QPI-12LZ

QPI™ Filters QPI-12LZ S C NRTL US 7A VI Chip® EMI Filter SiP Product Description Features & Benefits The QPI-12 EMI filter is specifically designed to attenuate conducted common-mode (CM) and differential-mode (DM) noise of Vicor VI Chip® products, such as the PRM™, VTM™ and BCM® converters, to comply with the CISPR22 standard requirements for conducted noise measurements. The filter is designed to operate up to 80VDC, 100VDC surge, and supports 7A loads up to 85°C (TA) without de-rating. • 45dB CM attenuation at 1MHz (50Ω) Designed for the telecom bus range, the VI Chip EMI filter supports the PICMG® 3.0 specification for filtering system boards to the EN55022 Class B limits. • Low-profile LGA package • 75dB DM attenuation at 1MHz (50Ω) • 80VDC (max input) • 100VDC surge 100ms • 1,500VDC hipot hold off to shield plane • 7A rating • ~1/2in2 area • –40 to +125°C PCB temperature (see Figure 6) • Efficiency >99% • TÜV Certified Applications • VI Chip Input EMI Filter • Telecom and ATCA boards Package Information • 12.9 x 25.3 x 5.0mm, lidded SiP (System-in-Package) Typical Applications • 12.4 x 24.9 x 4.09mm, open-frame L BUS+ BUS+ CB1 BUS– QPI+ IN+ CIN QPI-12 BUS– QPI– OUT+ IN+ OUT– IN– PRM IN– OUT+ VTM LOAD OUT– Optional Chassis Connection Shield CY1 CY2 CY3 Chassis/Shield CY4 Shield Plane Typical QPI-12 application schematic with Vicor PRM and VTM modules [a] BUS+ BUS+ CB1 BUS– QPI+ QPI-12 BUS– IN+ CIN QPI– OUT+ LOAD BCM IN– Optional Chassis Connection OUT– Shield CY1 Chassis/Shield CY2 CY3 CY4 Shield Plane Typical QPI-12 application schematic with Vicor BCM module [a] [a] CB1 capacitor, referenced in all schematics, is a 47µF electrolytic; United Chemi-Con EMVE101ARA470MKE0S or equivalent. CY1 to CY4, referenced in all schematics, are 4.7nF high-voltage safety capacitors; Vishay VY1472M63Y5UQ63V0 or equivalent. QPI™ Filters Page 1 of 15 Rev 2.5 01/2021 QPI-12LZ Contents Order Information 3 Absolute Maximum Ratings 3 Electrical Characteristics 3 Package Pinout 4 Applications Information 5 EMI Sources 5 EMI Filtering 5 EMI Management 6 Attenuation Test Set Ups 6 Attenuation Plots 7 Current De-Rating 9 Converter Output Grounding 10 QPI Insertion Loss Measurements and Test Circuits 11 Package Outline Drawings 12 Pad and Stencil Definitions 13 PCB Layout Recommendations 14 PCB Layout 14 Post-Solder Cleaning 14 QPI-12 Mechanical Data 14 Product Warranty QPI™ Filters Page 2 of 15 15 Rev 2.5 01/2021 QPI-12LZ Order Information Product Description QPI-12LZ [b] QPI-12 LGA package, RoHS compliant QPI-12LZ-01 QPI-12 LGA package, RoHS compliant, open-frame package Evaluation Board Description A QPI-12LZ mounted on a carrier board that can hold either a standalone BCM® or a paired PRM™/VTM™ evaluation board available from Vicor. QPI-12-CB1 [b] QPI-12LZ is a non-hermetically sealed package. Please read the “Post-Solder Cleaning” section on page 13. Absolute Maximum Ratings Exceeding these parameters may result in permanent damage to the product. Name Rating Input Voltage, BUS+ to BUS–, Continuous –80 to 80VDC Input Voltage, BUS+ to BUS–, 100ms Transient –100 to 100VDC BUS+/ BUS– to Shield Pads, Hi-pot –1500 to 1500VDC Input to Output Current, Continuous @ 25°C (TA) 7ADC Power Dissipation, @ 85°C (TA), 7A [c] 1.85W Operating Temperature - TA –40 to 125°C Thermal Resistance [c] - RθJ-A, using PCB layout in Figure 22 30°C/W Thermal Resistance [c] - RθJ-PCB 18°C/W Storage Temperature, JEDEC Standard J-STD-033B –55 to 125°C Reflow Temperature, 20s Exposure 245°C ESD, Human Body Model (HBM) –2000 to 2000V Electrical Characteristics Parameter limits apply over the operating temperature range unless