QPI-12-CB1

USER GUIDE | UG:312 QPI-12-CB1-EVAL QPI-12LZ Filter Carrier Board for 48V VI Chip® EMI Evaluation Contents Page Introduction 1 Bill of Materials 2 Board Assembly 3 EMI Bypass Configurations 4 EMI Performance and Test Set Up 4 Ordering Information 7 Introduction The QPI-12-CB1 carrier board is an evaluation board platform designed to demonstrate the EMI capabilities of a QPI-12LZ filter, with any combination of 48V input PRM™ / VTM™ or BCM® evaluation boards. The QPI-12-CB1 board includes a pre-mounted filter along with some additional components necessary to demonstrate the full functionality of the filter, along with mounting areas for VI Chip evaluation boards. This user guide provides basic instructions for assembly and use of the board. Further information on the functionality of the VI Chip boards, as well as the QPI-12LZ can be found in the VI Chip Evaluation Board user guide as well as the VI Chip and QPI-12LZ data sheets. QPI-12LZ Product Description The QPI-12LZ EMI filter is specifically designed to attenuate conducted common-mode (CM) and differential-mode (DM) noise of Vicor VI Chip products to comply with the CISPR22 standard requirements for conducted noise measurements. The filter is designed to operate up to 80VDC continuous, with a 100VDC surge for 100ms, and supports 7A loads up to 60°C without derating. Designed for the telecom bus range, the VI Chip EMI Filter supports the PICMG® 3.0 specification for filtering system boards to the EN55022 Class B limits. Figure 1 QPI-12-CB1 carrier board featuring the QPI-12LZ EMI filter UG:312 Page 1 Figure 2 QPI-12-CB1 board overview Bill of Materials Reference Designator Description QPI QPI-12LZ SiP CI Capacitor, electrolytic, 47µF, 100V C2 Capacitor, ceramic, 2.2µF, 100V CY5 – CY10 Capacitor, X7R ceramic, 4.7nF, 1,000V Hardware Machine screw, pan head, 0.373in, 1/2in long, #10-24 thread Hardware Machine nut, hex, 3/8in, #10-24 thread CY1 – CY4 Optional Y-Cap configuration (not populated) Figure 3 QPI-12-CB1 carrier board schematic 1 VTM_IN+ 2 JBCM+ 3 1 VTM_OUT+ As noted above: CY1 thru CY4 not populated. 2 C1 47µF VIN– VIN– VIN–A JVIN– Shield 1 8 BUS+ 9 BUS+ EMI+ 7 EMI+ 6 10 BUS– 1 BUS– EMI– 5 EMI– 4 SHIELD C2 2.2µF +IN Shield 1 2 3 4 –IN CY5 4.7nF 2 CY8 4.7nF Carrier QPI-12LZ SHIELD VIN+ VIN+ CY7 4.7nF 4.7nF 2 VIN+A JVOUT+ 3 VTM_IN+ CY3 1 3 JVIN+ 2 CY6 4.7nF PRM+ VTM_IN+ 5 BCM+ VTM_OUT+ 6 VTM_OUT– 7 BCM– PRM– VTM_IN– CY1 4.7nF CY2 4.7nF 8 CY9 4.7nF CY4 4.7nF VTM_OUT+ VOUT+ VOUT– VTM_OUT– CY10 4.7nF VTM_IN– 1 VTM_OUT– 2 3 JVOUT– 1 VTM_IN– UG:312 2 3 JBCM– Page 2 Board Assembly The VI Chip® evaluation boards should be attached to the carrier board using the hardware provided. Begin by removing the top nuts from the bolts in the space provided for mounting the evaluation board. Check to see that the lower bolts are tightened. Remove rubber spacers from the VI Chip evaluation board(s). Place the VI Chip evaluation board on the bolts. Make sure that the evaluation board is placed in the proper input to output orientation with respect to the carrier board (the input side will have the capacitor). Replace the top nuts and tighten gently with a wrench. Attach input and output leads, be careful to confirm proper polarity before powering up. When using the carrier board, pay special attention to the wiring and grounding. Wires should be kept as short as possible and positioned to minimize radiated noise pick up on the QPI-12LZ. Figure 4 Side-view hardware assembly Figure 5 QPI-12-CB1 carrier board assembled with PRM™ and VTM™ evaluation boards Figure 6 QPI-12-CB1 carrier board assembled with a BCM® evaluation board UG:312 Page 3 EMI Bypass Configurations EMI bypass capacitors (“Y” capacitors) are an essential element in a switch-mode DC-DC filter application as these capacitors provide a return path for common-mode noise currents to their source; so careful attention to bypass capacitor implementation is essential for a successful EMI filter design. This carrier board is preconfigured in a “baseplate” EMI topology, which uses six “Y” capacitors (only four are actually used in a BCM® configuration), as illustrated in Figure 7 below. This is the preferred topology for VI Chip® applications. The carrier board can be manually reconfigured to an “open frame” topology, which uses four “Y” caps in a PRM™ / VTM™ combination (two for a BCM), as shown in Figure 8. The open-frame approach may attenuate certain load dependent noise better than the baseplate method. The carrier board provides an ideal test vehicle for making a comparison between the two “Y” capacitor configurations. To reconfigure to “open frame” carefully remove capacitors CY5 through CY10 and place four of those six capacitors in the positions marked as CY1 through CY4. EMI Performance and Test Set Up The EMI plots in Figures 9 through 14 are