End of Life
BCM® in a VIA™ Package
Bus Converter
BCM3814x60E10A5yzz
®
S
US
C
C
NRTL
US
Isolated Fixed-Ratio DC-DC Converter
Features & Benefits
Product Ratings
• Up to 150A continuous low-voltage-side current
• Fixed transformation ratio (K) of 1/6
• Up to
769W/in3
power density
• 97.2% peak efficiency
VHI = 54V (36 – 60V)
ILO = up to 150A
VLO = 9V (6 – 10V)
(no load)
K = 1/6
Product Description
• Integrated ceramic capacitance filtering
The BCM3814x60E10A5yzz in a VIA package is a high-efficiency
Bus Converter, operating from a 36 to 60VDC high-voltage bus to
deliver an isolated 6 to 10VDC unregulated, low voltage.
• Parallel operation for multi-kW arrays
• OV, OC, UV, short circuit and thermal protection
This unique ultra-low-profile module incorporates DC-DC
conversion, integrated filtering and PMBus commands and controls
in a chassis- or PCB-mount form factor.
• 3814 package
• High MTBF
• Thermally enhanced VIA package
The BCM offers low noise, fast transient response and industry
leading efficiency and power density. A low-voltage-side
referenced PMBus-compatible telemetry and control interface
provides access to the BCM’s configuration, fault monitoring and
other telemetry functions.
• PMBus® management interface
Typical Applications
Leveraging the thermal and density benefits of Vicor VIA packaging
technology, the BCM module offers flexible thermal management
options with very low top- and bottom-side thermal impedances.
• DC Power Distribution
• Information and Communication
Technology (ICT) Equipment
When combined with downstream Vicor DC-DC conversion
components and regulators, the BCM allows the Power Design
Engineer to employ a simple, low-profile design, which will
differentiate the end system without compromising on cost or
performance metrics.
• High-End Computing Systems
• Automated Test Equipment
• Industrial Systems
• High-Density Energy Systems
• Transportation
Size:
3.76 x 1.40 x 0.37in
[95.59 x 35.54 x 9.40mm]
Part Ordering Information
Product
Function
Package
Length
Package
Width
Package
Type
BCM
38
14
x
BCM =
Bus Converter
Module
Length in
Inches x 10
Width in
Inches x 10
B = Board VIA
V = Chassis VIA
[a]
High-Side
Max
Max
Max
Voltage
Product Grade
High‑Side
Low‑Side Low‑Side
Range
(Case Temperature)
Voltage
Voltage Current
Ratio
60
E
10
Internal Reference
High-temperature current derating may apply; See Figure 1, specified thermal operating area.
BCM® in a VIA™ Package
Page 1 of 41
Rev 2.1
07/2020
A5
Option Field
y
zz
C = –20 to 100°C [a]
T = –40 to 100°C [a]
02 = Chassis/PMBus
06 = Short Pin/PMBus
10 = Long Pin/PMBus
BCM3814x60E10A5yzz
End of Life
Typical Applications
BCM in a VIA package
+HI
+LO
EXT_BIAS
5V
SCL
SDA
SGND
ADDR
–HI
–LO
R1
SCL
BCM in a VIA package
+HI
+LO
EXT_BIAS
5V
SCL
SDA
SGND
ADDR
–HI
–LO
R2
ISOLATION BOUNDARY
Paralleling PMBus® BCM in a VIA package – connection to Host PMBus
BCM® in a VIA™ Package
Page 2 of 41
Rev 2.1
07/2020
SGND
GROUND
L
O
A
D
+
–
SDA
DATA
DC
CLOCK
ISOLATION BOUNDARY
Host PMBus®
BCM3814x60E10A5yzz
End of Life
Typical Applications (Cont.)
Host PMBus®
PMBus
+
V
EXT
–
SGND
SGND
BCM in a VIA Package
SGND
EXT_BIAS
SCL
SDA
SGND
}
3
SGND
ADDR
FUSE
V
HI
C
+HI
+LO
–HI
–LO
Non-Isolated
Point-of-Load
Regulators
HI
HV
SOURCE_RTN
LOAD
LV
ISOLATION BOUNDARY
BCM3814x60E10A5yzz at point-of-load – connection to Host PMBus® – connection to Host PMBus
Host PMBus®
PMBus
V
+
EXT
SGND
–
SGND
SGND
BCM in a VIA Package
EXT_BIAS
SCL
SDA
SGND
}
3
SGND
ADDR
FUSE
V
HI
SOURCE_RTN
C
+HI
+LO
–HI
–LO
LOAD
HI
HV
LV
ISOLATION BOUNDARY
BCM3814x60E10A5yzz direct to load – connection to Host PMBus
BCM® in a VIA™ Package
Page 3 of 41
Rev 2.1
07/2020
BCM3814x60E10A5yzz
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Pin Configuration
10
1
+HI
TOP VIEW
3
12
–LO
–LO
+LO
5
6
7
8
9
PMBus
+LO
–LO
–LO
2
11
13
4
2
11
13
4
–HI
EXT BIAS
SCL
SDA
SGND
ADDR
BCM3814 in a VIA Package - Chassis (Lug) Mount
–HI
TOP VIEW
–LO
–LO
+LO
9
8
7
6
5
PMBus
+HI
–LO
–LO
10
12
1
ADDR
SGND
SDA
SCL
EXT BIAS
+LO
3
BCM3814 in a VIA Package - Board (PCB) Mount
Note: The dot on the VIA housing indicates the location of the signal pin 9.
Pin Descriptions
Pin Number
Signal Name
Type
Function
1
+HI
HIGH SIDE POWER
High-voltage-side positive power terminal
2
–HI
HIGH SIDE POWER
RETURN
High-voltage-side negative power terminal
3, 4
+LO
LOW SIDE
POWER
5
EXT BIAS
INPUT
5V supply input
6
SCL
INPUT
I2C™ Clock, PMBus® Compatible
7
SDA
INPUT/OUTPUT
I2C Data, PMBus Compatible
8
SGND
LOW SIDE
SIGNAL RETURN
Signal Ground
9
ADDR
INPUT
10, 11, 12, 13
–LO
LOW SIDE
POWER RETURN
Low voltage side positive power terminal
Address assignment – Resistor based
Low voltage side negative power terminal
Notes: All signal pins (5, 6, 7, 8, 9) are referenced to the low-voltage side and isolated from the high-voltage side.
