BCM384F480T325A00

BCM384 x 480 T 325A00 BCM™ Bus Converter C S NRTL US FEATURES • 384 Vdc – 48 Vdc 325 W Bus Converter • High efficiency (>95%) reduces system power consumption • High power density (>1000 W/in3) reduces power system footprint by >40% • “Full Chip” V•I Chip package enables surface mount, low impedance interconnect to system board • Contains built-in protection features: undervoltage, overvoltage lockout, overcurrent protection, short circuit protection, overtemperature protection. DESCRIPTION The V•I Chip™ bus converter is a high efficiency (>95%) Sine Amplitude Converter™ (SAC™) operating from a 360 to 400 Vdc primary bus to deliver an isolated 45 – 50 V nominal, unregulated secondary. The SAC offers a low AC impedance beyond the bandwidth of most downstream regulators, meaning that input capacitance normally located at the input of a regulator can be located at the input to the SAC. Since the K factor of the BCM384F480T325A00 is 1/8, that capacitance value can be reduced by a factor of 64x, resulting in savings of board area, materials and total system cost. The BCM384F480T325A00 is provided in a V•I Chip package compatible with standard pick-and-place and surface mount assembly processes. The V•I Chip package provides flexible thermal management through its low junction-to-case and junction-to-board thermal resistance. With high conversion efficiency the BCM384F480T325A00 increases overall system efficiency and lowers operating costs compared to conventional approaches. VIN = 360 – 400 V VOUT = 45 – 50 V (NO LOAD) POUT = 325 W(NOM) K = 1/8 • Provides enable/disable control, internal temperature monitoring • ZVS/ZCS Resonant Sine Amplitude Converter topology • Can be paralleled to create multi-kW arrays TYPICAL APPLICATIONS • High End Computing Systems • Automated Test Equipment • Telecom Base Stations • High Density Power Supplies • Communications Systems PART NUMBERING PART NUMBER PACKAGE STYLE PRODUCT GRADE BCM384 x 480 T325A00 F = J-Lead T = Through hole T = -40° to 125°C For Storage and Operating Temperatures see Section 6.0 General Characteristics TYPICAL APPLICATION VC SG OS CD VC PC TM PR enable / disable switch SW1 F1 +In VIN C1 1 µF -In -Out -In +Out +In PC TM PC TM IL BCM PRM +Out +In VTM +Out L O A D -Out -In -Out V•I CHIP CORP. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200 v i c o r p o w e r. c o m Rev. 1.9 4/2011 Page 1 of 18 PRELIMINARY DATASHEET BCM384 x 480 T 325A00 ABSOLUTE MAXIMUM RATINGS +IN to –IN . . . . . . . . . . . . . . . . . . . . . . . . -1.0 Vdc – +440 Vdc PC to –IN . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 Vdc – +20 Vdc TM to –IN . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 Vdc – +7 Vdc +IN/-IN to +OUT/-OUT . . . . . . . . . . . . . . . . . . . 4242 V (Hi Pot) +IN/-IN to +OUT/-OUT . . . . . . . . . . . . . . . . . . . 500 V (working) +OUT to –OUT . . . . . . . . . . . . . . . . . . . . . . -1.0 Vdc - +60 Vdc Temperature during reflow . . . . . . . . . . . . . . . . 245°C (MSL 6) PACKAGE ORDERING INFORMATION CONTROL PIN SPECIFICATIONS See section 5.0 for further application details and guidelines. PC (BCM™ Primary Control) The PC pin can enable and disable the BCM™ bus converter. When held below VPC_DIS the BCM module shall be disabled. When allowed to float with an impedance to –IN of greater than 50 kΩ the module will start. When connected to another bus converter PC pin, the modules will start simultaneously when enabled. The PC pin is capable of being driven high by an either external logic signal or internal pull up to 5 V (operating). TM (BCM™ Temperature Monitor) The TM pin monitors the internal temperature of the module within an accuracy of +5/-5°C. It has a room temperature setpoint of ~3.0 V and an approximate gain of 10 mV/°C. It can source up to 100 µA and may also be used as a “Power Good” flag to verify that the bus converter is operating. 