PRELIMINARY
45
Features
• >40dB ripple attenuation from 60Hz to 1MHz • Integrated OR’ing diode supports N+1 redundancy • Significantly improves load transient response • Efficiency up to 98% • User selectable performance optimization • Combined active and passive filtering • 3-30Vdc input range • 20 and 30 Ampere ratings
Data Sheet
MicroRAM
TM
Output Ripple Attenuation Module
Patents Pending
Shown actual size: 2.28 x 1.45 x 0.5 in 57,9 x 36,8 x 12,7 mm
Product Highlights
Vicor’s MicroRAM output ripple attenuation module combines both active and passive filtering to achieve greater than 40dB of noise attenuation from 60Hz to 1Mhz. The MicroRAM operates over a range of 3 to 30Vdc, is available in either 20 or 30A models and is compatible with most manufacturers switching converters including Vicor’s 1st and 2nd Generation DC-DC converters. The MicroRAM’s closed loop architecture greatly improves load transient response and with dual mode control, insures precise point of load voltage regulation, The MicroRAM supports redundant and parallel operation with its integrated OR’ing diode function. It is available in Vicor’s standard micro package (quarter brick) with a variety of terminations for through hole, socket or surface mount applications.
Absolute Maximum Ratings
Parameter +In to –In +In to –In Load current Ripple Input (Vp-p) Ripple Input (Vp-p) Mounting torque Pin soldering temperature Pin soldering temperature Storage temperature (C, T-Grade) Storage temperature (H-Grade) Storage temperature (M-Grade) Operating temperature (C-Grade) Operating temperature (T, H-Grade) Operating temperature (M-Grade) Rating 30 40 40 100 500 4-6 (0.45-0.68) 500 (260) 750 (390) -40 to +125 -55 to +125 -65 to +125 -20 to +100 -40 to +100 -55 to +100 Unit Vdc Vdc Adc mV mV In. lbs (Nm) °F (°C) °F (°C) °C °C °C °C °C °C Notes Continuous 100ms Continuous 60Hzc100 kHz 100kHz–2MHz 6 each, 4-40 screw 5 sec; wave solder 7 sec; wave solder
Baseplate Baseplate Baseplate
Thermal Resistance
Parameter Baseplate to sink; flat, greased surface Baseplate to sink; with thermal pad (P/N 20264) Baseplate to ambient Baseplate to ambient; 1000 LFM Typ 0.16 0.14 8.0 1.9 Unit °C/Watt °C/Watt °C/Watt °C/Watt
Part Numbering
uRAM
Product
2
Type 2 = 20A 3 = 30A
C
Product Grade C = –20°C to +100°C T = –40°C to +100°C H = –40°C to +100°C M = –55°C to +100°C
2
Pin Style* 1 = Short Pin 2 = Long Pin S = Short ModuMate N = Long ModuMate
1
Baseplate 1 = Slotted 2 = Threaded 3 = Thru-hole
*Pin styles S & N are compatible with the ModuMate interconnect system for socketing and surface mounting.
Vicor Corp. Tel: 800-735-6200, 978-470-2900 Fax: 978-475-6715
MicroRAM
Rev. 1.1
Page 1 of 8
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PRELIMINARY
Electrical Characteristics
Electrical characteristics apply over the full operating range of input voltage, output power and baseplate temperature, unless otherwise specified. All temperatures refer to the operating temperature at the center of the baseplate.
µRAM MODULE SPECIFICATIONS (-20°C to +100°C baseplate temperature)
Parameter Operating current range µRAM2xxx µRAM3xxx Operating input voltage Transient output response Load current step 50nH (b) 200µF to 1,000µF load capacitance needs an ESL of >5nH 3) Adding low ESR capacitance directly at the output terminals of MicroRAM is not recommended and may cause stability problems. 4) In practice the distributed board or wire inductance at a load or on a load board will be sufficient to isolate the output of the MicroRAM from any load capacitance and minimize any appreciable effect on phase margin.
1) Using ceramic load capacitance with
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