Keep SGND signal separated from the low-voltage-side power return terminal (–LO) in electrical design.
BCM® in a VIA™ Package
Page 4 of 41
Rev 2.1
07/2020
End of Life
BCM3814x60E10A5yzz
Absolute Maximum Ratings
The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause permanent damage to the device.
Parameter
Comments
+HI to –HI
Min
Max
Unit
–1
80
V
1
V/µs
–1
15
V
–0.3
10
V
0.15
A
HI_DC or LO_DC Slew Rate
+LO to –LO
EXT BIAS to SGND
SCL to SGND
–0.3
5.5
V
SDA to SGND
–0.3
5.5
V
ADDR to SGND
–0.3
3.6
V
Isolation Voltage /
Dielectric Withstand
Basic insulation (high-voltage side to case)
1500
VDC
Basic insulation (high-voltage side to low-voltage side) [b]
1500
VDC
N/A
VDC
Functional insulation (low-voltage side to case)
[b]
The absolute maximum rating listed above for the dielectric withstand (high-voltage side to the low-voltage side) refers to the VIA package. The internal
safety approved isolating component (ChiP™) provides basic insulation (2250V) from the high-voltage side to the low-voltage side. However, the VIA
package itself can only be tested at a basic insulation value (1500V).
BCM® in a VIA™ Package
Page 5 of 41
Rev 2.1
07/2020
End of Life
BCM3814x60E10A5yzz
Electrical Specifications
Specifications apply over all line and load conditions, unless otherwise noted; boldface specifications apply over the temperature range of
–40°C ≤ TCASE ≤ 100°C (T-Grade); all other specifications are at TCASE = 25ºC unless otherwise noted.
Attribute
Symbol
Conditions / Notes
Min
Typ
Max
Unit
60
V
14
V
General Powertrain Specification – Forward Direction Operation (High-Voltage Side to Low-Voltage Side)
HI-Side Voltage Range
(Continuous)
HI-Side Voltage Initialization
Threshold
HI-Side Quiescent Current
36
VHI_DC
VµC_ACTIVE
IHI_Q
HI-side voltage where internal controller is initialized,
(powertrain inactive)
Disabled, VHI_DC = 54V
5
TCASE ≤ 100ºC
10
VHI_DC = 54V, TCASE = 25ºC
No-Load Power Dissipation
HI-Side Inrush Current Peak
PHI_NL
IHI_INR_PK
7.2
5
VHI_DC = 54V
14
12
VHI_DC = 36 – 60V
17
30
TCASE ≤ 100ºC
DC HI-Side Current
Transformation Ratio
LO-Side Current (Continuous)
LO-Side Current (Pulsed)
Efficiency (Ambient)
IHI_IN_DC
K
ILO_OUT_DC
ILO_OUT_PULSE
ηAMB
9
VHI_DC = 36 – 60V, TCASE = 25ºC
VHI_DC = 60V, CLO_EXT = 4000μF,
RLOAD_LO = 20% of full-load current
A
At ILO_OUT_DC = 150A, TCASE ≤ 85ºC
25.5
High voltage to low voltage, K = VLO_DC / VHI_DC,
at no load
1/6
TCASE ≤ 85ºC
150
A
10ms pulse, 25% duty cycle, ILO_OUT_AVG ≤ 50% rated
ILO_OUT_DC
180
A
VHI_DC = 54V, ILO_OUT_DC = 150A
95.2
95.8
VHI_DC = 36 – 60V, ILO_OUT_DC = 150A
93.6
VHI_DC = 54V, ILO_OUT_DC = 75A
96.7
97.2
95.4
95.6
%
VHI_DC = 54V, ILO_OUT_DC = 150A TCASE = 85°C
Efficiency (Over Load Range)
η20%
30A < ILO_OUT_DC < 150A
93
RLO_COLD
VHI_DC = 54V, ILO_OUT_DC = 150A, TCASE = –40°C
0.9
1.7
2.1
RLO_AMB
VHI_DC = 54V, ILO_OUT_DC = 150A
2
2.1
2.4
RLO_HOT
VHI_DC = 54V, ILO_OUT_DC = 150A, TCASE = 85°C
1.6
2.3
2.6
Low side voltage ripple frequency = 2x FSW
0.85
0.90
0.95
LO-Side Voltage Ripple
FSW
VLO_OUT_PP
CLO_EXT = 0μF, ILO_OUT_DC = 150A, VHI_DC = 54V,
20MHz BW
TCASE ≤ 100ºC
BCM® in a VIA™ Package
Page 6 of 41
A
V/V
ηHOT
Switching Frequency
W
35
Efficiency (Hot)
LO-Side Output Resistance
mA
%
%
120
MHz
mV
200
Rev 2.1
07/2020
mΩ
End of Life
BCM3814x60E10A5yzz
Electrical Specifications (Cont.)
Specifications apply over all line and load conditions, unless otherwise noted; boldface specifications apply over the temperature range of
–40°C ≤ TCASE ≤ 100°C (T-Grade); all other specifications are at TCASE = 25ºC unless otherwise noted.
Attribute
Symbol
Conditions / Notes
Min
Typ
Max
Unit
General Powertrain Specification – Forward Direction Operation (High-Voltage Side to Low-Voltage Side), Cont.
Effective HI-Side Capacitance
(Internal)
CHI_INT
Effective value at 54VHI_DC
11.2
µF
Effective LO-Side Capacitance
(Internal)
CLO_INT
Effective value at 9VLO_DC
202
µF
Rated LO-Side Capacitance
(External)
CLO_OUT_EXT
Rated LO-Side Capacitance (External),
CLO_OUT_AEXT
Parallel Array Operation
Excessive capacitance may drive module into short
circuit protection
6000
µF
CLO_OUT_AEXT Max = N • 0.5 • CLO_OUT_EXT MAX, where
N = the number of units in parallel
Powertrain Hardware Protection Specification – Forward Direction Operation (High-Voltage Side to Low-Voltage Side)
• These built-in powertrain protections are fixed in hardware and cannot be configured through PMBus®.