4 A 3 2 1 A B C D E +Out B C D E +In -Out F G H H J J K K TM RSV PC +Out L M N P L M N P R T -In -Out R T Bottom View Signal Name +In –In TM RSV PC +Out –Out Designation A1-E1, A2-E2 L1-T1, L2-T2 H1, H2 J1, J2 K1, K2 A3-D3, A4-D4, J3-M3, J4-M4 E3-H3, E4-H4, N3-T3, N4-T4 V•I CHIP CORP. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200 v i c o r p o w e r. c o m Rev. 1.9 4/2011 Page 2 of 18 PRELIMINARY DATASHEET BCM384 x 480 T 325A00 1.0 ELECTRICAL CHARACTERISTICS Specifications apply over all line and load conditions unless otherwise noted; Boldface specifications apply over the temperature range of -40°C < TJ < 125°C (T-Grade); All other specifications are at TJ = 25ºC unless otherwise noted ATTRIBUTE Voltage range dV/dt Quiescent power No load power dissipation Inrush current peak DC input current K factor SYMBOL VIN dVIN /dt PQ PNL IINR_P IIN_DC K POUT POUT_P VOUT IOUT η η η ROUT ROUT ROUT COUT FSW FSW_RP VOUT_PP TON1 VIN = 384 VDC; See Figure 14 VIN = 360 – 400 VDC; See Figure 14 VIN = 384 VDC Average POUT < = 325 W, Tpeak < 5 ms Section 3.0 No load Pout < = 325 W VIN = 384 V, POUT = 325 W VIN = 360 V to 400 V, POUT = 325 W VIN = 384 V, TJ = 100° C,POUT = 325 W 60 W < POUT < 325 W Max TJ = 25° C TJ = 125° C TJ = -40° C CONDITIONS / NOTES MIN 360 PC connected to -IN VIN = 384 V VIN = 360 to 400 V VIN = 400 V COUT = 100 µF, POUT = 325 W POUT = 325 W TYP 384 395 6.5 2 MAX 400 1 410 10 13.5 4 1 1/8 325 300 495 45 94.2 94.2 94 90 100 150 60 1.66 3.33 COUT = 0 µF, POUT = 325 W, VIN = 384 V, Section 8.0 VIN = 384 V, CPC = 0; See Figure 16 170 235 130 1.75 3.5 160 460 540 200 270 180 100 1.83 3.66 400 620 95.5 95 50 7.05 W W V A % % % mΩ mΩ mΩ uF MHz MHz mV ms UNIT Vdc V/µs mW W A A () VOUT VIN Output power (average) Output power (peak) Output voltage Output current (average) Efficiency (ambient) Efficiency (hot) Minimum efficiency (over load range) Output resistance (ambient) Output resistance (hot) Output resistance (cold) Load capacitance Switching frequency Ripple frequency Output voltage ripple VIN to VOUT (application of VIN ) PC PC voltage (operating) PC voltage (enable) PC voltage (disable) PC source current (start up) PC source current (operating) PC internal resistance PC capacitance (internal) PC capacitance (external) External PC resistance PC external toggle rate PC to VOUT with PC released PC to VOUT, disable PC VPC VPC_EN VPC_DIS IPC_EN IPC_OP RPC_SNK CPC_INT CPC_EXT RPC FPC_TOG Ton2 TPC_DIS 4.7 2 50 2 50 5 2.5 100 3.5 150 Internal pull down resistor Section 5.0 External capacitance delays PC enable time Connected to –VIN VIN = 384 V, pre-applied CPC = 0, COUT = 0; See Figure 16 VIN = 384 V, pre-applied CPC = 0, COUT = 0; See Figure 16 5.3 3 1.95 300 5 400 1000 1000 1 50 50 100 4 150 10 V V V uA mA kΩ pF pF kΩ Hz µs µs V•I CHIP CORP. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200 v i c o r p o w e r. c o m Rev. 1.9 4/2011 Page 3 of 18 PRELIMINARY DATASHEET BCM384 x 480 T 325A00 1.0 ELECTRICAL CHARACTERISTICS (CONT.) Specifications apply over all line and load conditions unless otherwise noted; Boldface specifications apply over the temperature range of -40°C < TJ < 125°C (T-Grade); All other specifications are at TJ = 25ºC unless otherwise noted ATTRIBUTE TM TM accuracy TM gain TM source current TM internal resistance External TM capacitance TM voltage ripple PROTECTION Negative going OVLO Positive going OVLO Negative going