End of Life
IBC Module
IB0xE096T48xx-xx
®
S
US
C
C
NRTL
US
5:1 Intermediate Bus Converter Module: Up to 500W Output
Features & Benefits
Size:
2.30 x 0.9 x 0.38in
58.4 x 22.9 x 9.5mm
• Input: 36 – 60VDC
(38 – 55VDC for IB048x)
• Low profile: 0.38” height above
board
• Output: 9.6VDC at 48VIN
• Industry standard 1/8 Brick pinout
• Output current up to 48A
• Sine Amplitude Converter™ (SAC™)
• Output power: up to 500W *
• Low noise 1MHz ZVS/ZCS
• 2250VDC isolation
(1500VDC isolation for IB048x)
• 98% peak efficiency
Typical Applications
* For lower power applications, see 300W model IB0xxE096T40xx-xx
• Enterprise networks
• Optical access networks
Product Description
• Storage networks
The Intermediate Bus Converter (IBC) Module is a very efficient, low profile,
isolated, fixed ratio converter for power system applications in enterprise and
optical access networks.
Rated at up to 345W from 36VIN and up to 500W from 54 to 55VIN, the IBC conforms
to an industry standard eighth-brick footprint. Its leading efficiency enables full
load operation at 55°C with only 200LFM airflow. Its small cross section facilitates
unimpeded airflow — above and below its thin body — to minimize the temperature
rise of downstream components.
• Automated test equipment
Part Ordering Information
Product
Function
I
B
Input
Voltage
0
x
IB = Intermediate
Bus Converter
048 = 38 – 55VDC
050 = 36 – 60VDC
054 = 36 – 60VDC *
Output Voltage
(Nom.) x 10
Package
x
E
0
E = Eighth Brick
Format
9
Temperature
Grade
6
T
Output
Current
4
T = -40ºC ≤ TOPERATING ≤ +100ºC
-40ºC ≤ TSTORAGE ≤ +125ºC
096 = (VOUT nominal @ VIN = 48VDC x 10
(5:1 transfer ratio)
Rev 1.1
09/2016
Pin Length
x
x
N = Negative
P = Positive
48 = Max Rated Output Current
* Operating transient to 75VDC
IBC Module
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8
Enable
Logic
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Options
–
x
x
00 = Open frame
1 = 0.145”
2 = 0.210”
3 = 0.180”
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IB0xxE096T48xx-xx
Absolute Maximum Ratings
The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause permanent damage to the device.
Parameter
Comments
Input voltage (+IN to –IN)
See Input Range Specific Characteristics for details
Min
Max
Unit
-0.5
75
VDC
5
V / µs
-0.5
20
VDC
-0.5
(see note)
VDC
48
A
Input voltage slew rate
EN to –IN
Output voltage (+OUT to –OUT)
See OVP setpoint max
Output current
POUT ≤ 300W
Dielectric withstand (input to output)
1min
2250
1500 for IB048x
VDC
Temperature
Operating junction
Hottest semiconductor
Storage
-40
125
-55
125
ºC
Electrical Specifications
Specifications valid at 48VIN, 100% rated load and 25ºC ambient, unless otherwise indicated.
Attribute
Symbol
Conditions / Notes
Min
Typ
Max
Unit
38
48
55
VDC
75
VDC
0.003
5
V / µs
Turn–on
31
36
VDC
Turn–off
29
34
VDC
Turn–on / turn–off hysteresis
2
Input Range Specific Characteristics
Part Number IB048E096T48xx-xx
Operating input voltage
Non-operating input surge withstand
< 100ms
Operating input dV / dt
Undervoltage protection
VDC
Time constant
Undervoltage blanking time
UV blanking time is enabled after start up
50
100
7
µs
200
µs
Overvoltage protection
Turn–off
60
64
VDC
Turn–on
55
64
VDC
4
µs
Time constant
DC output voltage band
No load, over VIN range
7.6
Output OVP set point
Module will shut down
12.0
Dielctric withstand
Input to output; 1min
1500
Insulation resistance
Input to output
IBC Module
Page 2 of 17
Rev 1.1
09/2016
9.6
VDC
VDC
VDC
30
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11.0
12.8
MΩ
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IB0xxE096T48xx-xx
Electrical Specifications (Cont.)
Specifications valid at 48VIN, 100% rated load and 25ºC ambient, unless otherwise indicated.