• When duplicated in supervisory limits, hardware protections serve a secondary role and become active when supervisory limits are
disabled through PMBus.
Auto Restart Time
tAUTO_RESTART
Start up into a persistent fault condition. Non-latching
fault detection given VHI_DC > VHI_UVLO+
490
560
ms
HI-Side Overvoltage
Lockout Threshold
VHI_OVLO+
63
67
71
V
HI-Side Overvoltage
Recovery Threshold
VHI_OVLO–
61
65
69
V
HI-Side Overvoltage
Lockout Hysteresis
VHI_OVLO_HYST
2
V
HI-Side Overvoltage
Lockout Response Time
tHI_OVLO
100
µs
HI-Side Soft-Start Time
tHI_SOFT-START
1
ms
LO-Side Overcurrent Trip Threshold
ILO_OUT_OCP
LO-Side Overcurrent
Response Time Constant
tLO_OUT_OCP
LO-Side Short Circuit
Protection Trip Threshold
ILO_OUT_SCP
LO-Side Short Circuit
Protection Response Time
tLO_OUT_SCP
Overtemperature
Shutdown Threshold
BCM® in a VIA™ Package
Page 7 of 41
tOTP+
From powertrain active. Fast current limit protection
disabled during soft start
180
Effective internal RC filter
204
3
195
125
Rev 2.1
07/2020
A
ms
A
1
Internal
240
µs
°C
End of Life
BCM3814x60E10A5yzz
Electrical Specifications (Cont.)
Specifications apply over all line and load conditions, unless otherwise noted; boldface specifications apply over the temperature range of
–40°C ≤ TCASE ≤ 100°C (T-Grade); all other specifications are at TCASE = 25ºC unless otherwise noted.
Attribute
Symbol
Conditions / Notes
Min
Typ
Max
Unit
Powertrain Supervisory Limits Specification – Forward Direction Operation (High-Voltage Side to Low-Voltage Side)
• These supervisory limits are set in the internal controller and can be reconfigured or disabled through PMBus®.
• When disabled, the powertrain protections presented in the previous table will intervene during fault events.
HI-Side Overvoltage
Lockout Threshold
VHI_OVLO+
64
66
68
V
HI-Side Overvoltage
Recovery Threshold
VHI_OVLO–
60
64
66
V
HI-Side Overvoltage
Lockout Hysteresis
VHI_OVLO_HYST
2
V
HI-Side Overvoltage
Lockout Response Time
tHI_OVLO
100
µs
HI-Side Undervoltage
Lockout Threshold
VHI_UVLO–
26
28
30
V
HI-Side Undervoltage
Recovery Threshold
VHI_UVLO+
28
30
32
V
HI-Side Undervoltage
Lockout Hysteresis
VHI_UVLO_HYST
2
V
tHI_UVLO
100
µs
20
ms
HI-Side Undervoltage Lockout
Response Time
HI-Side Undervoltage Start-Up Delay
tHI_UVLO+_DELAY
LO-Side Overcurrent
Trip Threshold
ILO_OUT_OCP
LO-Side Overcurrent
Response Time Constant
tLO_OUT_OCP
From VHI_DC = VHI_UVLO+ to powertrain active (i.e., one
time start-up delay from application of VHI_DC
to VLO_DC)
193
Effective internal RC filter
tOTP+
Internal
125
Overtemperature
Recovery Threshold
tOTP–
Internal
105
Undertemperature Shutdown
Threshold (Internal)
tUTP
BCM® in a VIA™ Package
Page 8 of 41
tUTP_RESTART
215
3
Overtemperature
Shutdown Threshold
Undertemperature Restart Time
204
ms
°C
110
115
C-Grade
–25
T-Grade
–45
Start up into a persistent fault condition. Non-latching
fault detection given VHI_DC > VHI_UVLO+
Rev 2.1
07/2020
A
3
°C
°C
s
BCM3814x60E10A5yzz
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Operating Area
200
LO-Side Current (A)
180
160
140
120
100
80
60
40
20
0
–60
–40
–20
0
20
40
60
80
100
120
Case Temperature ( °C)
36 – 60V
Figure 1 — Specified thermal operating area
2000
200
1750
175
LO-Side Current (A)
LO-Side Power (W)
1. The BCM in a VIA package is cooled through the non-pin-side case.
2. The thermal rating is based on typical measured device efficiency.
3. The case temperature in the graph is the measured temperature of the non-pin-side housing, such that the internal operating temperature
does not exceed 125°C.
1500
1250
1000
750
500
250
0
36
38
40
42
44
46
48
50
52
54
56
58
150
125
100
75
50
25
0
60
36
38
40
HI-Side Voltage (V)
PLO_OUT_DC
42
44
46
ILO_OUT_DC
PLO_OUT_PULSE
LO-Side Capacitance
(% Rated CLO_EXT_MAX)
Figure 2 — Specified electrical operating area using rated RLO_HOT
110
100
90
80
70
60
50
40
30
20
10
0
0
20
40
60
LO Side-Current (% ILO_DC)
Figure 3 — Specified HI-side start up into load current and external capacitance
BCM® in a VIA™ Package
Page 9 of 41
48
50
52
54
HI-Side Voltage (V)
Rev 2.1
07/2020
80
100
ILO_OUT_PULSE
56
58
60
BCM3814x60E10A5yzz
End of Life
PMBus® Reported Characteristics
Specifications apply over all line and load conditions, unless otherwise noted; boldface specifications apply over the temperature range of
–40°C ≤ TCASE ≤ 100°C (T-Grade); all other specifications are at TCASE = 25ºC unless otherwise noted.
Monitored Telemetry
• The current telemetry is only available in forward operation. The input and output current reported value is not supported in reverse operation.