UVLO Positive going UVLO Output overcurrent trip Short circuit protection trip current Short circuit protection response time Thermal shutdown junction setpoint GENERAL SPECIFICATION Isolation voltage (hi-pot) Working voltage (IN – OUT) Isolation capacitance Isolation resistance MTBF Agency approvals /standards SYMBOL CONDITIONS / NOTES MIN TYP MAX UNIT ACTM ATM ITM RTM_SNK CTM VTM_PP -5 10 100 25 CTM = 0µF, VIN = 400 V, POUT = 325 W 200 40 400 +5 50 50 500 ºC mV/°C uA kΩ pF mV VIN_OVLOVIN_OVLO+ VIN_UVLOVIN_UVLO+ IOCP ISCP TSCP TJ_OTP VIN = 384 V, 25°C 400 420 270 290 9 14 420 430 285 310 11 430 440 304 330 14 V V V V A A 1.2 125 130 135 us °C VHIPOT VWORKING CIN_OUT RIN_OUT 4242 Unpowered unit MIL HDBK 217F, 25° C, GB cTUVus CE Mark ROHS 6 of 6 500 10 660 4.2 500 800 V V pF MΩ Mhrs V•I CHIP CORP. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200 v i c o r p o w e r. c o m Rev. 1.9 4/2011 Page 4 of 18 PRELIMINARY DATASHEET BCM384 x 480 T 325A00 1.1 APPLICATION CHARACTERISTICS All specifications are at TJ = 25ºC unless otherwise noted. See associated figures for general trend data. ATTRIBUTE No load power Inrush current peak Efficiency (ambient) Efficiency (hot – 100°C) Output resistance (-40°C) Output resistance (25°C) Output resistance (100°C) Output voltage ripple VOUT transient (positive) VOUT transient (negative) Undervoltage lockout response time constant Output overcurrent response time constant Overvoltage lockout response time constant TM voltage (ambient) SYMBOL PNL INR_P η η ROUT ROUT ROUT VOUT_PP VOUT_TRAN+ VOUT_TRANTUVLO TOCP TOVLO VTM_AMB TJ ≅ 27°C 9 < IOCP < 14 A CONDITIONS / NOTES VIN = 384 V, PC enabled; See Figure 1 COUT = 100 µF, POUT = 325 W VIN = 384 V, POUT = 325 W VIN = 384 V, POUT = 325 W VIN = 384 V VIN = 384 V VIN = 384 V COUT = 0 uF, POUT = 325 W @ VIN = 384, VIN = 384 V IOUT_STEP = 0 TO 7.07 A, ISLEW >10 A /us; See Figure 11 IOUT_STEP = 7.07 A to 0 A, ISLEW > 10 A /us; See Figure 12 TYP 6.5 2 95.5 95 130 170 235 160 1.5 1.5 150 5 120 3 UNIT W A % % mΩ mΩ mΩ mV mV mV µs ms µs V V•I CHIP CORP. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200 v i c o r p o w e r. c o m Rev. 1.9 4/2011 Page 5 of 18 PRELIMINARY DATASHEET BCM384 x 480 T 325A00 No Load Power Dissipation vs Line No Load Power Dissipation (W) 14 12 97 96.5 Full Load Efficiency vs Temperature Efficiency (%) 360 365 370 375 -40 10 8 6 4 2 0 355 380 385 25 96 95.5 95 94.5 390 100 395 400 405 Input Voltage TCASE: 94 -60 -40 -20 VIN : 0 360 20 40 384 60 400 80 100 120 Case Temperature (ºC) Figure 1 — No load power dissipation vs. VIN ; TCASE Figure 2 — Full load efficiency vs. temperature; VIN Efficiency & Power Dissipation -40°C Case 95 90 Efficiency & Power Dissipation 25ºC Case 21 98 Power Dissipation (W) 19 17 94 Efficiency (%) Efficiency (%) 85 80 75 70 65 60 0 1 2 3 4 5 6 7 92 90 88 86 84 82 80 0 360 η PD 15 13 1 1 PD 15 13 11 9 8 9 7 1 2 384 3 4 400 5 360 6 7 384 8 5 Output Load (A) VIN : 400 Output Load (A) VIN : 360 384 400 360 384 400 Figure 3 — Efficiency and power dissipation at -40°C (case); VIN Figure 4 — Efficiency and power dissipation at 25°C (case); VIN Efficiency & Power Dissipation 100ºC Case 98 96 20 Rout vs Case Temperature 240 18 16 14 Power Dissipation (W) Efficiency (%) 94 92 90 88 86 84 82 80 0 1 η PD 220 Rout (mohm) 200 180 160 140 120 100 -60 -40 -20 I OUT: 0 20 40 60 80 100 120 12 10 8 6 2 3 4 5 6 7 8 4 Output Load (A) VIN : 360 384 400 360 384 400 Temperature (ºC) 0.7 7.05 Figure 5 — Efficiency and power dissipation at 100°C (case); VIN Figure 6 — ROUT vs. temperature vs. IOUT V•I CHIP CORP. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200 v i c o r p o w e r. c o m Rev. 1.9 4/2011 Page 6 of 18 Power Dissipation (W) η 96 17 PRELIMINARY DATASHEET BCM384 x 480 T 325A00 Output Voltage Ripple at 25ºC vs. Iout 180 160 140 120 100 80 60 40 20 0 0 1 2 3 4 5 6 7 8 Vripple (mV) Iout (A) Figure 7 — Vripple vs. IOUT ; 384 VIN , no external capacitance Figure 8 — PC to VOUT start up waveform Figure 9 — VIN to VOUT start up waveform Figure 10 — Output voltage and input current ripple, 384 VIN, 325 W no COUT Figure 11 — Positive load transient (0 – 7.07 A) Figure 12 — Negative load transient (7.07 A – 0 A) V•I CHIP CORP. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200 v i c o r p o w e r. c o m Rev. 1.9 4/2011 Page 7 of 18 PRELIMINARY DATASHEET BCM384 x 480 T 325A00 Safe Operating Area 600 Output Power (W) 500 400 300 200 100 0 43.85 44.85 45.85 46.85 47.85 48.85 49.85 50.85 Output Voltage (V) Steady State 5mS 325W Ave Figure 13 — PC disable waveform, 384 VIN , 100 µF COUT full load Figure 14 — Safe Operating Area vs. VOUT 2.0 PACKAGE/MECHANICAL SPECIFICATIONS All specifications are at TJ = 25ºC unless otherwise noted. See associated figures for general trend data. ATTRIBUTE Length Width Height Volume Footprint Power density Weight Lead finish Operating temperature Storage temperature Thermal capacity Peak compressive force applied to case (Z-axis) ESD rating Peak temperature during reflow Peak time above 183°C Peak heating rate during reflow Peak cooling rate post reflow Thermal impedance [a] [b] SYMBOL L W H Vol F PD W CONDITIONS / NOTES MIN 32.4 / 1.27 21.7 / 0.85 6.48 / 0.255 TYP 32.5 / 1.28 22.0 / 0.87 6.73 / 0.265 4.81 / 0.295 7.3 / 1.1 1100 68 0.5/14 MAX 32.6 / 1.29 22.3 / 0.89 6.98 / 0.275 UNIT mm/in mm/in mm/in cm3/in3 cm2/in2 W/in3 W/cm3 oz/g µm No heat sink No heat sink No heat sink Nickel (0.51-2.03 µm) Palladium (0.02-0.15 µm) Gold (0.003-0.05 µm) TJ TST No J-lead support ESDHBM ESDMM Human Body Model Machine Model[b] MSL 5 MSL 6 [a] -40 -40 9 5 1500 400 125 125 6 °C °C Ws/°C lbs VDC ØJC Min board heat sinking 1.5 1.5 1.1 225 245 150 3 6 1.5 °C °C s °C/s °C/s °CW JEDEC JESD 22-A114C.01 JEDED JESD 22-A115-A V•I CHIP CORP. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200 v i c o r p o w e r. c o m Rev. 1.9 4/2011 Page 8 of 18 PRELIMINARY DATASHEET BCM384 x 480 T 325A00 2.1 J-LEAD PACKAGE MECHANICAL DRAWING & RECOMMENDED LAND PATTERN TOP VIEW ( COMPONENT SIDE ) BOTTOM VIEW RECOMMENDED LAND PATTERN ( COMPONENT SIDE SH OWN ) NOTES: mm 2. DIMENSIONS ARE inch . UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE: 3. .X / [.XX] = +/-0.25 / [.01]; .XX / [.XXX] = +/-0.13 / [.005] 4. PRODUCT MARKING ON TOP SURFACE DXF and PDF files are available on vicorpower.com V•I CHIP CORP. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200 v i c o r p o w e r. c o m Rev. 1.9 4/2011 Page 9 of 18 PRELIMINARY DATASHEET BCM384 x 480 T 325A00 2.2.1 THROUGH-HOLE PACKAGE MECHANICAL DRAWING Click here to view original mechanical drawings on the Vicor website. mm (inch) TOP VIEW ( COMPONENT SIDE ) NOTES: (mm) 1. DIMENSIONS ARE inch . 2. UNLESS OTHERWISE SPECIFIED TOLERANCES ARE: X.X [X.XX] = ±0.25 [0.01]; X.XX [X.XXX] = ±0.13 [0.005] 3. RoHS COMPLIANT PER CST-0001 LATEST REVISION DXF and PDF files are available on vicorpower.com BOTTOM VIEW 2.2.2 THROUGH-HOLE PACKAGE RECOMMENDED LAND PATTERN NOTES: (mm) 1. DIMENSIONS ARE inch . 2. UNLESS OTHERWISE SPECIFIED TOLERANCES ARE: X.X [X.XX] = ±0.25 [0.01]; X.XX [X.XXX] = ±0.13 [0.005] 3. RoHS COMPLIANT PER CST-0001 LATEST REVISION DXF and PDF files are available on vicorpower.com RECOMMENDED HOLE PATTERN ( COMPONENT SIDE SHOWN ) V•I CHIP CORP. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200 v i c o r p o w e r. c o m Rev. 1.9 4/2011 Page 10 of 18 PRELIMINARY DATASHEET BCM384 x 480 T 325A00 2.3 RECOMMENDED HEAT SINK PUSH PIN LOCATION RECOMMENDED LAND PATTERN (NO GROUNDING CLIPS) TOP SIDE SHOWN NOTES: 1. MAINTAIN 3.50 [0.138] DIA. KEEP-OUT ZONE FREE OF COPPER, ALL PCB LAYERS. 2. (A) MINIMUM RECOMMENDED PITCH IS 39.50 [1.555], THIS PROVIDES 7.00 [0.275] COMPONENT EDGE-TO-EDGE SPACING, AND 0.50 [0.020] CLEARANCE BETWEEN VICOR HEAT SINKS. (B) MINIMUM RECOMMENDED PITCH IS 41.00 [1.614], THIS PROVIDES 8.50 [0.334] COMPONENT EDGE-TO-EDGE SPACING, AND 2.00 [0.079] CLEARANCE BETWEEN VICOR HEAT SINKS. 3. V•I CHIP™ MODULE LAND PATTERN SHOWN FOR REFERENCE ONLY; ACTUAL LAND PATTERN MAY DIFFER. DIMENSIONS FROM EDGES OF LAND PATTERN TO PUSH-PIN HOLES WILL BE THE SAME FOR ALL FULL SIZE V•ICHIP PRODUCTS. 4. RoHS COMPLIANT PER CST-0001 LATEST REVISION. 5. UNLESS OTHERWISE SPECIFIED: DIMENSIONS ARE MM [INCH]. TOLERANCES ARE: X.X [X.XX] = ±0.3 [0.01] X.XX [X.XXX] = ±0.13 [0.005] 6. PLATED THROUGH HOLES FOR GROUNDING CLIPS (33855) SHOWN FOR REFERENCE. HEAT SINK ORIENTATION AND DEVICE PITCH WILL DICTATE FINAL GROUNDING SOLUTION. RECOMMENDED LAND PATTERN (With GROUNDING CLIPS) TOP SIDE SHOWN V•I CHIP CORP. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200 v i c o r p o w e r. c o m Rev. 1.9 4/2011 Page 11 of 18 PRELIMINARY DATASHEET BCM384 x 480 T 325A00 3.0 POWER, VOLTAGE, EFFICIENCY RELATIONSHIPS Because of the high frequency, fully resonant SAC topology, power dissipation and overall conversion efficiency of bus converters can be estimated as shown below. Key relationships to be considered are the following: 1. Transfer Function a. No load condition VOUT = VIN • K Eq. 1 Figure 15 — Power transfer diagram P R OUT P NL INPUT POWER OUTPUT POWER Where K (transformer turns ratio) is constant for each part number b. Loaded condition VOUT = Vin • K – IOUT • ROUT Eq. 2 2. Dissipated Power The two main terms of power losses in the BCM™ bus converter are: - No load power dissipation (PNL) defined as the power used to power up the module with an enabled power train at no load. - Resistive loss (ROUT) refers to the power loss across the bus converter modeled as pure resistive impedance. ~ PDISSIPATED ~ PNL + PROUT Eq. 3 Therefore, with reference to the diagram shown in Figure 15 POUT = PIN – PDISSIPATED = PIN – PNL – PROUT Eq. 4 Notice that ROUT is temperature and input voltage dependent and PNL is temperature dependent (See Figure 15). The above relations can be combined to calculate the overall module efficiency: η= POUT PIN = PIN – PNL – PROUT PIN = VIN • IIN – PNL – (IOUT)2 • ROUT VIN • IIN =1– ( PNL + (IOUT)2 • ROUT VIN • IIN ) Eq. 5 V•I CHIP CORP. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200 v i c o r p o w e r. c o m Rev. 1.9 4/2011 Page 12 of 18 4.0 OPERATING VOVLO+ VOVLO– 1 2 3 5 4 6 Figure 16 — Timing diagram v i c o r p o w e r. c o m C B VIN NL VUVLO+ VUVLO– PC 5V 3V 3V 5V 2.5 V C 500mS before retrial Vout G D A E F LL • K IOUT ISSP IOCP H PRELIMINARY DATASHEET TM 3 V @ 27°C V•I CHIP CORP. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200 0.4 V Notes: A: TON1 B: TOVLO* C: Max recovery time D:TUVLO E: TON2 F: TOCP G: TPC–DIS H: TSSP** 1: Controller start 2: Controller turn off 3: PC release 4: PC pulled low 5: PC released on output SC 6: SC removed – Timing and voltage is not to scale – Error pulse width is load dependent *Min value switching off **From detection of error to power train shutdown BCM384 x 480 T 325A00 Page 13 of 18 Rev. 1.9 4/2011 PRELIMINARY DATASHEET BCM384 x 480 T 325A00 5.0 USING THE CONTROL SIGNALS TM AND PC The PC control pin can be used to accomplish the following functions: • Delayed start: At startup, PC pin will source a constant 100 uA current to the internal RC network. Adding an external capacitor will allow further delay in reaching the 2.5 V threshold for module start. • Synchronized start up: In a parallel module array, PC pins shall be connected in order to ensure synchronous start of all the units. While every controller has a calibrated 2.5 V reference on PC comparator, many factors might cause different timing in turning on the 100 uA current source on each module, i.e.: – Different VIN slew rate – Statistical component value distribution By connecting all PC pins, the charging transient will be shared and all the modules will be enabled synchronously. • Auxiliary voltage source: Once enabled in regular operational conditions (no fault), each BCM™ bus converter PC provides a regulated 5 V, 2 mA voltage source. • Output Disable: PC pin can be actively pulled down in order to disable module operations. Pull down impedance shall be lower than 400 Ω and toggle rate lower than 1 Hz. • Fault detection flag: The PC 5 V voltage source is internally turned off as soon as a fault is detected. After a minimum disable time, the module tries to re-start, and PC voltage is re-enabled. For system monitoring purposes (microcontroller interface) faults are detected on falling edges of PC signal. It is important to notice that PC doesn’t have current sink capability (only 150 kΩ typical pull down is present), therefore, in an array, PC line will not be capable of disabling all the modules if a fault occurs on one of them. The temperature monitor (TM) pin provides a voltage proportional to the absolute temperature of the converter control IC. It can be used to accomplish the following functions: • Monitor the control IC temperature: The temperature in Kelvin is equal to the voltage on the TM pin scaled by x100. (i.e. 3.0 V = 300 K = 27ºC). It is important to remember that V•I Chip™ products are multi-chip modules, whose temperature distribution greatly vary for each part number as well with input/output conditions, thermal management and environmental conditions. Therefore, TM cannot be used to thermally protect the system. • Fault detection flag: The TM voltage source is internally turned off as soon as a fault is detected. After a minimum disable time, the module tries to re-start, and TM voltage is re-enabled. 6.0 FUSE SELECTION V•I Chip™ products are not internally fused in order to provide flexibility in configuring power systems. Input line fusing of V•I Chip modules is recommended at system level, in order to provide thermal protection in case of catastrophic failure. The fuse shall be selected by closely matching system requirements with the following characteristics: • Current rating (usually greater than maximum bus converter current) • Maximum voltage rating (usually greater than the maximum possible input voltage) • Ambient temperature • Nominal melting I2t • Recommended fuse: ≤2.5 A Bussmann PC-Tron or SOC type 36CFA. V•I CHIP CORP. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200 v i c o r p o w e r. c o m Rev. 1.9 4/2011 Page 14 of 18 PRELIMINARY DATASHEET BCM384 x 480 T 325A00 7.0 CURRENT SHARING The SAC topology bases its performance on efficient transfer of energy through a transformer, without the need of closed loop control. For this reason, the transfer characteristic can be approximated by an ideal transformer with some resistive drop and positive temperature coefficient. This type of characteristic is close to the impedance characteristic of a DC power distribution system, both in behavior (AC dynamic) and absolute value (DC dynamic). When