Attribute
Symbol
Conditions / Notes
Min
Typ
Max
Unit
36
48
60
VDC
Input Range Specific Characteristics
Part Number IB050E096T48xx-xx
Operating input voltage
Non-operating input surge withstand
< 100ms
75
VDC
0.003
5
V / µs
Turn–on
31
36
VDC
Turn–off
29
34
VDC
Turn–on / turn–off hysteresis
2
Operating input dV / dt
Undervoltage protection
VDC
Time constant
Undervoltage blanking time
UV blanking time is enabled after start up
50
100
7
µs
200
µs
Overvoltage protection
Turn–off
65
69
VDC
Turn–on
60
69
VDC
4
µs
12.0
VDC
13.8
VDC
Time constant
DC output voltage band
No load, over VIN range
7.2
Output OVP set point
Module will shut down
13
Dielctric withstand
Input to output; 1min
2250
Insulation resistance
Input to output
9.6
VDC
30
MΩ
Part Number IB054E096T48xx-xx
Operating input voltage
60
VDC
75
VDC
0.003
5
V / µs
Turn–on
31
36
VDC
Turn–off
29
34
VDC
Turn–on / turn–off hysteresis
2
Non-operating input surge withstand
36
48
< 100ms
Operating input dV / dt
Undervoltage protection
VDC
Time constant
Undervoltage blanking time
UV blanking time is enabled after start up
50
100
7
µs
200
µs
Overvoltage protection
Turn–off
76
79.5
VDC
Turn–on
75
78
VDC
4
µs
12.0
VDC
15.9
VDC
Time constant
DC output voltage band
No load, over VIN range
7.2
Output OVP set point
Module will shut down
15.2
Dielctric withstand
Input to output; 1min
2250
Insulation resistance
Input to output
IBC Module
Page 3 of 17
Rev 1.1
09/2016
9.6
VDC
30
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IB0xxE096T48xx-xx
Electrical Specifications (Cont.)
Specifications valid at 48VIN, 100% rated load and 25ºC ambient, unless otherwise indicated.
Attribute
Symbol
Conditions / Notes
Min
Typ
Max
Unit
20
25
30
ms
Common Input Specifications
Turn ON delay
Start-up inhibit
VIN reaching turn-on voltage to enable
function operational, see Figure 7
Turn-on delay
Enable to 10% VOUT; pre-applied VIN,
0 load capacitance, see Figure 8
50
µs
Output voltage rise time
From 10% to 90% VOUT, 10% load,
0 load capacitance
50
µs
Restart turn-on delay
See page 14 for restart after EN pin disable
250
ms
1.9
2.5
W
0.18
No load power dissipation
Enabled
0.21
W
Input current
Disabled
Low line, full load
9.8
A
Inrush current overshoot
Using test circuit in Figure 21, 15% load, high line
9.8
A
Input reflected ripple current
At max power;
Using test circuit in Figure 22; see Figure 6
500
mArms
Peak short circuit input current
40
A
Repetitive short circuit peak current
25
A
Internal input capacitance
8.8
µF
Internal input inductance
5
nH
Recommended external
input capacitance
IBC Module
Page 4 of 17
200nH maximum source inductance
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09/2016
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47
470
µF
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IB0xxE096T48xx-xx
Electrical Specifications (Cont.)
Specifications valid at 48VIN, 100% rated load and 25ºC ambient, unless otherwise indicated.
Attribute
Symbol
Conditions / Notes
Min
Typ
Max
Unit
500
W
Common Output Specifications
Output power *
0
Output current
P ≤ 500W
48
A
Output start up load
of IOUT max, maximum output capacitance
15
%
Effective output resistance
4.2
Line regulation (K factor)
VOUT = K • VIN @ no load
0.198
Current share accuracy
Full power operation; See Parallel Operation
on page 15; up to 3 units
0.200
mΩ
0.2020
10
%
Efficiency
50% load
See Figure 1
97.5
98.0
%
Full load
See Figure 1
96.9
97.1
%
1.6
nH
Internal output inductance
Internal output capacitance
55
Load capacitance
0
Output voltage ripple
20MHz bandwidth (Figure 16),
using test circuit in Figure 23
Output overload protection
threshold
Of IOUT max, will not shut down when started into max
COUT and 15% load.