PMBus Read Command
Accuracy
(Rated Range)
Functional
Reporting Range
Update Rate
Reported Units
HI-Side Voltage
(88h) READ_VIN
±5% (LL – HL)
28 to 66V
100µs
VACTUAL = VREPORTED x 10–1
HI-Side Current
(89h) READ_IIN
±20% (10 – 20% of FL)
±5% (20 – 133% of FL)
–1 to 34A
100µs
IACTUAL = IREPORTED x 10–2
LO-Side Voltage [c]
(8Bh) READ_VOUT
±5% (LL – HL)
4.7 to 11V
100µs
VACTUAL = VREPORTED x 10–1
LO-Side Current
(8Ch) READ_IOUT
±20% (10 – 20% of FL)
±5% (20 – 133% of FL)
–6 to 204A
100µs
IACTUAL = IREPORTED x 10–2
LO-Side Resistance
(D4h) READ_ROUT
±5% (50 – 100% of FL) at NL
±10% (50 – 100% of FL) (LL – HL)
500 to 3000µΩ
100ms
RACTUAL = RREPORTED x 10–5
(8Dh) READ_TEMPERATURE_1
±7°C (Full Range)
–55 to 130ºC
100ms
TACTUAL = TREPORTED
Attribute
Temperature [d]
[c]
[d]
Default READ LO-Side Voltage returned when unit is disabled = –300V.
Default READ Temperature returned when unit is disabled = –273°C.
Variable Parameters
• Factory setting of all Thresholds and Warning limits listed below are 100% of specified protection values.
• Variables can be written only when module is disabled with VHI < VHI_UVLO– and external bias (VDDB) applied.
• Module must remain in a disabled mode for 3ms after any changes to the variables below to allow sufficient time to commit changes to EEPROM.
Attribute
PMBus Command
Conditions / Notes
VHI_OVLO– is automatically 3%
lower than this set point
Accuracy
(Rated Range)
Functional
Reporting
Range
Default
Value
±5% (LL – HL)
28 – 66V
100%
±5% (LL – HL)
28 – 66V
100%
±5% (LL – HL)
14 – 36V
100%
HI-Side Overvoltage
Protection Limit
(55h) VIN_OV_FAULT_LIMIT
HI-Side Overvoltage
Warning Limit
(57h) VIN_OV_WARN_LIMIT
HI-Side Undervoltage
Protection Limit
(D7h) DISABLE_FAULTS
HI-Side Overcurrent
Protection Limit
(5Bh) IIN_OC_FAULT_LIMIT
±20% (10 – 20% of FL)
±5% (20 – 133% of FL)
0 – 34A
100%
HI-Side Overcurrent
Warning Limit
(5Dh) IIN_OC_WARN_LIMIT
±20% (10 – 20% of FL)
±5% (20 – 133% of FL)
0 – 34A
100%
Can only be disabled to a preset
default value
Overtemperature
Protection Limit
(4Fh) OT_FAULT_LIMIT
Internal temperature
±7°C (Full Range)
0 – 125°C
100%
Overtemperature
Warning Limit
(51h) OT_WARN_LIMIT
Internal temperature
±7°C (Full Range)
0 – 125°C
100%
±50µs
0 – 100ms
0ms
Turn On Delay
(60h) TON_DELAY
Additional time delay to the
undervoltage start-up delay
BCM® in a VIA™ Package
Rev 2.1
Page 10 of 41 07/2020
BCM3814x60E10A5yzz
End of Life
Signal Characteristics
Specifications apply over all line and load conditions, unless otherwise noted; boldface specifications apply over the temperature range of
–40°C ≤ TCASE ≤ 100°C (T-Grade); all other specifications are at TCASE = 25ºC unless otherwise noted. Please note: For chassis mount model, Vicor part
number 42550 will be needed for applications requiring the use of the signal pins. Signal cable 42550 is rated up to five insertions and extractions. To avoid
unnecessary stress on the connector, the cable should be appropriately strain relieved.
EXT. BIAS (VDDB) Pin
• VDDB powers the internal controller.
• VDDB needs to be applied to enable and disable the BCM through PMBus® control (using OPERATION COMMAND), and to adjust warning and
protection thresholds.
• VDDB voltage not required for telemetry; however, if VDDB is not applied, telemetry information will be lost when VIN is removed.
Signal Type
State
Regular
Operation
INPUT
Start Up
Attribute
Symbol
VDDB Voltage
VVDDB
VDDB Current Consumption
IVDDB
Conditions / Notes
Min
Typ
Max
Unit
4.5
5
9
V
50
mA
Inrush Current Peak
IVDDB_INR
VVDDB slew rate = 1V/µs
3.5
A
Turn On Time
tVDDB_ON
From VVDDB_MIN to PMBus active
1.5
ms
SGND Pin
• All PMBus interface signals (SCL, SDA, ADDR) are referenced to SGND pin.
• SGND pin also serves as return pin (ground pin) for VDDB.
• Keep SGND signal separated from the low-voltage side power return terminal (–LO) in electrical design.
Address (ADDR) Pin
• This pin programs the address using a resistor between ADDR pin and signal ground.
• The address is sampled during start up and is stored until power is reset. This pin programs only a Fixed and Persistent address.
• This pin has an internal 10kΩ pull-up resistor to 3.3V.
• 16 addresses are available. The range of each address is 206.25mV (total range for all 16 addresses is 0V to 3.3V).
Signal Type
MULTI–LEVEL
INPUT
State
Regular
Operation
Start Up
Attribute
Symbol
Conditions / Notes
ADDR Input Voltage
VSADDR
See address section
ADDR Leakage Current
ISADDR
Leakage current
ADDR Registration Time
tSADDR
From VVDDB_MIN
BCM® in a VIA™ Package
Rev 2.1
Page 11 of 41 07/2020
Min
Typ
0
1
Max
Unit
3.3
V
1
µA
ms
BCM3814x60E10A5yzz
End of Life
Serial Clock input (SCL) AND Serial Data (SDA) Pins
• High power SMBus specification and SMBus physical layer compatible. Note that optional SMBALERT# is not supported.
• PMBus® command compatible.
