Product Change Notice
Notice: #150106 MSL 4 Upgrade
Date: January 6, 2015
To Our Valued Customer:
We appreciate your use of VI Chip products. Our commitment to customer satisfaction is demonstrated by our notification
to you of the following change.
Description:
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The FULL and HALF sized VI Chip packages will be upgraded from MSL 6 (245 °C) & MSL 5 (225 °C) to MSL 4 (245 °C)
by the use of a new mold compound.
For more information on MSL (Moisture Sensitivity Level), please refer to the latest version of IPC-M-109 obtainable
through www.ipc.org
Products Affected:
All VI Chip products in the FULL and HALF size packages.
Schedule / Date codes:
Affected products with a date code of 1528 (July 6, 2015) will have the new mold compound and will be marked on
shipping materials as MSL 4 capable.
Data sheets will be updated on July 6, 2015.
Action Required:
No actions are required.
This improvement may allow for improvements in customer assembly processes.
Contact your local Vicor representative for more information.
Re
Technical Marketing contact:
Ian Mazsa
imazsa@vicr.com
978-749-3247
Vicor, 25 Frontage Road, Andover MA01810,
Tel: (978) 470-2900, FAX: (978) 475-6715
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`
MSL4 Qualification for
Full and Half VI Chip Products
Re
December 1, 2014
Page 1 of 6
Vicor Proprietary and Confidential
Purpose
The Moisture Sensitivity Level (MSL) for Full and Half VI Chips has been improved to
MSL4 for lead free reflow (245°C peak) through the use of a new mold compound
material. The improved package robustness increases floor life to 72 hours for customers.
Mold Compound Physical Comparison
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Section I:
Mold Compound Background
The mold compound satisfies three packaging requirements for VI Chips. First, it
provides encapsulation of the PCB assembly and components. Second, it provides a
dielectric for voltage differences of components, terminations and pads. Third, it
provides a thermal path for heat generated during the operation of the VI Chip. Mold
compound plays a critical role in the MSL performance of VI Chips.
Current Mold Compound
The current mold compound meets all of the packaging requirements, however, it cannot
provide MSL performance better than MSL6 at 245°C for all VI Chip products. Its
structural modulus at room temperature is low giving it low stress and therefore good
electrical performance from the stress sensitive transformer ferrite cores. Its low
structural modulus at elevated temperature and moisture absorption characteristics are
factors that contribute to its limited MSL performance.
The new mold compound also meets all of the packaging requirements and is qualified at
MSL4 245°C. Its structural modulus, adhesion and moisture resistance is higher than the
current mold compound, which is needed to achieve MSL4. The new mold compound
passes all reliability testing after exposure to MSL4 245°C reflow conditioning.
Critical MSL Material Performance Characterization
Re
A more hydrophobic mold compound with excellent adhesion characteristics was needed
to improve MSL performance. Moisture can weaken the interfacial adhesion and increase
overall package stress, resulting in failure such as solder shorting during reflow.
The new mold compound is significantly more hydrophobic than the current material; see
Chart 1 below for moisture uptake comparative data.
Page 2 of 6
Vicor Proprietary and Confidential
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Chart 1: Mold Compound Moisture Uptake Comparison
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Shear strength was evaluated to characterize adhesion to laminate and solder mask over
laminate with the new and the old mold compounds. The new compound has significantly
higher shear strength than the old mold compound on both substrates evaluated, further
supporting the contrast in MSL performance observed between the two materials. See
Chart 2 for comparative shear test data.
Chart 2 Shear Test Data for New and Old Mold Compounds
Page 3 of 6
Vicor Proprietary and Confidential
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The thermal characteristics of the new and old mold compounds were evaluated at
equivalent output power as well as power dissipation. The results for both tests were
comparable, confirming that there was no impact to thermal performance.