the total noise measurements, on both the positive and negative lines of the QPI-12LZ with various VI Chip® configurations, using the basic baseplate standard “Y” cap configuration. Figure 7 shows the basic EMI measurement set up that was used to achieve these results. Figure 8 shows the alternate set up method when converting to the open-frame approach. In Figure 7 (baseplate method), capacitors CY5 through CY10 represent the recirculation capacitors that are connected to each of the four input and output terminals, then are commoned to a shield plane that has been created underneath the converter. Since the PRM / VTM pair is similar to a conventional converter, which is split into to halves, two additional “Y” caps (CY7 and CY9) were added to the PRM’s output (the input to the VTM), referenced to the shield plane. In Figure 8 (open-frame method), four “Y” capacitors are used (CY1 through CY4) rather than the two “Y” caps that a conventional converter would require, once again because of the topology split created by the pair. In a BCM application there is no topology split so the set up would require two fewer capacitors for either configuration. The open-frame method would only need one pair of input an output caps, referenced to the shield plane on either side of the BCM. And for open-frame method a pair of “Y” caps across the positive input to positive output, and negative input and negative output would be sufficient. Figure 7 Basic EMI measurement set up for “baseplate” configuration Shielded Box ~1.25m PCB Board PCB Plane Under Converter BUS+ LISN QPI+ VIN+ VOUT+ VIN+ VOUT+ C1 BUS SUPPLY QPI 47µF SHIELD BUS– LISN PRM QPI– VIN– CY5 VTM VOUT– CY6 VIN– CY9 VOUT– CY7 CY10 CY8 Shield Plane (Earth Ground) Figure 8 Basic EMI measurement set up for “open-frame” configuration Shielded Box ~1.25m CY3 PCB Board BUS+ LISN QPI+ VIN+ VOUT+ CY1 VIN+ VOUT+ C1 BUS SUPPLY QPI 47µF SHIELD BUS– LISN PRM QPI– VIN– VOUT– CY4 VTM VIN– PCB Plane Under Converter VOUT– CY2 Shield Plane (Earth Ground) UG:312 Page 4 Figure 9 Total noise QPI-12LZ [a] with 48V input PRM™ and 3V output VTM™; 3.27A input current; 160W output load Figure 10 Total noise QPI-12LZ [a] with 48V input PRM and 12V output VTM; 4.03A input current; 180W output load Figure 11 Total noise QPI-12LZ [a] with 48V input PRM and 48V output VTM; 3.45A input current; 160W output load [a] These EMI plots are actually based on QPI-10LZ, which includes the same filter elements but includes integrated hot swap. UG:312 Page 5 Figure 12 Total noise QPI-12LZ [a] with 48V input, 3V output BCM®; 3.18A input current; 160W output load Figure 13 Total noise QPI-12LZ [a] with 48V input, 12V output BCM; 3.75A input current; 180W output load Figure 14 Total noise QPI-12LZ [a] with 48V input, 48V output BCM; 3.20A input current; 153W output load [a] These EMI plots are actually based on QPI-10LZ, which includes the same filter elements but includes integrated hot swap. UG:312 Page 6 4.585 2.435 0.000 Figure 15 Mechanical drawing for QPI-12-CB1 3.200 3.200 +IN C1 BCM QPI-12LZ 0.400 CY6 Plane CY4 –IN 5/07 revC Carrier CY9 VOUT– CY10 2.350 2.150 1.950 1.250 1.050 0.850 0.385 CY2 0.000 2.500 0.850 0.250 VOUT– SHIELD VIN– 0.000 VOUT+ –IN VIN– 0.000 BCM+ VTM BCM- PRM 7.200 1.050 0.850 0.650 +IN 7.950 VIN+ C2 2.815 CY8 VOUT+ 5.600 VIN+ 2.250 2.150 2.050 CY7 CY5 QPI / VIChip Carrier Board For QPI-11 or QPI-12 filter models Reorder # QPI-xx-CB1* * xx indicates model 5.100 2.800 CY1 CY3 Ordering Information Carrier Board Part Number Compatible VI Chip® Evaluation Boards (sold separately) [b] PRMs™: P048F048T12AL-CB P048F048T24AL-CB P048F048T17AL-CB P048F048T32AL-CB QPI-12-CB1 VTMs™: All 48V input models BCMs®: All 48V input models [b] Some VI Chip products exceed the current rating and therefore may not be compatible when operating at full load. Additional Resources nn QPI-12LZ Data Sheet nn Compatible VI Chip® Converters nnPRM and VTM nnBCM UG:312 Page 7 Limitation of Warranties Information in this document is believed to be accurate and reliable. HOWEVER, THIS INFORMATION IS PROVIDED “AS IS” AND WITHOUT ANY WARRANTIES, EXPRESSED OR IMPLIED, AS TO THE ACCURACY OR COMPLETENESS OF SUCH INFORMATION. VICOR SHALL HAVE NO LIABILITY FOR THE CONSEQUENCES OF USE OF SUCH INFORMATION. IN NO EVENT SHALL VICOR BE LIABLE FOR ANY INDIRECT, INCIDENTAL, PUNITIVE, SPECIAL OR CONSEQUENTIAL DAMAGES (INCLUDING, WITHOUT LIMITATION, LOST PROFITS OR SAVINGS, BUSINESS INTERRUPTION, COSTS RELATED TO THE REMOVAL OR REPLACEMENT OF ANY PRODUCTS OR REWORK CHARGES). Vicor reserves the right to make changes to information published in this document, at any time and without notice. You should verify that this document and information is current. This document supersedes and replaces all prior versions of this publication. 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