VS-20ETF..SPbF Series
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Vishay Semiconductors
Surface Mountable Fast Soft Recovery Rectifier Diode, 20 A
FEATURES
Base common cathode + 2
• Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • Designed and qualified according to JEDEC-JESD47 • Compliant to RoHS Directive 2002/95/EC • Halogen-free according to IEC 61249-2-21 definition
D2PAK (SMD-220)
1 Anode -
3 - Anode
APPLICATIONS
• Output rectification and freewheeling in inverters, choppers and converters • Input rectifications where severe restrictions on conducted EMI should be met
PRODUCT SUMMARY
Package IF(AV) VR VF at IF IFSM trr TJ max. Diode variation Snap factor TO-263AB (D2PAK) 20 A 200 V, 400 V, 600 V 1.3 V 300 A 60 ns 150 °C Single die 0.6
DESCRIPTION
The VS-20ETF..SPbF soft recovery rectifier series has been optimized for combined short reverse recovery time and low forward voltage drop. The glass passivation ensures stable reliable operation in the most severe temperature and power cycling conditions.
MAJOR RATINGS AND CHARACTERISTICS
SYMBOL IF(AV) VRRM IFSM VF trr TJ 10 A, TJ = 25 °C 1 A, 100 A/μs Range CHARACTERISTICS Sinusoidal waveform VALUES 20 200 to 600 300 1.2 60 - 40 to 150 UNITS A V A V ns °C
VOLTAGE RATINGS
PART NUMBER VS-20ETF02SPbF VS-20ETF04SPbF VS-20ETF06SPbF VRRM, MAXIMUM PEAK REVERSE VOLTAGE V 200 400 600 VRSM, MAXIMUM NON-REPETITIVE PEAK REVERSE VOLTAGE V 300 500 700 5 IRRM AT 150 °C mA
ABSOLUTE MAXIMUM RATINGS
PARAMETER Maximum average forward current Maximum peak one cycle non-repetitive surge current Maximum I2t for fusing Maximum I2t for fusing Revision: 17-Aug-11 SYMBOL IF(AV) IFSM I2t I2t TEST CONDITIONS TC = 97 °C, 180° conduction half sine wave 10 ms sine pulse, rated VRRM applied 10 ms sine pulse, no voltage reapplied 10 ms sine pulse, rated VRRM applied 10 ms sine pulse, no voltage reapplied t = 0.1 ms to 10 ms, no voltage reapplied VALUES 20 250 300 316 442 4420 A2s A2s A UNITS
Document Number: 94097 1 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-20ETF..SPbF Series
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Vishay Semiconductors
ELECTRICAL SPECIFICATIONS
PARAMETER Maximum forward voltage drop Forward slope resistance Threshold voltage Maximum reverse leakage current SYMBOL VFM rt VF(TO) IRM TJ = 150 °C TJ = 25 °C TJ = 150 °C VR = Rated VRRM TEST CONDITIONS 20 A, TJ = 25 °C 60 A, TJ = 25 °C VALUES 1.30 1.67 12.5 0.9 0.1 5.0 UNITS V m V mA
RECOVERY CHARACTERISTICS
PARAMETER Reverse recovery time Reverse recovery current Reverse recovery charge Snap factor SYMBOL trr Irr Qrr S TEST CONDITIONS IF at 20 Apk 100 A/μs 25 °C Typical VALUES 160 10 1.25 0.6 UNITS ns A μC
dir dt IFM ta trr tb Qrr IRM(REC) t
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER Maximum junction and storage temperature range Maximum thermal resistance, junction to case Maximum thermal resistance junction to ambient (PCB mount) Soldering temperature Approximate weight SYMBOL TJ, TStg RthJC RthJA (1) TS DC operation TEST CONDITIONS VALUES - 40 to 150 0.9 °C/W 40 240 2 0.07 20ETF02S Marking device Case style TO-263AB (D2PAK) 20ETF04S 20ETF06S Note (1) When mounted on 1" square (650 mm2) PCB of FR-4 or G-10 material 4 oz. (140 μm) copper 40 °C/W. For recommended footprint and soldering techniques refer to application note #AN-994. °C g oz. UNITS °C
Revision: 17-Aug-11
Document Number: 94097 2 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-20ETF..SPbF Series
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Vishay Semiconductors
45 40 35 30 25 20 15 10 5 0 0 5 10 15 20
150
130
Ø
120 110 100 90 30° 80 70 0 2 4 6 8
Conduction angle
Maximum Average Forward Power Loss (W)
Maximum Allowable Case Temperature (°C)
140
20ETF.. Series RthJC (DC) = 0.9 K/W
DC 180° 120° 90° 60° 30°
RMS limit
Ø
Conduction period 20ETF.. Series TJ = 150 °C
25 30 35
60° 90° 120° 180°
10 12 14 16 18 20 22
Average Forward Current (A)
Fig. 1 - Current Rating Characteristics
Average Forward Current (A)
Fig. 4 - Forward Power Loss Characteristics
150
300 20ETF.. Series RthJC (DC) = 0.9 K/W At any rated load condition and with rated VRRM applied following surge.
