delivered to the load is larger than that sourced from the input, allowing traces to be utilized on the input side if necessary. The use of dedicated power planes is, however, preferable. The bus converter power train and control architecture allow bidirectional power transfer, including reverse power processing from the module output to its input. Reverse power transfer is enabled if the module input is within its operating range and the module is otherwise enabled. The bus converter’s ability to process power in reverse improves the module’s transient response to an output load dump. Thermal Considerations Anomalies in the response of the source will appear at the output of the module multiplied by its K factor. The DC resistance of the source should be kept as low as possible to minimize voltage deviations. This is especially important if the module is operated near low or high line as the overvoltage /undervoltage detection circuitry could be activated. Input Fuse Recommendations VI Chip modules are not internally fused in order to provide flexibility in configuring power systems. However, input line fusing of the modules must always be incorporated within the power system. A fast acting fuse should be placed in series with the +In port. VI Chip products are multi-chip modules whose temperature distribution varies greatly for each part number as well as with the input /output conditions, thermal management and environmental conditions. Maintaining the top of the B048F320T30 case to less than 100°C will keep all junctions within the module below 125°C for most applications. The percent of total heat dissipated through the top surface versus through the J-lead is entirely dependent on the particular mechanical and thermal environment. The heat dissipated through the top surface is typically 60%. The heat dissipated through the J-lead onto the PCB board surface is typically 40%. Use 100% top surface dissipation when designing for a conservative cooling solution. It is not recommended to use a module for an extended period of time at full load without proper heat sinking. BCM® Bus Converter Rev 2.9 vicorpower.com Page 10 of 12 01/2014 800 927.9474 B048F320T30 End of Life - Replaced by BCM48Bx320y300A00 Application Note (continued) Input reflected ripple measurement point F1 Notes: 10 A Fuse + +Out +In Enable / Disable Switch electrolytic SW1 D1 TM RSV PC R2 2 kΩ BCM® K Ro Load C3 4.7 µF +Out -In C3 should be placed close to the load. R3 10 mΩ -Out C1 47 µF Source inductance should be no more than 200 nH. If source inductance is greater than 200 nH, additional bypass capacitance may be required. R3 may be ESR of C3 or a separate damping resistor. D1 power good indicator will dim when a module fault is detected. – -Out Figure 20 — BCM® module test circuit BCM® Bus Converter Level 1 DC Behavioral Model for 48 V to 32 V, 300 W ROUT IOUT + + 79.0 mΩ 2/3 • Iout VIN + – IQ 81 mA V•I K 2/3 • Vin + VOUT – – – © Figure 21 — This model characterizes the DC operation of the bus converter, including the converter transfer function and its losses. The model enables estimates or simulations of output voltage as a function of input voltage and output load, as well as total converter power dissipation or heat generation. BCM® Bus Converter Level 2 Transient Behavioral Model for 48 V to 32 V, 300 W 7.2 nH IOUT + 79.0 mΩ RCIN 1.25 mΩ VIN ROUT CIN 2/3 • Iout 1.9 µF IQ 81 mA 23.6 mΩ V•I + + – – Lout RCOUT 1.1 nH + 0.3 mΩ 2/3 • Vin COUT 12 µF VOUT K – – © Figure 22 — This model characterizes the AC operation of the bus converter including response to output load or input voltage transients or steady state modulations. The model enables estimates or simulations of input and output voltages under transient conditions, including response to a stepped load with or without external filtering elements. BCM® Bus Converter Rev 2.9 vicorpower.com Page 11 of 12 01/2014 800 927.9474 B048F320T30 End of Life - Replaced by BCM48Bx320y300A00 Vicor’s comprehensive line of power solutions includes high density AC-DC and DC-DC modules and accessory components, fully configurable AC-DC and DC-DC power supplies, and complete custom power systems. Information furnished by Vicor is believed to be accurate and reliable. However, no responsibility is assumed by Vicor for its use. Vicor makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication. Vicor reserves the right to make changes to any products, specifications, and product descriptions at any time without notice. Information published by Vicor has been checked and is believed to be accurate at the time it was printed; however, Vicor assumes no responsibility for inaccuracies. Testing and other quality controls are used to the extent Vicor deems necessary to support Vicor’s product warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. Specifications are subject to change without notice. Vicor’s Standard Terms and Conditions All sales are subject to Vicor’s Standard Terms and Conditions of Sale, which are available on Vicor’s webpage or upon request. Product Warranty In Vicor’s standard terms and conditions of sale, Vicor warrants that its products are free from non-conformity to its Standard Specifications (the “Express Limited Warranty”). This warranty is extended only to the original Buyer for the period expiring two (2) years after the date of shipment and is not transferable. 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Prior to using or distributing any products that include Vicor components, buyers should provide adequate design, testing and operating safeguards. Vicor will repair or replace defective products in accordance with its own best judgment. For service under this warranty, the buyer must contact Vicor to obtain a Return Material Authorization (RMA) number and shipping instructions. Products returned without prior authorization will be returned to the buyer. The buyer will pay all charges incurred in returning the product to the factory. Vicor will pay all reshipment charges if the product was defective within the terms of this warranty. Life Support Policy VICOR’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS PRIOR WRITTEN APPROVAL OF THE CHIEF EXECUTIVE OFFICER AND GENERAL COUNSEL OF VICOR CORPORATION. As used herein, life support devices or systems are devices which (a) are intended for surgical implant into the body, or (b) support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in a significant injury to the user. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness. Per Vicor Terms and Conditions of Sale, the user of Vicor products and components in life support applications assumes all risks of such use and indemnifies Vicor against all liability and damages. Intellectual Property Notice Vicor and its subsidiaries own Intellectual Property (including issued U.S. and Foreign Patents and pending patent applications) relating to the products described in this data sheet. No license, whether express, implied, or arising by estoppel or otherwise, to any intellectual property rights is granted by this document. Interested parties should contact Vicor's Intellectual Property Department. The products described on this data sheet are protected by the following U.S. Patents Numbers: 5,945,130; 6,403,009; 6,710,257; 6,911,848; 6,930,893; 6,934,166; 6,940,013; 6,969,909; 7,038,917; 7,166,898; 7,187,263; 7,361,844; D496,906; D505,114; D506,438; D509,472 and for use under 6,975,098 and 6,984,965. Vicor Corporation 25 Frontage Road Andover, MA, USA 01810 Tel: 800-735-6200 Fax: 978-475-6715 email Customer Service: custserv@vicorpower.com Technical Support: apps@vicorpower.com BCM® Bus Converter Rev 2.9 vicorpower.com Page 12 of 12 01/2014 800 927.9474