B048L120T10

V•I Chip – BCM Bus Converter Module TM B048K120T10 1 • 48V to 12V V•I Chip Converter • 100 Watt (150 Watt for 1 ms) • High density – up to 400 W/in3 • Small footprint – 100 W/in • Low weight – 0.4 oz (12 g) • Pick & Place / SMD 2 • >96% efficiency • 125°C operation • 3.5 million hours MTBF • No output filtering required • V•I Chip BGA package Actual size © Vin = 42 - 53 V Vout = 10.5 - 13.25 V Iout = 8.3 A K = 1/4 Rout = 32 mΩ max Product Description The V•I Chip Bus Converter Module (BCM) is a high efficiency (>96%), narrow input range Voltage Transformation Module (VTM) operating from a pre-regulated 48 Vdc primary bus to deliver an isolated 12 V secondary for Intermediate Bus Architecture applications. The BCM may be used to power non-isolated POL converters or as an independent 12 V source. Due to the fast response time and low noise of the BCM, the need for limited life aluminum electrolytic or tantalum capacitors at the input of POL converters is reduced—or eliminated—resulting in savings of board area, materials and total system cost. Absolute Maximum Ratings Parameter +In to -In +In to -In PC to -In TM to -In SG to -In +Out to -Out Isolation voltage Operating junction temperature Output current Values -1.0 to 60.0 100 -0.3 to 7.0 -0.3 to 7.0 500 Unit Vdc Vdc Vdc Vdc mA Notes For 100 ms Peak output current The BCM achieves a power density of 400 W/in3 and may be surface mounted with a profile as low as 0.16" (4mm) over the PCB. Its V•I Chip power BGA package is compatible with on-board or in-board surface mounting. The V•I Chip package provides flexible thermal management through its low Junction-to-Case and Junction-to-BGA thermal resistance. Owing to its high conversion efficiency and safe operating temperature range, the BCM does not require a discrete heat sink in typical applications. It is also compatible with heat sink options, assuring low junction temperatures and long life in the harshest environments. P EL R RθJC RθJB RθJA RθJA Case temperature during reflow Storage temperature Output power Peak output power I IM Parameter Junction-to-case Junction-to-BGA Junction-to-ambient 3 Junction-to-ambient 4 RY A N -0.5 to 15.0 1500 Vdc Vdc °C A -40 to 125 8.3 See note 2 Continuous For 1 ms 12.5 208 A °C -40 to 150 100 150 °C W W Continuous For 1 ms Typ 1.1 2.1 Max 1.5 2.5 Units °C/W °C/W °C/W °C/W Input to Output Thermal Resistance Symbol 6.5 5.0 7.2 5.5 Notes 1. For complete product matrix see chart on page 10. 2. The referenced junction is defined as the semiconductor having the highest temperature. This temperature is monitored by the temperature monitor (TM) signal and by a shutdown comparator. 3. B048K120T10 surface mounted in-board to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM. 4. B048L120T10 (0.25"H integral Pin Fins) surface mounted on FR4 board, 300 LFM. 45 Vicor Corporation Tel: 800-735-6200 vicorpower.com V•I Chip Bus Converter B048K120T10 Rev. 1.2 Page 1 of 16 Specifications INPUT (Conditions are at nominal line, full load, and 25°C ambient unless otherwise specified) Parameter Input voltage range Input dV/dt Input undervoltage turn-on Input undervoltage turn-off Input overvoltage turn-on Input overvoltage turn-off Input quiescent current Inrush current overshoot Input current Input reflected ripple current No load power dissipation Internal input capacitance Internal input