Signal Type
State
Attribute
Symbol
Conditions / Notes
Min
Typ
Max
Unit
Electrical Parameters
2.1
VIH
Input Voltage Threshold
VIL
VOL
Leakage Current
ILEAK_PIN
Signal Sink Current
ILOAD
Signal Capacitive Load
CI
Signal Noise Immunity
VNOISE_PP
0.8
V
0.4
V
10
µA
3
VOH
Output Voltage Threshold
V
Unpowered device
VOL = 0.4V
V
4
Total capacitive load of
one device pin
mA
10
10MHz to 100MHz
300
Idle state = 0Hz
10
pF
mV
Timing Parameters
DIGITAL
INPUT/OUTPUT
Regular
Operation
Operating Frequency
FSMB
Free Time Between
Stop and Start Condition
tBUF
Hold Time After Start or
Repeated Start Condition
tHD:STA
Repeat Start Condition
Setup Time
µs
0.6
µs
tSU:STA
0.6
µs
Stop Condition Setup Time
tSU:STO
0.6
µs
Data Hold Time
tHD:DAT
300
ns
Data Setup Time
tSU:DAT
100
ns
Clock Low Time Out
tTIMEOUT
25
Clock Low Period
tLOW
1.3
Clock High Period
tHIGH
0.6
First clock is generated
after this hold time
35
ms
µs
50
µs
25
ms
Cumulative Clock Low
Extend Time
tLOW:SEXT
Clock or Data Fall Time
tF
20
300
ns
Clock or Data Rise Time
tR
20
300
ns
tLOW tR
tF
VIH
VIL
tHD,STA
SDA
P
kHz
1.3
SCL
VIH
VIL
400
tBUF
tHD,DAT
tHIGH
tSU,DAT
S
BCM® in a VIA™ Package
Rev 2.1
Page 12 of 41 07/2020
tSU,STA
tSU,STO
S
P
BCM® in a VIA™ Package
Rev 2.1
Page 13 of 41 07/2020
OUTPUT
INPUT
+VLO
+VHI
VµC_ACTIVE
VHI_OVLO+
VNOM
STARTUP
tHI_UVLO+_DELAY
VHI_UVLO+
VHI_UVLO-
VHI_OVLO-
OVERVOLTAGE
T
NI
E
IA N
LT
VO
I NO
R
N
R R
E
R
LE TU
OV
TU
E
E
RO IDE
T
D
D
N S
SI
SI
HI
CO LO
HI
ON
LIZ
E
AG
A
OPERATION
COMMAND
CONTROL
M
F
ON
T
OR
SH
D
AN
OF
OVERCURRENT
tAUTO_RESTART
> tHI_UVLO+_DELAY tLO_OUT_SCP
M M
C O CO
N
N
E
R
I O IO
A T RAT
DE
I
R
S
E
E
HI
O P OP
RT
A
ST
M
ND
U
RC
CI
S
HI
T
E
ID
RN
TU
SHUTDOWN
IT
EN
EV
F
OF
End of Life
BCM3814x60E10A5yzz
Timing Diagram (Forward Direction)
BCM3814x60E10A5yzz
End of Life
Application Characteristics
Temperature controlled via pin-side side cold plate, unless otherwise noted. All data presented in this section are collected from units processing power in the
forward direction (high-voltage side to low-voltage side). See associated figures for general trend data.
97.0
14
Full-Load Efficiency (%)
Power Dissipation (W)
16
12
10
8
6
4
2
0
36
38
40
42
44
46
48
50
52
54
56
58
96.0
95.0
94.0
93.0
–40
60
–20
0
HI-Side Voltage (V)
T CASE:
–40°C
25°C
VHI_DC:
70°C
Figure 4 — No-load power dissipation vs. VHI_DC
99
100
97
90
Power Dissipation (W)
Efficiency (%)
40
60
80
100
36V
54V
60V
Figure 5 — Full-load efficiency vs. temperature
95
93
91
89
87
85
83
81
80
70
60
50
40
30
20
10
0
79
0
15
30
45
60
75
90
105
120
135
0
150
15
30
LO-Side Current (A)
VHI_DC:
36V
54V
45
60
75
90
105
120
135
150
135
150
LO-Side Current (A)
VHI_DC:
60V
Figure 6 — Efficiency at TCASE = –40°C
36V
54V
60V
Figure 7 — Power dissipation at TCASE = –40°C
100
97
90
Power Dissipation (W)
99
95
Efficiency (%)
20
Case Temperature (ºC)
93
91
89
87
85
83
81
80
70
60
50
40
30
20
10
0
79
0
15
30
45
60
75
90
105
120
135
0
150
15
30
VHI_DC:
36V
Figure 8 — Efficiency at TCASE = 25°C
54V
45
60
75
90
105
120
LO-Side Current (A)
LO-Side Current (A)
VHI_DC:
60V
36V
54V
Figure 9 — Power dissipation at TCASE = 25°C
BCM® in a VIA™ Package
Rev 2.1
Page 14 of 41 07/2020
60V
BCM3814x60E10A5yzz
End of Life
Application Characteristics (Cont.)
Temperature controlled via pin-side side cold plate, unless otherwise noted. All data presented in this section are collected from units processing power in the
forward direction (high-voltage side to low-voltage side). See associated figures for general trend data.
100
97
90
Power Dissipation (W)
99
Efficiency (%)
95
93
91
89
87
85
83
81
79
80
70
60
50
40
30
20
10
0
0
15
30
45
60
75
90
105
120
135
150
0
15
30
LO-Side Current (A)
VHI_DC:
36V
54V
60V
VHI_DC:
75
90
105
120
135
150
36V
54V
60V
Figure 11 — Power dissipation at TCASE = 70°C
4.0
250
3.5
LO-Side
Voltage Ripple (mV)
LO-Side Output Resistance (mΩ)
60
LO-Side Current (A)
Figure 10 — Efficiency at TCASE = 0°C
3.0
2.5
2.0
1.5
1.0
0.5
0.0
–40
45
225
200
175
150
125
100
75
50
25
0
–20
0
20
40
60
80
100
30
45
60
VHI_DC:
150A
Figure 12 — RLO vs. temperature; nominal VHI_DC
ILO_DC = 150A at TCASE = 70°C
15
75
90
105
120
135
LO-Side Current (A)
Case Temperature (°C)
ILO_DC:
0
54V
Figure 13 — VLO_OUT_PP vs. ILO_DC ; no external CLO_OUT_EXT.
Board‑mounted module, scope setting:
20MHz analog BW
BCM® in a VIA™ Package
Rev 2.1
Page 15 of 41 07/2020
150
End of Life
BCM3814x60E10A5yzz
Application Characteristics (Cont.)