Maximum Allowable Case Temperature (°C)
140 130 120 110 100 90 80 0 5 10 30° 60°
Ø
Conduction period
Peak Half Sine Wave Forward Current (A)
250
Initial TJ = 150 °C at 60 Hz 0.0083 s at 50 Hz 0.0100 s
200
150
90° 120° 180° 15 20 25 DC
100 20ETF.. Series 50
30
35
1
10
100
Average Forward Current (A)
Fig. 2 - Current Rating Characteristics
Number of Equal Amplitude Half Cycle Current Pulses (N) Fig. 5 - Maximum Non-Repetitive Surge Current
35
550 180° 120° 90° 60° 30° RMS limit 500 Maximum non-repetitive surge current versus pulse train duration. Initial TJ = 150 °C No voltage reapplied Rated VRRM reapplied
Maximum Average Forward Power Loss (W)
30 25 20 15
Peak Half Sine Wave Forward Current (A)
450 400 350 300 250 200 150 100 20ETF.. Series 0.01
Ø
10 5 0 0 5 10
Conduction angle 20ETF.. Series TJ = 150 °C 15 20 25
50 0.001
0.1
1
Average Forward Current (A)
Fig. 3 - Forward Power Loss Characteristics
Pulse Train Duration (s)
Fig. 6 - Maximum Non-Repetitive Surge Current
Revision: 17-Aug-11
Document Number: 94097 3 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-20ETF..SPbF Series
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1000 4.0 3.5 20ETF.. Series TJ = 25 °C IFM = 30 A
Vishay Semiconductors
Instantaneous Forward Current (A)
Qrr - Maximum Reverse Recovery Charge (µC)
3.0 IFM = 20 A 2.5 2.0 1.5 1.0 IFM = 5 A 0.5 0 IFM = 1 A 0 200 400 600 800 1000 IFM = 10 A
100
10
TJ = 25 °C TJ = 150 °C 20ETF.. Series
1 0 1 2 3 4 5
Instantaneous Forward Voltage (V)
Fig. 7 - Forward Voltage Drop Characteristics
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 10 - Recovery Charge Characteristics, TJ = 25 °C
0.20 20ETF.. Series TJ = 25 °C
10 9 20ETF.. Series TJ = 150 °C
Qrr - Maximum Reverse Recovery Charge (µC)
trr - Maximum Reverse Recovery Time (µs)
8 7 6 5 4 3 2 1 0
IFM = 30 A
0.15
IFM = 30 A IFM = 20 A
IFM = 20 A
0.10 IFM = 10 A 0.05 IFM = 5 A
IFM = 10 A
IFM = 5 A IFM = 1 A 0 200 400 600 800 1000
IFM = 1 A 0 0 200 400 600 800 1000
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 8 - Recovery Time Characteristics, TJ = 25 °C
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 11 - Recovery Charge Characteristics, TJ = 150 °C
0.5 20ETF.. Series TJ = 150 °C
70 60 20ETF.. Series TJ = 25 °C IFM = 30 A IFM = 20 A IFM = 10 A IFM = 5 A 20 10
trr - Maximum Reverse Recovery Time (µs)
Irr - Maximum Reverse Recovery Current (A)
0.4 IFM = 30 A IFM = 20 A IFM = 10 A IFM = 5 A IFM = 1 A
50 40 30
0.3
0.2
0.1
IFM = 1 A 0 200 400 600 800 1000
0 0 200 400 600 800 1000
0
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 9 - Recovery Time Characteristics, TJ = 150 °C
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 12 - Recovery Current Characteristics, TJ = 25 °C
Revision: 17-Aug-11
Document Number: 94097 4 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-20ETF..SPbF Series
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100 20ETF.. Series TJ = 150 °C
Vishay Semiconductors
Irr - Maximum Reverse Recovery Current (A)
80
IFM = 30 A IFM = 20 A IFM = 10 A
60
40
IFM = 5 A IFM = 1 A
20
0 0 200 400 600 800 1000
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 13 - Recovery Current Characteristics, TJ = 150 °C
ZthJC - Transient Thermal Impedance (K/W)
10 Steady state value (DC operation) 1
0.1
Single pulse
D = 0.50 D = 0.33 D = 0.25 D = 0.17 D = 0.08
