VS-16CTT100
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Vishay Semiconductors
High Performance Generation 5.0 Schottky Rectifier, 2 x 8 A
Base 2 common cathode
FEATURES
• 175 °C high performance Schottky diode • Very low forward voltage drop • Extremely low reverse leakage • Optimized VF vs. IR trade off for high efficiency • Increased ruggedness for reverse avalanche capability • RBSOA available • Negligible switching losses • Submicron trench technology
Anode
TO-220AB
Anode 2 1 Common 3 cathode
PRODUCT SUMMARY
Package IF(AV) VR VF at IF IRM max. TJ max. Diode variation EAS TO-220AB 2x8A 100 V 0.58 V 4 mA at 125 °C 175 °C Common cathode 36 mJ
• Compliant to RoHS Directive 2002/95/EC • Designed and qualified according to JEDEC-JESD47
APPLICATIONS
• • • • • • • • High efficiency SMPS Automotive High frequency switching Output rectification Reverse battery protection Freewheeling DC/DC systems Increased power density systems
MAJOR RATINGS AND CHARACTERISTICS
SYMBOL VRRM VF TJ 8 Apk, TJ = 125 °C (typical, per leg) Range CHARACTERISTICS VALUES 100 0.55 - 55 to 175 UNITS V °C
VOLTAGE RATINGS
PARAMETER Maximum DC reverse voltage SYMBOL VR TEST CONDITIONS TJ = 25 °C VS-16CTT100 100 UNITS V
ABSOLUTE MAXIMUM RATINGS
PARAMETER Maximum average forward current per leg per device SYMBOL IF(AV) TEST CONDITIONS 50 % duty cycle at TC = 163 °C, rectangular waveform 5 µs sine or 3 µs rect. pulse IFSM EAS IAR 10 ms sine or 6 ms rect. pulse Following any rated load condition and with rated VRRM applied VALUES 8 16 850 210 67 IAS at TJ max. mJ A A UNITS
Maximum peak one cycle non-repetitive surge current per leg Non-repetitive avalanche energy per leg Repetitive avalanche current per leg
TJ = 25 °C, IAS = 1.5 A, L = 60 mH Limited by frequency of operation and time pulse duration so that TJ < TJ max. IAS at TJ max. as a function of time pulse See fig. 8
Revision: 10-Aug-11
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VS-16CTT100
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Vishay Semiconductors
SYMBOL 8A TEST CONDITIONS TJ = 25 °C TJ = 125 °C VR = Rated VR TYP. 520 8.0 MAX. 0.72 0.85 0.58 0.69 65 4 10 000 μA mA pF nH V/μs V UNITS
ELECTRICAL SPECIFICATIONS
PARAMETER
Forward voltage drop per leg
VFM (1)
16 A 8A 16 A
Reverse leakage current per leg Junction capacitance per leg Series inductance per leg Maximum voltage rate of change
IRM (1) CT LS dV/dt
TJ = 25 °C TJ = 125 °C
VR = 5 VDC (test signal range 100 kHz to 1 MHz) 25 °C Measured lead to lead 5 mm from package body Rated VR
Note (1) Pulse width < 300 μs, duty cycle < 2 %
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER Maximum junction and storage temperature range Maximum thermal resistance, junction to case per leg Maximum thermal resistance, junction to case per device Typical thermal resistance, case to heatsink Approximate weight minimum maximum Case style TO-220AB (JEDEC) SYMBOL TJ, TStg TEST CONDITIONS VALUES - 55 to 175 2 RthJC DC operation 1 RthCS Mounting surface, smooth and greased 0.5 2 0.07 6 (5) 12 (10) g oz. kgf · cm (lbf · in) 16CTT100 °C/W UNITS °C
Mounting torque Marking device
Revision: 10-Aug-11
Document Number: 94530 2 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-16CTT100
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100 175°C 10 1 0.1 0.01 0.001 0.0001 0 20 40 60 80 100
100
Reverse Current - IR (mA)
150°C 125°C 100°C 75°C 50°C 25°C
Tj = 175°C
Instantaneous Forward Current - IF (A)
Reverse Voltage - VR (V)
10
Fig. 2 - Typical Values of Reverse Current vs. Reverse Voltage
1000
Junction Capacitance - CT (pF)
Tj = 125°C
100
Tj = 25°C
1 0.0 0.5 1.0 1.5 2.0
10 0 20 40 60 80 100 120
Forward Voltage Drop - VFM (V)
Fig. 1 - Maximum Forward Voltage Drop Characteristics
Reverse Voltage - VR (V)
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
10
Thermal Impedance ZthJC (°C/W)
D = 0.75 D = 0.5 1 D = 0.33 D = 0.25 D = 0.2 0.1 Single Pulse (Thermal Resistance) 0.01
0.001 1E-05
1E-04
1E-03 1E-02 1E-01 t1, Rectangular Pulse Duration (Seconds)
1E+00
Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics Revision: 10-Aug-11 Document Number: 94530 3 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-16CTT100
