VS-63CTQ100PbF, VS-63CTQ100-N3
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Vishay Semiconductors
Schottky Rectifier, 2 x 30 A
Base common cathode 2
FEATURES
• 175 °C TJ operation • Low forward voltage drop • High frequency operation • High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance
TO-220AB
Anode Anode 2 1 Common 3 cathode
• Guard ring for enhanced ruggedness and long term reliability • Compliant to RoHS Directive 2002/95/EC • Designed and qualified according to JEDEC-JESD47 • Halogen-free according to IEC 61249-2-21 definition (-N3 only)
PRODUCT SUMMARY
Package IF(AV) VR VF at IF IRM max. TJ max. Diode variation EAS TO-220AB 2 x 30 A 100 V 0.69 V 20 mA at 125 °C 175 °C Common cathode 11.25 mJ
DESCRIPTION
This center tap Schottky rectifier has been optimized for low reverse leakage at high temperature. The proprietary barrier technology allows for reliable operation up to 175 °C junction temperature. Typical applications are in switching power supplies, converters, freewheeling diodes, and reverse battery protection.
MAJOR RATINGS AND CHARACTERISTICS
SYMBOL IF(AV) VRRM IFRM IFSM VF TJ TC = 139 °C (per leg) tp = 5 μs sine 30 Apk, TJ = 125 °C Range CHARACTERISTICS Rectangular waveform (per device) VALUES 60 100 60 1500 0.69 - 65 to 175 UNITS A V A V °C
VOLTAGE RATINGS
PARAMETER Maximum DC reverse voltage Maximum working peak reverse voltage SYMBOL VR VRWM VS-63CTQ100PbF 100 VS-63CTQ100-N3 100 UNITS V
ABSOLUTE MAXIMUM RATINGS
PARAMETER Maximum average forward current per leg per device SYMBOL IF(AV) IFRM IFSM 10 ms sine or 6 ms rect. pulse EAS IAR TEST CONDITIONS 50 % duty cycle at TC = 139 °C, rectangular waveform Rated VR, square wave, 20 kHz, TC = 140 °C 5 µs sine or 3 µs rect. pulse Following any rated load condition and with rated VRRM applied VALUES 30 60 60 1500 300 11.25 0.75 mJ A A UNITS
Peak repetitive forward current per leg Maximum peak one cycle non-repetitive surge current per leg Non-repetitive avalanche energy per leg Repetitive avalanche current per leg
TJ = 25 °C, IAS = 0.75 A, L = 40 mH Current decaying linearly to zero in 1 μs Frequency limited by TJ maximum VA = 1.5 x VR typical
Revision: 29-Aug-11
Document Number: 94245 1 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-63CTQ100PbF, VS-63CTQ100-N3
www.vishay.com
Vishay Semiconductors
ELECTRICAL SPECIFICATIONS
PARAMETER SYMBOL 30 A Maximum forward voltage drop VFM (1) 60 A 30 A 60 A Maximum instantaneous reverse current Maximum junction capacitance Typical series inductance Maximum voltage rate of change Note (1) Pulse width < 300 μs, duty cycle < 2 % IRM CT LS dV/dt TJ = 25 °C TJ = 125 °C TEST CONDITIONS TJ = 25 °C TJ = 125 °C Rated DC voltage TYP. 0.78 0.94 0.64 0.78 0.02 11 1100 8.0 10 000 MAX. 0.82 1.0 0.69 0.83 0.3 20 mA pF nH V/µs V UNITS
VR = 5 VDC (test signal range 100 kHz to 1 MHz) 25 °C Measured from top of terminal to mounting plane Rated VR
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER Maximum junction and storage temperature range Maximum thermal resistance, junction to case per leg Typical thermal resistance, case to heatsink Approximate weight minimum maximum SYMBOL TJ, TStg RthJC RthCS DC operation Mounting surface, smooth and greased TEST CONDITIONS VALUES - 65 to 175 1.2 °C/W 0.50 2 0.07 Non-lubricated threads Case style TO-220AB 6 (5) 12 (10) g oz. kgf · cm (lbf · in) UNITS °C
Mounting torque Marking device
63CTQ100
Revision: 29-Aug-11
Document Number: 94245 2 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-63CTQ100PbF, VS-63CTQ100-N3
www.vishay.com