otherwise noted. Parameter Max Unit Measured at 7A, 85°C ambient temperature [c] 80 VDC Measured at 7A, 85°C ambient temperature [c] 130 mVDC BUS– to QPI– Voltage Drop Measured at 7A, 85°C ambient temperature [c] 130 mVDC Common-Mode Attenuation VBUS = 48V, Frequency = 1.0MHz, line impedance = 50Ω 45 dB Differential-Mode Attenuation VBUS = 48V, Frequency = 1.0MHz, line impedance = 50Ω 75 dB Input Bias Current at 50V Input current from BUS+ to BUS– BUS+ to BUS– Input Range BUS+ to QPI+ Voltage Drop [c] Conditions See Figure 11 for the current de-rating curve. QPI™ Filters Page 3 of 15 Rev 2.5 01/2021 Min Typ 10 µA QPI-12LZ Package Pinout BUS+ 9 BUS– 10 BUS+ QPI+ 8 7 1 2 3 4 BUS– Shield Shield QPI– 6 QPI+ 5 QPI– LGA Pattern (Top View) Pad Number Name Description 8, 9 BUS+ Positive bus potential 1, 10 BUS– Negative bus potential 6, 7 QPI+ Positive input to the converter 4, 5 QPI– Negative input to the converter 2, 3 Shield QPI™ Filters Page 4 of 15 Shield connects to the system chassis or to a safety ground Rev 2.5 01/2021 QPI-12LZ Applications Information EMI Filtering EMI Sources The basic premise of filtering EMI is to insert a high impedance, at the EMI’s base frequency, in both the differential- and common‑mode paths as it returns to the power source. Many of the components in today’s power conversion modules are sources of high-frequency EMI noise generation. Diodes, high‑frequency switching devices, transformers and inductors, and circuit layouts passing high dV/dt or dI/dt signals are all potential sources of EMI. EMI is propagated either by radiated or conductive means. Radiated EMI can be sourced from these components as well as by circuit loops that act like antennas and broadcast the noise signals to neighboring circuit paths. This also means that these loops can act as receivers of a broadcasted signal. This radiated EMI noise can be reduced by proper circuit layout and by shielding potential sources of EMI transmission. There are two basic forms of conducted EMI that typically need to be filtered; namely common-mode (CM) and differential-mode (DM) EMI. Differential-mode resides in the normal power loop of a power source and its load; where the signal travels from the source to the load and then returns to the source. Common‑mode is a signal that travels through both leads of the source and is returned to earth via parasitic pathways, either capacitively or inductively coupled. Passive filters use common-mode chokes and “Y” capacitors to filter out common-mode EMI. These chokes are designed to present a high impedance at the EMI frequency in series with the return path, and a low-impedance path to the earth signal via the “Y” caps. This network will force the EMI signals to re-circulate within a confined area and not to propagate to the outside world. Often two common-mode networks are required to filter EMI within the frequency span required to pass the EN55022 Class B limits. The other component of the passive filter is the differential LC network. Again, the inductor is chosen such that it will present a high impedance in the differential EMI loop at the EMI’s base frequency. The differential capacitor will then shunt the EMI back to its source. The QPI-12 was specifically designed to work with higher switching frequency converters like Vicor VI Chip® products; PRM, VTM and BCM modules; as well as their newer VI Brick® product series. Figures 3 – 10 are the resulting EMI plots of the total noise, both common and differential mode, of Vicor PRM™/VTM™ and BCM® evaluation modules, under various loads, after filtering by the QPI‑12LZ. The red and blue traces represent the positive and