Auto restart with duty cycle < 10%
60
105
Overcurrent protection
time constant
Short circuit current response time
Switching frequency
Dynamic response – load
VOUT overshoot / undershoot
VOUT response time
Dynamic response – line
VOUT overshoot
Pre-bias voltage
µF
4500
µF
150
mVp-p
150
%
5
ms
1.5
µs
1.0
Load change: ±25% of IOUT max,
Slew rate (dI/dt) = 1A/µs
See Figures 11–14
100
1
Line step of 5V in 1µs, within VIN operating range.
(CIN = 500µF, CO = 350µF)
(Figure 15 illustrates similar converter response
when subjected to a more severe line transient.)
Unit will start up into a pre-bias voltage on the output
MHz
0
mV
µs
1.25
V
12
VDC
* Does not exceed IPC-9592 derating guidelines. At 70ºC ambient, full power operation may exceed IPC-9592 guidelines, but does not exceed component
ratings, does not activate OTP and does not compromise reliability.
IBC Module
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Electrical Specifications (Cont.)
Specifications valid at 48VIN, 100% rated load and 25ºC ambient, unless otherwise indicated.
Attribute
Symbol
Conditions / Notes
Min
Typ
Max
Unit
Control & Interface Specifications
Enable (negative logic)
Referenced to –IN
Module enable threshold
0.8
Module enable current
VEN = 0.8V
VDC
130
Module disable threshold
Modeule disable current
VEN = 2.4V
Disable hysteresis
500
Enable pin open circuit voltage
2.5
EN to –IN resistance
Open circuit
Enable (positive logic)
200
µA
2.4
VDC
10
µA
mV
3.0
35
VDC
kΩ
Referenced to –IN
Module enable threshold
2.0
2.5
Module disable threshold
EN source current (operating)
VEN = 5V
EN voltage (operating)
3.0
VDC
1.45
VDC
2
mA
4.7
5
5.3
VDC
Min
Typ
Max
Unit
General Characteristics
• Conditions: TCASE = 25ºC, 75% rated load and specified input voltage range unless otherwise specified.
Attribute
Symbol
Conditions / Notes
MTBF
Calculated per Telcordia SR-332, 40°C
Service life
Calculated at 30°C
Overtemperature shut down
TJ ; Converter will reset when overtemperature
condition is removed
1.0
Mhrs
7
Years
125
130
135
ºC
Mechanical
Weight
0.71 / 20.3
oz / g
Length
2.30 / 58.4
in / mm
Width
0.9 / 22.9
in / mm
Height above customer board
0.39 / 9.9
in / mm
Pin solderability
Moisture sensitivity level
Storage life for normal solderability
MSL
Not applicable, for wave soldering only
Clearance to customer board
From lowest component on IBC
Altitude, operating
Derate operating temp 1°C
per 1000 feet above sea level
Relative humidity, operating
Non condensing
RoHS compliance
Compatible with RoHS directive 2002/95/EC
Agency approvals
Years
N/A
0.12 / 3.1
in / mm
-500
10000
Feet
10
90
%
UL/CSA 60950-1
cURus
UL/CSA 60950-1, EN60950-1
cTUVus
Low voltage directive (2006/95/EC)
IBC Module
Page 6 of 17
1
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IB0xxE096T48xx-xx
Electrical Specifications (Cont.)
Specifications valid at 48VIN, 100% rated load and 25ºC ambient, unless otherwise indicated.
Environmental Qualification
• IPC-9592A, based on Class II Category 2 the following detail is applicable.
Test Description
Test Detail
Min. Quanity Tested
Low temp
3
High temp
3
Rapid thermal cycling
3
6 DOF random vibration test
3
Input voltage test
3
Output load test
3
Combined stresses test
3
5.2.4 THB (Temperature Humidity Bias)
(72hr presoak required) 1000hrs – continuous bias
30
5.2.5 HTOB (High Temperature Operating Bias)
Power cycle – On 42 minutes
Off 1 minute, On 1 minute, Off 1 minute, On 1 minute, Off 1 minute,
On 1 minute, Off 1 minute, On 1 minute, Off 10 minutes. Alternating
between maximum and minimum operating voltage every hour.