Temperature controlled via pin-side side cold plate, unless otherwise noted. All data presented in this section are collected from units processing power in the
forward direction (high-voltage side to low-voltage side). See associated figures for general trend data.
Figure 14 — Full-load LO-side voltage ripple, 300µF CHI_IN_EXT;
no external CLO_OUT_EXT. Board-mounted module,
scope setting: 20MHz analog BW
Figure 15 — 0 – 150A transient response:
CHI_IN_EXT = 300µF, no external CLO_OUT_EXT
Figure 16 — 150 – 0A transient response:
CHI_IN_EXT = 300µF, no external CLO_OUT_EXT
Figure 17 — Start up from application of VHI_DC = 54V, 20% ILO_DC
100% CLO_OUT_EXT
Figure 18 — Start up from application of OPERATION COMMAND
with pre-applied VHI_DC = 54V, 20% ILO_DC,
100% CLO_OUT_EXT
BCM® in a VIA™ Package
Rev 2.1
Page 16 of 41 07/2020
BCM3814x60E10A5yzz
End of Life
General Characteristics
Specifications apply over all line and load conditions, unless otherwise noted; boldface specifications apply over the temperature range of
–40°C ≤ TCASE ≤ 100°C (T-Grade); All other specifications are at TCASE = 25ºC unless otherwise noted.
Attribute
Symbol
Conditions / Notes
Min
Typ
Max
Unit
Mechanical
Length
L
Lug (Chassis) Mount
95.34 [3.75]
95.59 [3.76]
95.84 [3.77]
mm [in]
Length
L
PCB (Board) Mount
97.55 [3.84]
97.80 [3.85]
98.05 [3.86]
mm [in]
Width
W
35.29 [1.39]
35.54 [1.40]
35.79 [1.41]
mm [in]
Height
H
9.019 [0.355]
9.40 [0.37]
9.781 [0.385]
mm [in]
Volume
Vol
Weight
W
Without heat sink
Pin Material
C145 copper
Underplate
Low-stress ductile Nickel
Pin Finish (Gold)
Pin Finish (Tin)
31.93 [1.95]
cm3 [in3]
130.4 [4.6]
g [oz]
50
100
Palladium
0.8
6
Soft Gold
0.12
2
Whisker-resistant matte Tin
200
400
BCM3814x60E10A5yzz (T-Grade)
–40
125
BCM3814x60E10A5yzz (C-Grade)
–20
125
BCM3814x60E10A5yzz (T-Grade),
derating applied, see safe thermal
operating area
–40
100
–20
100
µin
µin
µin
Thermal
Operating Internal Temperature
Operating Case Temperature
TINT
TCASE
Thermal Resistance Pin Side
θINT_PIN_SIDE
Thermal Resistance Housing
θHOU
Thermal Resistance Non-Pin Side
θINT_NON_PIN_SIDE
BCM3814x60E10A5yzz (C-Grade),
derating applied, see safe thermal
operating area
Estimated thermal resistance to
maximum temperature internal
component from isothermal pin/
terminal-side housing
Estimated thermal resistance of thermal
coupling between the pin-side and
non‑pin‑side case surfaces
Estimated thermal resistance to
maximum temperature internal
component from isothermal non-pin/
non-terminal housing
Thermal Capacity
°C
0.97
°C/W
0.58
°C/W
0.59
°C/W
52
Ws/°C
Assembly
Storage Temperature
TST
BCM3814x60E10A5yzz (T-Grade)
–40
125
°C
BCM3814x60E10A5yzz (C-Grade)
–40
125
°C
ESDHBM
Human Body Model,
“ESDA / JEDEC JDS-001-2012” Class I-C
(1kV to < 2kV)
1000
ESDCDM
Charge Device Model,
“JESD 22-C101-E” Class II (200V to
< 500V)
200
ESD Withstand
BCM® in a VIA™ Package
Rev 2.1
Page 17 of 41 07/2020
BCM3814x60E10A5yzz
End of Life
General Characteristics (Cont.)
Specifications apply over all line and load conditions, unless otherwise noted; boldface specifications apply over the temperature range of
–40°C ≤ TCASE ≤ 100°C (T-Grade); All other specifications are at TCASE = 25ºC unless otherwise noted.
Attribute
Symbol
Conditions / Notes
Min
Typ
Max
Unit
780
940
pF
Safety
Isolation Capacitance
CHI_LO
Unpowered unit
620
Isolation Resistance
RHI_LO
At 500VDC
10
MTBF
MΩ
MIL-HDBK-217Plus Parts Count - 25°C
Ground Benign, Stationary, Indoors /
Computer
2.2
MHrs
Telcordia Issue 2 - Method I Case III;
25°C Ground Benign, Controlled
3.6
MHrs
cTÜVus EN 60950-1
Agency Approvals / Standards
cURus UL60950-1
CE Marked for Low Voltage Directive and RoHS Recast Directive, as applicable
BCM® in a VIA™ Package
Rev 2.1
Page 18 of 41 07/2020
BCM3814x60E10A5yzz
End of Life
BCM in a VIA Package
ILO
IHI
RLO
+
+
K • ILO
VHI
+
IHI_Q
–
V•I
K
+
K • VHI
VLO
–
–
–
Figure 19 — BCM DC model (Forward Direction)
The BCM uses a high frequency resonant tank to move energy
from the high-voltage side to the low-voltage side and vice
versa. The resonant LC tank, operated at high frequency, is
amplitude modulated as a function of the HI-side voltage and
the LO-side current. A small amount of capacitance embedded
in the high‑voltage side and low-voltage side stages of the
module is sufficient for full functionality and is key to achieving
high power density.
The effective DC voltage transformer action provides additional
interesting attributes. Assuming that RLO = 0Ω and IHI_Q = 0A,
Equation 3 now becomes Equation 1 and is essentially load
independent, resistor R is now placed in series with VHI.
R
R
The BCM3814x60E10A5yzz can be simplified into the model
shown in Figure 19.
Vin
VHI
+
–
BCM
SAC
1/6
KK==1/32
V
Vout
LO
At no load:
VLO = VHI • K
(1)
Figure 20 — K = 1/6 BCM with series HI-side resistor
K represents the “turns ratio” of the BCM.