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Vishay Semiconductors
7
180
Allowable Case Temperature (°C) Average Power Loss - (Watts)
6 5 4 3 2 1 0
170
DC
180° 120° 90° 60° 30°
DC
160
Square wave (D=0.50) 80% rated Vr applied see note (1)
150 0 2 4 6 8 10 12
Average Forward Current - IF(AV)(A)
Fig. 5 - Maximum Allowable Case Temperature vs. Average Forward Current
0
2
4
6
8
10
12
Average Forward Current - IF(AV) (A)
Fig. 6 - Forward Power Loss Characteristics
Non-Repetitive Surge Current - IFSM (A)
1000
100 10 100 1000 10000
Square Wave Pulse Duration - tp (microsec)
Fig. 7 - Maximum Non-Repetitive Surge Current Note (1) Formula used: T = T - (Pd + Pd C J REV) x RthJC; Pd = Forward power loss = IF(AV) x VFM at (IF(AV)/D) (see fig. 6); PdREV = Inverse power loss = VR1 x IR (1 - D); IR at VR1 = 80 % rated VR
Revision: 10-Aug-11
Document Number: 94530 4 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-16CTT100
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100
Avalanche Current (A)
Tj = 25°C
10
Tj = 125°C
1
Tj = 175°C
0.1 1 10 100
Rectangular Pulse Duration ( μsec)
Fig. 8 - Reverse Bias Safe Operating Area (Avalanche Current vs. Rectangular Pulse Duration)
100
Avalanche Energy (mJ)
10
Tj = 25°C Tj = 125°C Tj = 175°C
1 1 10 100
Rectangular Pulse Duration ( μsec)
Fig. 9 - Reverse Bias Safe Operating Area (Avalanche Energy vs. Rectangular Pulse Duration)
Revision: 10-Aug-11
Document Number: 94530 5 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-16CTT100
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Device code
Vishay Semiconductors
VS1 1 2 3 4 5 6 -
16
2
C
3
T
4
T
5
100
6
Vishay Semiconductors product Current rating (16 A) Circuit configuration: C = Common cathode Package: T = TO-220
-
T = Trench Voltage code (100 V)
Tube standard pack quantity: 50 pieces
LINKS TO RELATED DOCUMENTS Dimensions Part marking information SPICE model www.vishay.com/doc?95222 www.vishay.com/doc?95225 www.vishay.com/doc?95229
Revision: 10-Aug-11
Document Number: 94530 6 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Outline Dimensions
Vishay Semiconductors
TO-220AB
DIMENSIONS in millimeters and inches
(6) E E2 Q (6) (7) D2 (6) (6) D D1 1 2 3 C E1 (6) L Base metal View A - A c 2x e e1 0.015 M B A M Lead assignments Lead tip Diodes 1. - Anode/open 2. - Cathode 3. - Anode A2 A b1, b3 (4) c (b, b2) Plating c1 (4) Detail B H1 (H1) C (7) A ØP 0.014 M B A M A B Seating plane A A1 1 D C 23 D L1 (2)
Thermal pad (E)
3xb
3 x b2
Detail B
Section C - C and D - D
Conforms to JEDEC outline TO-220AB
SYMBOL
A A1 A2 b b1 4 b2 b3 4 c c1 4 D 3 D1 D2 6 Notes (1) Dimensioning and tolerancing as per ASME Y14.5M-1994 (2) Lead dimension and finish uncontrolled in L1 (3) Dimension D, D1 and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at the outermost extremes of the plastic body (4) Dimension b1, b3 and c1 apply to base metal only (5) Controlling dimensions: inches (6) Thermal pad contour optional within dimensions E, H1, D2 and E1 Document Number: 95222 Revision: 08-Mar-11
MILLIMETERS MIN. MAX. 4.25 4.65 1.14 1.40 2.56 2.92 0.69 1.01 0.38 0.97 1.20 1.73 1.14 1.73 0.36 0.61 0.36 0.56 14.85 15.25 8.38 9.02 11.68 12.88
INCHES MIN. MAX. 0.167 0.183 0.045 0.055 0.101 0.115 0.027 0.040 0.015 0.038 0.047 0.068 0.045 0.068 0.014 0.024 0.014 0.022 0.585 0.600 0.330 0.355 0.460 0.507
NOTES
SYMBOL E E1 E2 e e1 H1 L L1 ØP Q
MILLIMETERS MIN. MAX. 10.11 10.51 6.86 8.89 0.76 2.41 2.67 4.88 5.28 6.09 6.48 13.52 14.02 3.32 3.82 3.54 3.73 2.60 3.00 90° to 93°
INCHES MIN. MAX. 0.398 0.414 0.270 0.350 0.030 0.095 0.105 0.192 0.208 0.240 0.255 0.532 0.552 0.131 0.150 0.139 0.147 0.102 0.118 90° to 93°
NOTES 3, 6 6 7
6, 7 2
(7) (8)
Dimensions E2 x H1 define a zone where stamping and singulation irregularities are allowed Outline conforms to JEDEC TO-220, except A2 (maximum) and D2 (minimum) where dimensions are derived from the actual package outline
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Document Number: 91000 Revision: 11-Mar-11
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