30
5.2.6 TC (Temperature Cycling)
700 cycles, 30 minute dwell at each extreme – 20C minimum ramp rate
30
5.2.7 PTC (Power & Temperature Cycling)
Reference IPC-9592A
3
Random Vibration – Operating IEC 60068-2-64 (normal operation vibration)
3
Random Vibration Non-operating (transportation) IEC 60068-2-64
3
Shock Operating - normal operation shock IEC 60068-2-27
3
Free fall - IEC 60068-2-32
3
Drop Test 1 full shipping container (box)
1
5.2.3 HALT (Highly Accelerated Life Testing)
5.2.8 – 5.2.13 Shock and Vibration
5.2.14.1 Corrosion Resistance – Not required
5.2.14 Other Environmental Tests
ESD Classification Testing
5.2.14.2 Dust Resistance – Unpotted class II GR-1274-CORE
5.2.14.3 SMT Attachment Reliability IPC-9701 - J-STD-002
3
N/A
5.2.14.4 Through Hole solderability – J-STD-002
5
HBM testing - JESD22-A114
3
138
Total Quantity (estimated)
IBC Module
Page 7 of 17
N/A
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IB0xxE096T48xx-xx
99
99
98
98
97
97
Efficiency (%)
Efficiency (%)
Application Characteristics: Waveforms
96
95
94
93
96
95
94
93
92
92
0
10
VIN:
19
38V
29
IOUT (A)
48V
38
48
55V
0
10
VIN:
19
38V
IOUT (A)
29
48V
38
48
55V
Figure 2 — Efficiency vs. output current, 55ºC ambient
Figure 1 — Efficiency vs. output current, 25ºC ambient
99
Efficiency (%)
98
97
96
95
94
93
92
0
10
VIN:
19
38V
IOUT (A)
29
48V
38
48
55V
Figure 3 — Efficiency vs. output current, 70ºC ambient
Figure 4 — Inrush current at high line 15% load
Figure 5 — Input reflected ripple current at nominal line, full load
Figure 6 — Turn on delay time; VIN turn on delay at nominal line,
15% load; Start-up inhibit time
IBC Module
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Application Characteristics: Waveforms (Cont.)
Figure 7 — Turn on delay time; Enable turn on delay at nominal
line, 15% load.
Figure 8 — Output voltage rise time at nominal line, 10% load
Figure 9 — Overshoot at turn on at nominal line. 15% load
Figure 10 — Undershoot at turn off at nominal line. 15% load
IBC Module
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Application Characteristics: Waveforms (Cont.)
Figure 11 — Load transient response; nominal line
Load step 75–100%
Figure 12 — Load transient response; full load to 75%;
nominal line
Figure 13 — Load transient response, nominal line
Load step 0–25%
Figure 14 — Load transient response; nominal line
Load step 25–0%
Figure 15 — Input transient response;
VIN step low line to high line at full load
Figure 16 — Output ripple; nominal line, full load
IBC Module
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Application Characteristics: Waveforms (Cont.)
Figure 18 — Two modules parallel array test. VOUT and IIN
change when one module is enabled. Nominal VIN,
IOUT = 48A
50
50
45
45
40
40
Output Current (A)
Output Current (A)
Figure 17 — Two modules parallel array test. VOUT and IIN
change when one module is disabled. Nominal VIN,
IOUT = 48A
35
30
25
20
15
10
5
35
30
25
20
15
10
5
0
0
25
35
45
55
65
75
85
95
25
35
Ambient Air Temperature (°C)
200LFM
400LFM
IBC Module
Page 11 of 17
Rev 1.1
09/2016
55
65
75
85
95
Ambient Air Temperature (°C)
600LFM
Figure 19 — Maximum output current derating vs. ambient air
temperature. Transverse airflow. Board and
junction temperatures < 125ºC tested with
IBC evaluation board IB048E096T48N1-CB
45
200LFM
400LFM
600LFM
Figure 20 — Maximum output current derating vs. ambient air
temperature. Longitudinal airflow. Board and
junction temperatures < 125ºC tested with
IBC evaluation board IB048E096T48N1-CB
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Application Characteristics: Waveforms (Cont.)