Rearranging Equation 1:
K =
VLO
The relationship between VHI and VLO becomes:
VLO = VHI • K – ILO • RLO
(3)
and ILO is represented by:
IHI – IHI_Q
K
(5)
Substituting the simplified version of Equation 4
(IHI_Q is assumed = 0A) into Equation 5 yields:
In the presence of a load, VLO is represented by:
ILO =
VLO = (VHI – IHI • R) • K
(2)
VHI
(4)
RLO represents the impedance of the BCM and is a function of the
RDS_ON of the HI-side and LO-side MOSFETs, PC board resistance
of HI-side and LO-side boards and the winding resistance of the
power transformer. IHI_Q represents the HI-side quiescent current of
the BCM controller, gate drive circuitry and core losses.
VLO = VHI • K – ILO • R • K 2
(6)
This is similar in form to Equation 3, where RLO is used to represent
the characteristic impedance of the BCM. However, in this case a
real resistor, R, on the high-voltage side of the BCM is effectively
scaled by K 2 with respect to the low-voltage side.
Assuming that R = 1Ω, the effective R as seen from the low-voltage
side is 28mΩ, with K = 1/6.
BCM® in a VIA™ Package
Rev 2.1
Page 19 of 41 07/2020
BCM3814x60E10A5yzz
End of Life
A similar exercise can be performed with the addition of a
capacitor or shunt impedance at the high-voltage side of the
BCM. A switch in series with VHI is added to the circuit. This is
depicted in Figure 21.
S
VVin
HI
+
–
BCM
SAC
1/6
KK==1/32
C
VVout
LO
Low impedance is a key requirement for powering a high‑current,
low-voltage load efficiently. A switching regulation stage
should have minimal impedance while simultaneously providing
appropriate filtering for any switched current. The use of a BCM
between the regulation stage and the point-of-load provides a
dual benefit of scaling down series impedance leading back to
the source and scaling up shunt capacitance or energy storage
as a function of its K factor squared. However, these benefits are
not achieved if the series impedance of the BCM is too high. The
impedance of the BCM must be low, i.e., well beyond the crossover
frequency of the system.
A solution for keeping the impedance of the BCM low involves
switching at a high frequency. This enables the use of small
magnetic components because magnetizing currents remain low.
Small magnetics mean small path lengths for turns. Use of low loss
core material at high frequencies also reduces core losses.
Figure 21 — BCM with HI-side capacitor
The two main terms of power loss in the BCM module are:
A change in VHI with the switch closed would result in a change in
capacitor current according to the following equation:
dVHI
IC (t) = C
(7)
dt
K
PLO_OUT = PHI_IN – PDISSIPATED = PHI_IN – PHI_NL – PRLO
(8)
C
2
•
dVLO
dt
(10)
Therefore,
(11)
The above relations can be combined to calculate the overall
module efficiency:
substituting Equation 1 and 8 into Equation 7 reveals:
ILO(t) =
n
Resistive loss (PRLO): refers to the power loss across the BCM
module modeled as pure resistive impedance.
PDISSIPATED = PHI_NL + PRLO
Assume that with the capacitor charged to VHI, the switch is
opened and the capacitor is discharged through the idealized
BCM. In this case,
IC = ILO • K
n
No-load power dissipation (PHI_NL): defined as the power used to
power up the module with an enabled powertrain at no load.
(9)
η=
The equation in terms of the LO-side has yielded a K 2 scaling factor
for C, specified in the denominator of the equation.
A K factor less than unity results in an effectively larger capacitance
on the low-voltage side when expressed in terms of the
high‑voltage side. With a K = 1/6 as shown in Figure 21, C = 1µF
would appear as C = 36µF when viewed from the low-voltage side.
=
PLO_OUT
PHI_IN
PHI_IN – PHI_NL – PRLO
PHI_IN
VHI • IHI – PHI_NL – (ILO)2 • RLO
= 1 –
BCM® in a VIA™ Package
Rev 2.1
Page 20 of 41 07/2020
=
VHI • IHI
(
)
PHI_NL + (ILO)2 • RLO
VHI • IHI
(12)
BCM3814x60E10A5yzz
End of Life
Filter Design
Thermal Considerations
A major advantage of BCM systems versus conventional PWM
converters is that the transformer based BCM does not require
external filtering to function properly. The resonant LC tank,
operated at extreme high frequency, is amplitude modulated as
a function of HI-side voltage and LO-side current and efficiently
transfers charge through the isolation transformer. A small amount
of capacitance embedded in the high-voltage side and low-voltage
side stages of the module is sufficient for full functionality and is
key to achieving power density.
The VIA package provides effective conduction cooling from
either of the two module surfaces. Heat may be removed from
the pin‑side surface, the non-pin-side surface or both. The extent
to which these two surfaces are cooled is a key component for
determining the maximum power that can be processed by a BCM,
as can be seen from the specified thermal operating area in
Figure 1. Since the BCM has a maximum internal temperature
rating, it is necessary to estimate this temperature based on a
system‑level thermal solution. For this purpose, it is helpful to
simplify the thermal solution into a roughly equivalent circuit
where power dissipation is modeled as a current source, isothermal
surface temperatures are represented as voltage sources and the
thermal resistances are represented as resistors. Figure 22 shows
the “thermal circuit” for the BCM in a VIA package.
This paradigm shift requires system design to carefully evaluate
external filters in order to:
n Guarantee low source impedance:
To take full advantage of the BCM module’s dynamic response,
the impedance presented to its HI-side terminals must be low
from DC to approximately 5MHz. The connection of the bus
converter module to its power source should be implemented
with minimal distribution inductance. If the interconnect
inductance exceeds 100nH, the HI side should be bypassed
with a RC damper to retain low source impedance and stable
operation. With an interconnect inductance of 200nH, the RC
damper may be as high as 1µF in series with 0.3Ω. A single
electrolytic or equivalent low-Q capacitor may be used in place
of the series RC bypass.
–
θHOU
θINT_NON_
PDISS
n Further reduce HI-side and/or LO-side voltage ripple
Given the wide bandwidth of the module, the source response
is generally the limiting factor in the overall system response.