negative branches of total noise, as measured using an industry‑standard LISN set up, shown in Figures 1 and 2. The PRM and VTM evaluation boards are mounted to a Vicor QPI‑12‑CB1 board for testing. The QPI-12-CB1 carrier is designed to accept both the PRM/VTM combination of evaluation boards, as well as the standalone BCM evaluation board. The differential-mode EMI is typically larger in magnitude than common-mode, since common-mode is created by the physical imbalances in the differential loop path. Reducing differential EMI will cause a reduction in common-mode EMI. QPI™ Filters Page 5 of 15 Rev 2.5 01/2021 QPI-12LZ EMI Management The more effectively EMI is managed at the source, namely the power converter, the less EMI attenuation the filter will have to do. The addition of “Y” capacitors to the input and output power nodes of the converter will help to limit the amount of EMI that tries to propagate to the input source. There are two basic topologies for the connection of the recirculating “Y” capacitors. In Figure 1 the open-frame topology is shown in the Vicor EMI test setup. The “Y” capacitors (CY1 to CY4) recirculate the EMI signals between the positive input and output, and the negative input and output of the power conversion stage. Figure 2 shows the baseplate topology of recirculating “Y” caps. Here, CY5 to CY10 are connected to each power node of the PRM™ and VTM™, and then are commoned together on a copper shield plane created under the converter. The addition of the copper shield plane helps in the containment of the radiated EMI, converting it back to conducted EMI and shunting it back to its source. Both of these topologies work well with the PRM/VTM combination shown above in attenuating noise levels well below Class B EMI limits. Attenuation Test Set Ups Figure 1 — Open-frame EMI test setup using the QPI-12-CB1 carrier board with VI Chip® evaluation boards Figure 2 — Baseplate EMI test setup using the QPI-12-CB1 carrier board with VI Chip evaluation boards QPI™ Filters Page 6 of 15 Rev 2.5 01/2021 QPI-12LZ Attenuation Plots QPI-12 with PRM™ P048F048T24AL-CB and various VTM™ modules, connected in baseplate configuration, as shown in Figure 1. Figure 3 — VTM V048F030T070-CB with 160W load Figure 4 — VTM V048F120T025-CB with 180W load Figure 5 — VTM V048F240T012-CB with 172W output load Figure 6 — VTM V048F480T006-CB with 153W load QPI™ Filters Page 7 of 15 Rev 2.5 01/2021 QPI-12LZ Attenuation Plots (Cont.) QPI-12 with various BCM® modules, connected in open-frame configuration, as shown in Figure 12. Figure 7 — BCM B048F030T21-EB with 160W load Figure 8 — BCM B048F120T30-EB with 180W load Figure 9 — BCM B048F240T30-EB with 172W load Figure 10 — BCM B048F480T30-EB with 152W load QPI™ Filters Page 8 of 15 Rev 2.5 01/2021 QPI-12LZ Current De-Rating Mounted to QPI-12-CB1 Evaluation Board. 8 Limited by TPCBMAX = Load Current (A) 7 125ºC 6 5 4 Limited by TJMAX = 140ºC 3 2 1 0 –40 –20 0 20 40 60 Ambient Temperature (ºC) QPI-12LZ-01 Figure 11 — Current de-rating over ambient temperature range QPI™ Filters Page 9 of 15 Rev 2.5 01/2021 QPI-12LZ 80 100 120 QPI-12LZ Converter Output Grounding Recommended configurations. CY1 BUS+ BUS+ CB1 QPI+ IN+ CIN QPI-12 BUS– BUS– 4.7nF QPI– OUT+ LOAD BCM IN– Optional Chassis Connection OUT– Shield Chassis/Shield CY2 4.7nF Figure 12 — BCM® converter in open-frame configuration with the output connected to chassis/earth CY1 CY2 4.7nF 4.7nF L BUS+ BUS+ CB1 4.7µF BUS– QPI+ QPI-12 BUS– IN+ CIN QPI– OUT+ IN+ PRM IN– OUT+ VTM OUT– IN– Shield LOAD OUT– Optional Chassis Connection CY3 Chassis/Shield 4.7nF Figure 13 — PRM™/VTM™ in open-frame configuration with