Current Probe
_
47µF
+OUT
IBC
–IN
Load
Vsource
EN
–OUT
10µH
+
C*
Vsource
_
470µF
Current Probe
+IN
EN
–IN
+OUT
IBC
Load
+IN
+
–OUT
*Maximum load capacitance
Figure 21 — Test circuit; inrush current overshoot
+IN
+OUT
10µF
0.1µF
IBC
–IN
Figure 22 — Test circuit; input reflected ripple current
E – Load
–OUT
Cya
Cyc
Cyb
Cyd
20MHz BW
Cy a-d = 4700pF
Figure 23 — Test circuit; output voltage ripple
IBC Module
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Application Characteristics: Thermal Data
Figure 24 — Thermal plot, 200LFM, 25ºC, 48VIN,
450W output power
Figure 25 — Thermal plot, 200LFM, 25ºC, 48VIN,
450W output power
Figure 26 — Thermal plot, 400LFM, 25ºC, 48VIN,
450W output power
Figure 27 — Thermal plot, 400LFM, 25ºC, 48VIN,
450W output power
Figure 28 — Thermal plot, 600LFM, 25ºC, 48VIN,
450W output power
Figure 29 — Thermal plot, 600LFM, 25ºC, 48VIN,
450W output power
IBC Module
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Pin / Control Functions
+IN / –IN — DC Voltage Input Pins
The IBC input voltage range should not be exceeded. An internal
undervoltage/overvoltage lockout function prevents operation
outside of the normal operating input range. The IBC turns
on within an input voltage window bounded by the “Input
undervoltage turn-on” and “Input overvoltage turn-off” levels, as
specified. The IBC may be protected against accidental application
of a reverse input voltage by the addition of a rectifier in series
with the positive input, or a reverse rectifier in shunt with the
positive input located on the load side of the input fuse.
The connection of the IBC to its power source should be
implemented with minimal distribution inductance. If the
interconnect inductance exceeds 100nH, the input should be
bypassed with a RC damper to retain low source impedance and
stable operation. With an interconnect inductance of 200nH,
the RC damper may be 47μF in series with 0.3Ω. A single
electrolytic or equivalent low-Q capacitor may be used in place
of the series RC bypass.
EN — Enable/Disable
1
5
2 Top View
3
4
Pin Number
Function
1
VIN+
2
Enable
3
VIN-
Negative logic option
If the EN port is left floating, the IBC output is disabled. Once this
port is pulled lower than 0.8VDC with respect to –IN, the output
is enabled. The EN port can be driven by a relay, optocoupler, or
open collector transistor. Refer to Figures 7 and 8 for the typical
enable / disable characteristics. This port should not be toggled
at a rate higher than 1Hz. The EN port should also not be driven
by or pulled up to an external voltage source.
4
VOUT-
5
VOUT+
Positive logic option
If the EN port is left floating, the IBC output is enabled. Once this
port is pulled lower than 1.4VDC with respect to –IN, the output
is disabled. This action can be realized by employing a relay,
optocoupler, or open collector transistor. This port should not be
toggled at a rate higher than 1Hz.
Figure 30 — IBC Pin Designations
The EN port should also not be driven by or pulled up to an
external voltage source. The EN port can source up to 2mA at
5VDC. The EN port should never be used to sink current.
If the IBC is disabled using the EN pin, the module will attempt to
restart approximately every 250ms. Once the module has been
disabled for at least 250ms, the turn on delay after the EN pin is
enabled will be as shown in Figure 7.
+OUT / –OUT — DC Voltage Output Pins
Total load capacitance at the output of the IBC should not exceed
the specified maximum. Owing to the wide bandwidth and low
output impedance of the IBC, low frequency bypass capacitance
and significant energy storage may be more densely and efficiently
provided by adding capacitance at the input of the IBC.
IBC Module
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Applications Note
Input Impedance Recommendations
Parallel Operation
To take full advantage of the IBC capabilities, the impedance
presented to its input terminals must be low from DC to
approximately 5MHz. The source should exhibit low inductance
and should have a critically damped response. If the interconnect
inductance is excessive, the IBC input pins should be bypassed with
an RC damper (e.g., 47μF in series with 0.3Ω) to retain low source
impedance and proper operation. Given the wide bandwidth of
the IBC, the source response is generally the limiting factor in the
overall system response.
The IBC will inherently current share when operated in an array.
Arrays may be used for higher power or redundancy in an
application. Current sharing accuracy is maximized when the source
and load impedance presented to each IBC within an array are
equal. The recommended method to achieve matched impedances
is to dedicate common copper planes within the PCB to deliver
and return the current to the array, rather than rely upon traces of
varying lengths. In typical applications the current being delivered
to the load is larger than that sourced from the input, allowing
narrower traces to be utilized on the input side if necessary. The
use of dedicated power planes is, however, preferable.