Anomalies in the response of the source will appear at the
LO‑side of the module multiplied by its K factor.
n Protect the module from overvoltage transients imposed
by the system that would exceed maximum ratings and
induce stresses:
The module high side/low side voltage ranges shall not be
exceeded. An internal overvoltage lockout function prevents
operation outside of the normal operating HI-side range. Even
when disabled, the powertrain is exposed to the applied voltage
and the power MOSFETs must withstand it.
Total load capacitance at the LO side of the BCM module shall not
exceed the specified maximum. Owing to the wide bandwidth and
small LO-side impedance of the module, low-frequency bypass
capacitance and significant energy storage may be more densely
and efficiently provided by adding capacitance at the HI side of
the module. At frequencies PP@
127(6
3.957 [100.517]
3.368 [85.554]
3.368 [85.554]
End of Life
BCM3814x60E10A5yzz
BCM in VIA Package PCB (Board) Mount Package Mechanical Drawing
BCM® in a VIA™ Package
Rev 2.1
Page 39 of 41 07/2020
1.61 [40.93]
4414 BCM –OUT RETURN TO CASE
6HH3LQ&RQILJXUDWLRQDQG3LQ'HVFULSWLRQVHFWLRQVIRUSLQGHVLJQDWLRQV
DIM 'B'
12
13
1.277 [32.430]
1.277 [32.430]
1.277 [32.430]
RECOMMENED HOLE PATTERN
10
11
1.02 [25.96]
3814 BCM –OUT RETURN TO CASE
8QOHVVRWKHUZLVHVSHFLILHGGLPHQVLRQVDUH,QFK>PP@
127(6
1
2
DIM 'A'
1.02 [25.96]
PRODUCT
3814 NBM –OUT RETURN TO CASE
DIM 'C'
9
5
6
7
8
DETAIL A
4.35 [110.55]
3.76 [95.59]
3.76 [95.59]
DIM 'D'
3
4
3.957 [100.517]
3.368 [85.554]
3.368 [85.554]
DIM 'E'
4.44 [112.76]
3.85 [97.80]
3.85 [97.80]
DIM 'F'
DIM 'G'
4.221 [107.206]
3.632 [92.243]
3.632 [92.243]
SEE DETAIL 'A'
1.439 [36.554]
.850 [21.590]
.850 [21.590]
End of Life
BCM3814x60E10A5yzz
BCM in VIA Package PCB (Board) Mount Package Recommended Hole Pattern
End of Life
BCM3814x60E10A5yzz
Revision History
Revision
Date
Description
1.0
03/3/16
Initial release
n/a
1.1
05/2/16
New Power Pin Nomenclature
All
1.2
06/17/16
Notes update
1.3
08/01/16
Charts format update
1.4
09/26/16
Value of R correction for READ_BCM_ROUT
1.5
12/13/16
Content improvements
Pin Finish update
PMBus® Supported Commands update
All
17
26 – 37
1.6
03/23/17
Package drawings update
37 – 39
1.7
01/24/18
Updated monitored telemetry technical information and specs
Updated mechanical drawings
10
37 – 39
1.8
02/06/18
Updated agency approvals
1.9
08/17/18
Updated mechanical drawings
38 – 39
2.0
09/24/18
Correction to READ_IIN R value
24
2.1
07/13/20
Updated terminology
BCM® in a VIA™ Package
Rev 2.1
Page 40 of 41 07/2020
Page Number(s)
2, 3, 10
13, 14, 15
23
1, 18
24, 26, 27, 28, 31
End of Life
BCM3814x60E10A5yzz
Vicor’s comprehensive line of power solutions includes high density AC-DC and DC-DC modules and
accessory components, fully configurable AC-DC and DC-DC power supplies, and complete custom
power systems.
Information furnished by Vicor is believed to be accurate and reliable. However, no responsibility is assumed by Vicor for its use. Vicor
makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication. Vicor reserves
the right to make changes to any products, specifications, and product descriptions at any time without notice. Information published by
Vicor has been checked and is believed to be accurate at the time it was printed; however, Vicor assumes no responsibility for inaccuracies.
Testing and other quality controls are used to the extent Vicor deems necessary to support Vicor’s product warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
Specifications are subject to change without notice.
Visit http://www.vicorpower.com/dc-dc/isolated-fixed-ratio/bus-converter-module for the latest product information.
Vicor’s Standard Terms and Conditions and Product Warranty
All sales are subject to Vicor’s Standard Terms and Conditions of Sale, and Product Warranty which are available on Vicor’s webpage
(http://www.vicorpower.com/termsconditionswarranty) or upon request.
Life Support Policy
VICOR’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE
EXPRESS PRIOR WRITTEN APPROVAL OF THE CHIEF EXECUTIVE OFFICER AND GENERAL COUNSEL OF VICOR CORPORATION. As used
herein, life support devices or systems are devices which (a) are intended for surgical implant into the body, or (b) support or sustain life and
whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to
result in a significant injury to the user. A critical component is any component in a life support device or system whose failure to perform
can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness. Per Vicor Terms
and Conditions of Sale, the user of Vicor products and components in life support applications assumes all risks of such use and indemnifies
Vicor against all liability and damages.
Intellectual Property Notice
Vicor and its subsidiaries own Intellectual Property (including issued U.S. and Foreign Patents and pending patent applications) relating to the
products described in this data sheet. No license, whether express, implied, or arising by estoppel or otherwise, to any intellectual property
rights is granted by this document. Interested parties should contact Vicor’s Intellectual Property Department.
The products described on this data sheet are protected by the following U.S. Patents Numbers:
Patents Pending.
Contact Us: http://www.vicorpower.com/contact-us
Vicor Corporation
25 Frontage Road
Andover, MA, USA 01810
Tel: 800-735-6200
Fax: 978-475-6715
www.vicorpower.com
email
Customer Service: custserv@vicorpower.com
Technical Support: apps@vicorpower.com
©2018 – 2020 Vicor Corporation. All rights reserved. The Vicor name is a registered trademark of Vicor Corporation.
The PMBus® is a registered trademark of SMIF, Inc.
I2C™ is a trademark of NXP Semiconductor
All other trademarks, product names, logos and brands are property of their respective owners.
BCM® in a VIA™ Package
Rev 2.1
Page 41 of 41 07/2020
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