connected in an array (with same K factor), the BCM™ module will inherently share the load current with parallel units, according to the equivalent impedance divider that the system implements from the power source to the point of load. It is important to notice that, when successfully started, BCM™ bus converter modules are capable of bidirectional operations (reverse power transfer is enabled if the module input falls within its operating range and the bus conveter is otherwise enabled). In parallel arrays, because of the resistive behavior, circulating currents are never experienced (energy conservation law). General recommendations to achieve matched array impedances are (see also AN016 for further details): • to dedicate common copper planes within the PCB to deliver and return the current to the modules • to make the PCB layout as symmetric as possible • to apply same input/output filters (if present) to each unit Figure 17 — BCM™ module array V•I CHIP CORP. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200 v i c o r p o w e r. c o m Rev. 1.9 4/2011 Page 15 of 18 PRELIMINARY DATASHEET BCM384 x 480 T 325A00 8.0 INPUT AND OUTPUT FILTER DESIGN A major advantage of SAC™ systems versus conventional PWM converters is that the transformers do not require large functional filters. The resonant LC tank, operated at extreme high frequency, is amplitude modulated as a function of input voltage and output current, and efficiently transfers charge through the isolation transformer. A small amount of capacitance, embedded in the input and output stages of the module, is sufficient for full functionality and is key to achieve power density. This paradigm shift requires system design to carefully evaluate external filters in order to: 1. Guarantee low source impedance: To take full advantage of the BCM™ bus conveter dynamic response, the impedance presented to its input terminals must be low from DC to approximately 5 MHz. The connection of the module to its power source should be implemented with minimal distribution inductance. If the interconnect inductance exceeds 100 nH, the input should be bypassed with a RC damper to retain low source impedance and stable operation. With an interconnect inductance of 200 nH, the RC damper may be as high as 1 µF in series with 0.3 Ω. A single electrolytic or equivalent low-Q capacitor may be used in place of the series RC bypass. 2. Further reduce input and/or output voltage ripple without sacrificing dynamic response: Given the wide bandwidth of the bus converter, the source response is generally the limiting factor in the overall system response. Anomalies in the response of the source will appear at the output of the module multiplied by its K factor. This is illustrated in Figures 11 and 12. 3. Protect the module from overvoltage transients imposed by the system that would exceed maximum ratings and cause failures: The V•I Chip™ module input/output voltage ranges shall not be exceeded. An internal overvoltage lockout function prevents operation outside of the normal operating input range. Even during this condition, the powertrain is exposed to the applied voltage and power MOSFETs must withstand it. A criterion for protection is the maximum amount of energy that the input or output switches can tolerate if avalanched. Total load capacitance at the output of the bus converter shall not exceed the specified maximum. Owing to the wide bandwidth and low output impedance of the module, low frequency bypass capacitance and significant energy storage may be more densely and efficiently provided by adding capacitance at the input of the module. At frequencies