inductance Recommended external input capacitance Min 42 Typ 48 Max 53 10 42 Unit V V/µs V V V V mA A A mA p-p W µF nH µF Note 37 53 P EL R 8 IN IM 1.5 1.0 59 1.8 52 1.7 2 20 2.5 70 3.0 PC low Using test circuit in Fig.24; See Fig.1 Y AR Using test circuit in Fig.24; See Fig.4 200 nH maximum source inductance; See Fig.24 INPUT WAVEFORMS Figure 1— Inrush transient current at full load and nominal VIN with PC enabled Figure 2— Output voltage turn-on waveform with PC enabled at full load and nominal VIN Figure 3—Output voltage turn-on waveform with input turn-on at full load and nominal VIN Figure 4— Input reflected ripple current at full load and nominal VIN 45 Vicor Corporation Tel: 800-735-6200 vicorpower.com V•I Chip Bus Converter B048K120T10 Rev. 1.2 Page 2 of 16 Specifications, continued OUTPUT (Conditions are at nominal line, full load, and 25°C ambient unless otherwise specified) Parameter Rated DC current Peak repetitive current DC current limit Current share accuracy Efficiency Half load Full load Internal output inductance Internal output capacitance Load capacitance Output overvoltage setpoint Output ripple voltage No external bypass 1µF bypass capacitor Average short circuit current Effective switching frequency Line regulation K Load regulation ROUT Transient response Voltage undershoot Voltage overshoot Response time Recovery time Output overshoot Input turn-on PC enable Output turn-on delay From application of power From release of PC pin 8.3 10.5 5 95.5 96.5 1.6 7 1000 14.5 70 6 200 3.5 1/4 135 Min 0 Typ Max 8.3 12.5 13.1 10 Unit A A A % % % nH µF µF V mV mV mA MHz Note Max pulse width 1ms, max duty cycle 10%, baseline power 50% See Parallel Operation on page 11 See Fig.5 See Fig.5 Effective value 95.0 95.0 2.8 0.245 P EL R Efficiency vs. Output Power I IM 0.255 32 140 96 200 1 0 0 180 320 300 410 ms µs 4.2 mΩ mV mV ns µs RY NA See Figs.7 and 10 See Fig.8 Fixed, 1.75 MHz per phase VOUT=K•VIN at no load See Figs.9 and 28 0-8.3A load step, w/Cin =100µF, see Fig.11 8.3 -0A load step, w/Cin =100µF, see Fig.12 See Figs.11 and 12 See Figs.11 and 12 No output filter; See Fig.2 No output filter; See Fig.3 See Fig.3 See Fig.2 mV mV OUTPUT WAVEFORMS Power Dissipation 4 3.5 98 96 Power Dissipation (W) 0 10 20 30 40 50 60 70 80 90 100 94 3 2.5 2 1.5 1 0.5 0 0 10 20 30 40 50 60 70 80 90 100 Efficiency (%) 92 90 88 86 84 Output Power (W) Output Power (W) Figure 5— Efficiency vs. output power at nominal VIN Figure 6—Power dissipation as a function of output power 45 Vicor Corporation Tel: 800-735-6200 vicorpower.com V•I Chip Bus Converter B048K120T10 Rev. 1.2 Page 3 of 16 Specifications, continued PRELIMINARY Figure 7— Output voltage ripple at full load and nominal VIN; without any external bypass capacitor. Figure 8—Output voltage ripple at full load and nominal VIN with 1 µF ceramic external bypass capacitor. 80 70 60 Output Ripple (mV) 50 40 30 20 10 0 0 10 20 30 40 50 60 70 80 90 100 Output Power (W) Figure 9— Output impedance vs. frequency Figure 10— Output voltage ripple vs. output power at nominal line without any external bypass capacitor. Figure 11— 0 -8.3A transient response with no external bypass capacitance. Figure 12— 8.3 -0A transient response with no external bypass capacitance. 