Re
Chart 3: Thermal Resistance of New and Old Mold Compound with Constant Output Power
Chart 4: Thermal Resistance of New and Old Mold Compound with Constant Power Dissipation
Page 4 of 6
Vicor Proprietary and Confidential
Section II:
Product Qualification of VI Chip Packages to MSL 4
New Mold Compound Qualification Summary
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The new mold compound was evaluated on models representing designs and physical
materials used in the PRM, VTM, and BCM product families. These products meet the
following reliability test requirements:
• MSL 4 3X245°C reflow conditioning
• 1,000 temperature cycles from -55°C to 125°C
• 1,000 hours at 125°C
• 1,000 hours at -65°C
• 1,000 hours of temperature-humidity bias
Details of MSL 4 Reflow Testing
Re
MSL 4 245°C Qualification Process Steps:
1. Units baked at 125°C for 24 hours.
2. Condition per J-STD-020D.1 using standard soak conditions of 96 hours at
30°C/60% RH.
3. Reflow 3 times using profile per J-STD-020D.1 (See Chart 5 below)
4. Post-stress full functional electrical verification (Final ATE Test Conditions)
Chart 5: MSL Reflow Profile with 245°C Peak
Page 5 of 6
Vicor Proprietary and Confidential
Conclusion
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Based on Vicor’s successful MSL4 245°C reflow testing of the product lines, supporting
reliability testing, and material characterization, all Full and Half VI Chip products have
been qualified to MSL4 245°C with the use of the new mold compound material. Product
electrical performance and reliability are not affected by this material change, allowing
customers to continue to experience very high long-term field performance with Vicor’s
VI Chip products.
Page 6 of 6
Vicor Proprietary and Confidential
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MSL 4 Upgrade to VI Chips
› Products will be upgraded to MSL 4 on July 6, 2015
– Affects HALF and FULL sized VI Chips
› No change to form, fit, or functionality
› Refer to PCN document for details
› Packaging Report available
– Can be shared with customers
› Detailed qualification results available by request
– NDA will be required
1
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AFFECTED MPNs
B048F060M24
B048F060T24
B048F080M24
B048F080T24
B048F080T24A
B048F096T24
B048F120T30
B048F240T30
B048F480T30
B048F480T30A
B048T060T24
B384F120T30
BCM352F440T330A00
BCM384F120T300A00
BCM384F480T325A00
BCM384T480T325A00
BCM48BF040T200A00
BCM48BF060T240A00
BCM48BF096M240A00
BCM48BF120M300A00
BCM48BF120T300A00
BCM48BF240T300A00
BCM48BF480T300A00
BCM48BH120M120A00
BCM48BH120T120A00
BCM48BT120T300A00
BCM48BT480T300A00
MBCM270F338M235A00
MBCM270F450M270A00
MBCM270T338M235A00
MP028F036M12AL
MP028T036M12AL
MV036F030M040
MV036F045M027
MV036F060M020
MV036F120M010
MV036F180M007
MV036F240M005
MV036T045M027
MV036T120M010
MV036T240M005
MV036T360M003
MVTM36BF045M027A00
MVTM36BF120M010A00
MVTM36BF240M005A00
MVTM36BT120M010A00
MVTM36BT240M005A00
P024F048T12AL
P024T048T12AL
P036F048T12AL
P036T048T12AL
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P045F048T17AL
P045F048T32AL
P048F048T12AL
P048F048T24AL
P048T048T12AL
P048T048T24AL
PRM48AF480T400A00
PRM48AH480T200A00
PRM48AT480T400A00
PRM48BF480T400A00
PRM48BF480T500A00
PRM48BH480T200A00