20ETF.. Series
0.01 0.0001
0.001
0.01
0.1
1
Square Wave Pulse Duration (s)
Fig. 14 - Thermal Impedance ZthJC Characteristics
Revision: 17-Aug-11
Document Number: 94097 5 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-20ETF..SPbF Series
www.vishay.com ORDERING INFORMATION TABLE
Device code
Vishay Semiconductors
VS1
20
2
E
3
T
4
F
5
06
6
S
7
TRL PbF
8 9
1
2 3 4 5 6 7 8
-
Vishay Semiconductors product
Current rating (20 = 20 A) Circuit configuration: E = Single diode Package: T = TO-220
-
Type of silicon: F = Fast soft recovery rectifier Voltage code x 100 = VRRM S = D2PAK None = Tube TRR = Tape and reel (right oriented) TRL = Tape and reel (left oriented)
02 = 200 V 04 = 400 V 06 = 600 V
9
-
PbF = Lead (Pb)-free
LINKS TO RELATED DOCUMENTS
Dimensions Part marking information Packaging information
www.vishay.com/doc?95046 www.vishay.com/doc?95054 www.vishay.com/doc?95032
Revision: 17-Aug-11
Document Number: 94097 6 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Outline Dimensions
Vishay Semiconductors
D2PAK
DIMENSIONS in millimeters and inches
Conforms to JEDEC outline D2PAK (SMD-220) (2)(3) E (3) L1 4 (D1) (3) D H 1 L2 B B A 2 x b2 2xb 0.010 M A M B 2x e Gauge plane 0° to 8° Lead assignments Diodes 1. - Anode (two die)/open (one die) 2., 4. - Cathode 3. - Anode Lead tip L3 L L4 Detail “A” Rotated 90 °CW Scale: 8:1 A1 B Seating plane (b, b2) Section B - B and C - C Scale: None (c) c1 (4) ± 0.004 M B H C c E1 View A - A Plating (4) b1, b3 Base Metal (3) 2.64 (0.103) 2.41 (0.096) 2.32 MIN. (0.08) 2 3 (2) Detail A 17.90 (0.70) 15.00 (0.625) 3.81 MIN. (0.15) 9.65 MIN. (0.38) A A c2 A (E) B Pad layout 11.00 MIN. (0.43)
SYMBOL A A1 b b1 b2 b3 c c1 c2 D
MILLIMETERS MIN. 4.06 0.00 0.51 0.51 1.14 1.14 0.38 0.38 1.14 8.51 MAX. 4.83 0.254 0.99 0.89 1.78 1.73 0.74 0.58 1.65 9.65
INCHES MIN. 0.160 0.000 0.020 0.020 0.045 0.045 0.015 0.015 0.045 0.335 MAX. 0.190 0.010 0.039 0.035 0.070 0.068 0.029 0.023 0.065 0.380
NOTES
SYMBOL D1 E E1
MILLIMETERS MIN. 6.86 9.65 7.90 14.61 1.78 1.27 4.78 MAX. 8.00 10.67 8.80 15.88 2.79 1.65 1.78 5.28
INCHES MIN. 0.270 0.380 0.311 0.575 0.070 0.050 0.188 MAX. 0.315 0.420 0.346 0.625 0.110 0.066 0.070 0.208
NOTES 3 2, 3 3
4 4 4 2
e H L L1 L2 L3 L4
2.54 BSC
0.100 BSC
3
0.25 BSC
0.010 BSC
Notes (1) Dimensioning and tolerancing per ASME Y14.5 M-1994 (2) Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at the outmost extremes of the plastic body (3) Thermal pad contour optional within dimension E, L1, D1 and E1 (4) Dimension b1 and c1 apply to base metal only (5) Datum A and B to be determined at datum plane H (6) Controlling dimension: inch (7) Outline conforms to JEDEC outline TO-263AB
Document Number: 95046 Revision: 31-Mar-11
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ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein. Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk and agree to fully indemnify and hold Vishay and its distributors harmless from and against any and all claims, liabilities, expenses and damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that Vishay or its distributor was negligent regarding the design or manufacture of the part. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000 Revision: 11-Mar-11
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