45 Vicor Corporation Tel: 800-735-6200 vicorpower.com V•I Chip Bus Converter B048K120T10 Rev. 1.2 Page 4 of 16 Specifications, continued GENERAL Parameter MTBF MIL-HDBK-217F Telcordia TR-NT-000332 Telcordia SR-332 Demonstrated Isolation specifications Voltage Capacitance Resistance Agency approvals(pending) Mechanical parameters Weight Dimensions Length Width Height Min Typ 3.6 4.2 TBD TBD 1,500 5,000 10 cTÜVus CE Mark 0.43 / 12.25 1.26 / 32 0.85 / 21.5 0.24 / 6 oz / g 6,500 Max Unit Mhrs Mhrs hrs hrs Vdc pF MΩ Note 25°C, GB Input to Output Input to Output Input to Output UL/CSA 60950, EN 60950 Low Voltage Directive See mechanical drawing, Figs.16 and 18 Auxiliary Pins (Conditions are at nominal line, full load, and 25°C ambient unless otherwise specified) Parameter Primary control (PC) DC voltage Module disable voltage Module enable voltage Current limit Enable delay time Disable delay time Temperature Monitor (TM) 27°C setting Temperature coefficient Full range accuracy Current limit P EL R Min 4.8 2.4 2.4 2.95 -5 100 I IM Typ 5.0 2.5 2.5 2.5 320 16 3.00 10 Max 5.2 2.6 2.9 410 40 3.05 5 in / mm in / mm in / mm RY NA Note Source only See Fig.2 See Fig.13 Operating junction temperature Operating junction temperature Source only Unit V V V mA µs µs V mV/°C °C µA Figure 13— VOUT at full load vs. PC disable Figure 14— PC signal during fault 45 Vicor Corporation Tel: 800-735-6200 vicorpower.com V•I Chip Bus Converter B048K120T10 Rev. 1.2 Page 5 of 16 Specifications, continued THERMAL Symbol Parameter Over temperature shutdown Thermal capacity Junction-to-case thermal impedance Junction-to-BGA thermal impedance Junction-to-ambient 1 Junction-to-ambient 2 PRELIMINARY Min 125 Typ 130 0.61 1.1 2.1 6.5 5.0 Max 135 1.5 2.5 7.2 5.5 Unit °C Ws/°C °C/W °C/W °C/W °C/W Note Junction temperature RθJC RθJB RθJA RθJA Notes 1. B048K120T10 surface mounted in-board to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM. 2. B048L120T10 (0.25"H integral Pin Fins) surface mounted on FR4 board, 300 LFM. V•I CHIP STRESS DRIVEN PRODUCT QUALIFICATION PROCESS Test High Temperature Operational Life (HTOL) Temperature Cycling High Temperature Storage Moisture Resistance Temperature Humidity Bias Testing (THB) Pressure Cooker Testing (Autoclave) Highly Accelerated Stress Testing (HAST) Solvent Resistance/Marking Permanency Mechanical Vibration Mechanical Shock Electro Static Discharge Testing – Human Body Model Electro Static Discharge Testing – Machine Model Highly Accelerated Life Testing (HALT) Dynamic Cycling Standard JESD22-A-108-B JESD22-A-104B JESD22-A-103A JESD22-A113-B EIA/JESD22-A-101-B JESD22-A-102-C JESD22-A-110B JESD22-B-107-A JESD22-B-103-A JESD22-B-104-A EIA/JESD22-A114-A EIA/JESD22-A115-A Per Vicor Internal Test Specification Per Vicor Internal Test Specification Environment 125°C, Vmax, 1,008 hrs -55°C to 125°C, 1,000 cycles 150°C, 1,000 hrs Moisture Sensitivity Level 4 85°C, 85% RH, Vmax, 1,008 hrs 121°C, 100% RH, 15 PSIG, 96 hrs 130°C, 85% RH, Vmax, 96 hrs Solvents A, B & C as defined 20g peak, 20-2,000 Hz, test in X, Y & Z directions 1,500g peak 0.5 ms pulse duration, 5 pulses in 6 directions Meets or exceeds 2,000 Volts Meets or exceeds 200 Volts Operation limits verified, destruct margin determined Constant line, 0-100% load, -20°C to 125°C V•I CHIP BALL GRID ARRAY INTERCONNECT QUALIFICATION Test BGA Daisy-Chain Thermal Cycling Ball Shear Bend Test Standard IPC-SM-785 IPC-9701 IPC-9701 IPC J-STD-029 IPC J-STD-029 Environment TC3, -40 to 125°C at