One or more IBCs in an array may be disabled without adversely
affecting operation or reliability as long as the load does not
exceed the rated power of the enabled IBCs.
The IBC power train and control architecture allow bi-directional
power transfer, including reverse power processing from the IBC
output to its input. The IBC’s ability to process power in reverse
improves the IBC transient response to an output load dump.
Anomalies in the response of the source will appear at the output
of the IBC multiplied by its K factor. The DC resistance of the
source should be kept as low as possible to minimize voltage
deviations. This is especially important if the IBC is operated near
low or high line as the overvoltage/undervoltage detection circuitry
could be activated.
Input Fuse Recommendations
The IBC is not internally fused in order to provide flexibility in
configuring power systems. However, input line fusing of VI Bricks
must always be incorporated within the power system. A fast
acting fuse should be placed in series with the +IN port.
Thermal Considerations
The temperature distribution of the VI Brick® can vary significantly
with its input / output operating conditions, thermal management
and environmental conditions. Although the PCB is UL rated to
130°C, it is recommended that PCB temperatures be maintained
at or below 125°C. For maximum long term reliability, lower
PCB temperatures are recommended for continuous operation,
however, short periods of operation at 125°C will not negatively
impact performance or reliability.
Application Notes
For IBC and VI Brick application notes on soldering,
thermal management, board layout, and system design
visit www.vicorpower.com.
WARNING: Thermal and voltage hazards. The IBC can operate
with surface temperatures and operating voltages that may be
hazardous to personnel. Ensure that adequate protection is in place
to avoid inadvertent contact.
IBC Module
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2.2
SEE NOTE 2
End of Life
.15
3.8
IB0xxE096T48xx-xx
.15
3.8
Mechanical Drawings
2.300±.010
58.42±.25
.900±.010
22.86±.25
.09
2.2
SEE NOTE 2
.15
3.8
.15
3.8
.45
11.4
SEE NOTE 2
inch
(mm)
1.20
30.6
SEE NOTE 2
.900±.010
22.86±.25
.45
11.4
SEE NOTE 2
.386±.025
9.80±.64
.392±.025
9.95±.64
1.20
30.6
SEE NOTE 2
SEE CHART
TYP
.12
3.1
.093
2.36
(3) PL.
.125
3.18
(2) PL.
.040
1.02
PIN LENGTH CHART
DESIGNATOR
LENGTH
1
.145 [3.68]
2
.210 [5.33]
3
.060
1.52
(2) PL.
(3) PL.
.392±.025
9.95±.64
SEE CHART
TYP
NOTES:
1. RoHS COMPLIANT PER CST-0001 LATEST REVISION.
.180 [4.57]
2.
.093
2.36
REFERENCE
(3) PL.
DIMENSIONS FOR THE ASSEMBLY CENTER OF
.386±.025
9.80±.64
.12
3.1
.125
3.18
GRAVITY.
(2) PL.
.040
1.02
(3) PL.
.060
1.52
(2) PL.
PIN LENGTH CHART
DESIGNATOR
LENGTH
1
.145 [3.68]
2
.210 [5.33]
1. RoHS COMPLIANT PER CST-0001 LATEST REVISION.
3
.180 [4.57]
2. REFERENCE DIMENSIONS FOR THE ASSEMBLY CENTER OF GRAVITY.
NOTES:
Figure 31 — IBC outline drawing
inch
(mm)
2.000±.003
50.80±.08
1
.300±.003
7.62±.08
5
2.000±.003
50.80±.08
2
1
.300±.003
7.62±.08
.300±.0033
7.62±.08
5
Top View
4
2
Top View
.300±.003
7.62±.08
3
.080±.003
2.03±.08
PLATED THRU HOLE
.125±.003
[3.18±.08]
ANNULAR RING
(3) PL.
.080±.003
2.03±.08
PLATED THRU HOLE
.125±.003
[3.18±.08]
ANNULAR RING
(3) PL.
.100±.003
2.54±.08
PLATED THRU HOLE
.180±.003
[4.57±.08]
ANNULAR RING
(2) PL.
.100±.003
2.54±.08
PLATED THRU HOLE
.180±.003
[4.57±.08]
ANNULAR RING
(2) PL.
Figure 32 — IBC PCB recommended hole pattern
IBC Module
Page 16 of 17
Rev 1.1
09/2016
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End of Life
IB0xxE096T48xx-xx
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