the output connected to the chassis/earth When using the QPI-12 with a Vicor PRM™/VTM™ or BCM® in a power system that requires the converter’s output to be connected to chassis/earth, Vicor recommends using the open-frame configuration of “Y” capacitors, shown in Figure 12, to re-circulate EMI currents. A baseplate configuration could also be used with a slight decrease in EMI attenuation, but with peaks well below class B limits. The plot in Figure 14 is of a B048F120T30, with a 125W load, with the output ground connected to the chassis. When using the open‑frame configuration of “Y” caps, the EMI shield plane is not used by the “Y” capacitors for recirculating EMI currents. This configuration would also be recommended for a QPI-12 with a PRM/VTM pair, configured as shown in the PRM/VTM typical application schematic on page 1. Figure 14 — Total noise plot of BCM with its output return connected to chassis, as shown in Figure 12, 125W load. The QPI-12 is not designed to be used in parallel with another QPI‑12 to achieve a higher current rating, but it can be used multiple times within a system design. QPI™ Filters Rev 2.5 Page 10 of 15 01/2021 QPI-12LZ QPI Insertion Loss Measurements and Test Circuits Figure 15 — Attenuation curves into a 50Ω line impedance, bias from a 48V bus Insertion loss equation: Insertion Loss = 20log ( ) IINA IINB IPROBE BUS BUS+ IN LISN VBUS Chassis 47µF QPI+ QPI-12 SIG BUS– INA INB QPI– SIG 50Ω Shield BUS CSIG LOAD IN LISN Chassis IPROBE SIG Figure 16 — Test set up to measure differential-mode EMI currents in Figure 15 IN BUS LISN VBUS Chassis BUS+ 47µF SIG QPI+ QPI-12 BUS– QPI– Shield BUS IPROBE LOAD INA CSIG INB SIG IN 50Ω LISN Chassis SIG Figure 17 — Test set up to measure common-mode EMI currents in Figure 15 QPI™ Filters Rev 2.5 Page 11 of 15 01/2021 IPROBE QPI-12LZ Package Outline Drawings 0.006" [0.15mm] max. 0.508" [12.903 mm] 0.006" [0.15mm] max. QPI-12LZ U.S. and Foreign Patents/Patents Pending Lot # Date Code Pin 1 indicator 0.996" [25.298 mm] 0.196" [4.978 mm] Figure 18 — Lidded package dimensions, tolerance of ±0.004in 12LZ–01 BC000 Figure 19 — Open-frame package dimensions, tolerance of ±0.004in; pick-and-place from label center QPI™ Filters Rev 2.5 Page 12 of 15 01/2021 QPI-12LZ Pad and Stencil Definitions Figure 20 — Bottom view of open-frame (OF) and lidded (LID) products (all dimensions are in inches) Figure 21 — Recommended receptor and stencil patterns (all dimensions are in inches) Note: Stencil definition is based on a 6mil stencil thickness, 80% of LGA pad area coverage. LGA Package dimensions are for both the open-frame and lidded versions of the QPI-12. QPI™ Filters Rev 2.5 Page 13 of 15 01/2021 QPI-12LZ PCB Layout Recommendations Figure 22 — 3D view of paralleling planes underneath the QPI-12 PCB Layout Post-Solder Cleaning The filtering performance of the QPI-12 is sensitive to capacitive coupling between its input and output pins. Parasitic plane capacitance must be kept below one pico-Farad between inputs and outputs using the layout shown above and the recommendations described below to achieve maximum conducted EMI performance. LZ version SiPs are not hermetically sealed and must not be exposed to liquid, including but not limited to cleaning solvents, aqueous washing solutions or pressurized sprays. When soldering, it is recommended that no-clean flux solder be used, as this will ensure that potentially corrosive mobile ions will not remain on, around or under the module following the soldering process. For applications where the end product must be cleaned in a liquid solvent, Vicor recommends using the QPI-12LZ-01, open-frame