PRM48BH480T250A00
PRM48BT480T500A00
PRM48JF480T500A00
V048F060M040
V048F060T040
V048F060T040A
V048F080T030
V048F096T025
V048F160T015
V048F240T012
V048F320T009
V048F480M006
V048F480T006
V048T060T040
V048T060T040A
V048T080T030A
V048T096T025A
V048T160T015A
V048T240T012
V048T240T012A
V048T320T009
V048T480T006
VIZ0010
VIZ0012
VTD48EH040T025A00
VTD48EH120T010A00
VTM48EF012T130A00
VTM48EF012T130A01
VTM48EF015T115A00
VTM48EF020T080A00
VTM48EF030T070A00
VTM48EF040T050A00
VTM48EF060M040A00
VTM48EF060T040A00
VTM48EF120T025A00
VTM48EF240T012A00
VTM48EF320T009A00
VTM48EF480M006A00
VTM48EF480T006A00
VTM48EH015T050A00
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VTM48EH020T040A00
VTM48EH040T025A00
VTM48EH120M010A00
VTM48EH120T010A00
VTM48ET020T080A00
VTM48ET030T070A00
VTM48ET040T050A00
VTM48ET060T040A00
VTM48ET096T025A00
VTM48ET120T025A00
VTM48ET240T012A00
VTM48ET320T009A00
VTM48ET480T006A00
VTM48FH060M020A00
VTM48FH060T020A00
Last Time Buy Last Ship Date Replacement Part
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Mfr Part No
B048F060M24
B048F060T24
B048F080M24
B048F080T24
B048F080T24A
B048F096T24
B048F120T30
B048F240T30
B048F480T30
B048F480T30A
B048T060T24
B384F120T30
BCM352F440T330A00
BCM384F120T300A00
BCM384F480T325A00
BCM384T480T325A00
BCM48BF040T200A00
BCM48BF060T240A00
BCM48BF096M240A00
BCM48BF120M300A00
BCM48BF120T300A00
BCM48BF240T300A00
BCM48BF480T300A00
BCM48BH120M120A00
BCM48BH120T120A00
BCM48BT120T300A00
BCM48BT480T300A00
MBCM270F338M235A00
MBCM270F450M270A00
MBCM270T338M235A00
MP028F036M12AL
MP028T036M12AL
MV036F030M040
MV036F045M027
MV036F060M020
MV036F120M010
MV036F180M007
MV036F240M005
MV036T045M027
MV036T120M010
MV036T240M005
MV036T360M003
MVTM36BF045M027A00
MVTM36BF120M010A00
MVTM36BF240M005A00
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PcnId
40629
40629
40629
40629
40629
40629
40629
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MVTM36BT120M010A00
MVTM36BT240M005A00
P024F048T12AL
P024T048T12AL
P036F048T12AL
P036T048T12AL
P045F048T17AL
P045F048T32AL
P048F048T12AL
P048F048T24AL
P048T048T12AL
P048T048T24AL
PRM48AF480T400A00
PRM48AH480T200A00
PRM48AT480T400A00
PRM48BF480T400A00
PRM48BF480T500A00
PRM48BH480T200A00
PRM48BH480T250A00
PRM48BT480T500A00
PRM48JF480T500A00
V048F060M040
V048F060T040
V048F060T040A
V048F080T030
V048F096T025
V048F160T015
V048F240T012
V048F320T009
V048F480M006
V048F480T006
V048T060T040
V048T060T040A
V048T080T030A
V048T096T025A
V048T160T015A
V048T240T012
V048T240T012A
V048T320T009
V048T480T006
VIZ0010
VIZ0012
VTD48EH040T025A00
VTD48EH120T010A00
VTM48EF012T130A00
VTM48EF012T130A01
Re
40629
40629
40629
40629
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VTM48EF015T115A00
VTM48EF020T080A00
VTM48EF030T070A00
VTM48EF040T050A00
VTM48EF060M040A00
VTM48EF060T040A00
VTM48EF120T025A00
VTM48EF240T012A00
VTM48EF320T009A00
VTM48EF480M006A00
VTM48EF480T006A00
VTM48EH015T050A00
VTM48EH020T040A00
VTM48EH040T025A00
VTM48EH120M010A00
VTM48EH120T010A00
VTM48ET020T080A00
VTM48ET030T070A00
VTM48ET040T050A00
VTM48ET060T040A00
VTM48ET096T025A00
VTM48ET120T025A00
VTM48ET240T012A00
VTM48ET320T009A00
VTM48ET480T006A00
VTM48FH060M020A00
VTM48FH060T020A00
Re
40629
40629
40629
40629
40629
40629
40629
40629
40629
40629
40629
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