version of the EMI filter. To avoid capacitive coupling between input and output pins, there should not be any planes or large traces that run under both input and output pins, such as a ground plane or power plane. For example, if there are two signal planes or large traces where one trace runs under the input pins, and the other under the output pins, and both planes overlap in another area, they will cause capacitive coupling between input and output pins. Also, planes that run under both input and outputs pins, but do not cross, can cause capacitive coupling if they are capacitively bypassed together. Figure 22 shows the recommended PCB layout on a two-layer board. Here, the top layer planes are duplicated on the bottom layer so that there can be no overlapping of input and output planes. This method can be used for boards of greater layer count. QPI-12 Mechanical Data Datum FITS MTBF Weight Units QPI-12LZ QPI-12LZ-01 Failure/Billion Hrs 16 16 Million Hrs 62.5 62.5 grams 2.4 2.075 3 3 °C/20 seconds 245 245 MSL Peak Reflow Temperature QPI™ Filters Rev 2.5 Page 14 of 15 01/2021 Notes FITS based on the BellCore Standard TR-332 MTBFs based on the BellCore Standard TR-332 IPC/JEDEC J-STD-020D QPI-12LZ Vicor’s comprehensive line of power solutions includes high density AC-DC and DC-DC modules and accessory components, fully configurable AC-DC and DC-DC power supplies, and complete custom power systems. Information furnished by Vicor is believed to be accurate and reliable. However, no responsibility is assumed by Vicor for its use. Vicor makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication. Vicor reserves the right to make changes to any products, specifications, and product descriptions at any time without notice. Information published by Vicor has been checked and is believed to be accurate at the time it was printed; however, Vicor assumes no responsibility for inaccuracies. Testing and other quality controls are used to the extent Vicor deems necessary to support Vicor’s product warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. Specifications are subject to change without notice. Visit http://www.vicorpower.com/dc-dc-filters/qpi for the latest product information. Vicor’s Standard Terms and Conditions and Product Warranty All sales are subject to Vicor’s Standard Terms and Conditions of Sale, and Product Warranty which are available on Vicor’s webpage (http://www.vicorpower.com/termsconditionswarranty) or upon request. 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Intellectual Property Notice Vicor and its subsidiaries own Intellectual Property (including issued U.S. and Foreign Patents and pending patent applications) relating to the products described in this data sheet. No license, whether express, implied, or arising by estoppel or otherwise, to any intellectual property rights is granted by this document. Interested parties should contact Vicor’s Intellectual Property Department. The products described on this data sheet are protected by U.S. Patents. Please see www.vicorpower.com/patents for the latest patent information. Contact Us: http://www.vicorpower.com/contact-us Vicor Corporation 25 Frontage Road Andover, MA, USA 01810 Tel: 800-735-6200 Fax: 978-475-6715 www.vicorpower.com email Customer Service: custserv@vicorpower.com Technical Support: apps@vicorpower.com ©2019 – 2021 Vicor Corporation. All rights reserved. The Vicor name is a registered trademark of Vicor Corporation. PICMG® is a trademark of the PICMG consortium. All other trademarks, product names, logos and brands are property of their respective owners. QPI™ Filters Rev 2.5 Page 15 of 15 01/2021