Vishay Semiconductors
1000
IF - Instantaneous Forward Current (A)
1000
IR - Reverse Current (mA)
100 10 1 0.1 0.01 0.001 0.0001
TJ = 175 °C TJ = 150 °C TJ = 125 °C TJ = 100 °C TJ = 75 °C TJ = 50 °C TJ = 25 °C
100
10
TJ = 175 °C TJ = 125 °C TJ = 25 °C
1 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
0
20
40
60
80
100
VFM - Forward Voltage Drop (V)
Fig. 1 - Maximum Forward Voltage Drop Characteristics
VR - Reverse Voltage (V)
Fig. 2 - Typical Values of Reverse Current vs. Reverse Voltage
1000
CT - Junction Capacitance (pF)
TJ = 25 °C
100 0 20 40 60 80 100
VR - Reverse Voltage (V)
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
ZthJC - Thermal Impedance (°C/W)
10
1
0.1
0.01
Single pulse (thermal resistance)
D = 0.75 D = 0.50 D = 0.33 D = 0.25 D = 0.20
PDM t1 t2
Notes: 1. Duty factor D = t1/t2 2. Peak TJ = PDM x ZthJC + TC 0.001 0.01 0.1 1 10
0.001 0.00001
0.0001
t1 - Rectangular Pulse Duration (s)
Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics
Revision: 29-Aug-11
Document Number: 94245 3 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-63CTQ100PbF, VS-63CTQ100-N3
www.vishay.com
Vishay Semiconductors
30 D = 0.20 D = 0.25 D = 0.33 D = 0.50 D = 0.75 RMS limit
180
Allowable Case Temperature (°C)
170 160 150 140 130 120 110 100 90 0 5 10 15 20 25 30 35 40 45 See note (1) 0 0 Square wave (D = 0.50) 80 % rated VR applied DC
Average Power Loss (W)
25 20 15 10
DC 5
5
10
15
20
25
30
35
40
45
IF(AV) - Average Forward Current (A)
Fig. 5 - Maximum Allowable Case Temperature vs. Average Forward Current
IF(AV) - Average Forward Current (A)
Fig. 6 - Forward Power Loss Characteristics
IFSM - Non-Repetitive Surge Current (A)
10 000 At any rated load condition and with rated VRRM applied following surge
1000
100 10 100 1000 10 000
tp - Square Wave Pulse Duration (µs)
Fig. 7 - Maximum Non-Repetitive Surge Current (Per Leg)
Note (1) Formula used: T = T - (Pd + Pd C J REV) x RthJC; Pd = Forward power loss = IF(AV) x VFM at (IF(AV)/D) (see fig. 6); PdREV = Inverse power loss = VR1 x IR (1 - D); IR at VR1 = 80 % rated VR
Revision: 29-Aug-11
Document Number: 94245 4 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-63CTQ100PbF, VS-63CTQ100-N3
www.vishay.com ORDERING INFORMATION TABLE
Device code
Vishay Semiconductors
VS1 1 2 3 4 5 6 7 -
63
2
C
3
T
4
Q
5
100 PbF
6 7
Vishay Semiconductors product Current rating (60 A) Circuit configuration C = Common cathode
-
Package T = TO-220
-
Schottky “Q” series Voltage rating (100 = 100 V) Environmental digit PbF = Lead (Pb)-free and RoHS compliant -N3 = Halogen-free, RoHS compliant, and totally lead (Pb)-free
-
ORDERING INFORMATION (Example)
PREFERRED P/N VS-63CTQ100PbF VS-63CTQ100-N3 QUANTITY PER T/R 50 50 MINIMUM ORDER QUANTITY 1000 1000 PACKAGING DESCRIPTION Antistatic plastic tube Antistatic plastic tube
LINKS TO RELATED DOCUMENTS Dimensions Part marking information TO-220AB PbF TO-220AB -N3 www.vishay.com/doc?95222 www.vishay.com/doc?95225 www.vishay.com/doc?95028
Revision: 29-Aug-11
Document Number: 94245 5 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Outline Dimensions
Vishay Semiconductors
TO-220AB
DIMENSIONS in millimeters and inches
(6) E E2 Q (6) (7) D2 (6) (6) D D1 1 2 3 C E1 (6) L Base metal View A - A c 2x e e1 0.015 M B A M Lead assignments Lead tip Diodes 1. - Anode/open 2. - Cathode 3. - Anode A2 A b1, b3 (4) c (b, b2) Plating c1 (4) Detail B H1 (H1) C (7) A ØP 0.014 M B A M A B Seating plane A A1 1 D C 23 D L1 (2)
Thermal pad (E)
3xb
3 x b2
Detail B
Section C - C and D - D
Conforms to JEDEC outline TO-220AB
SYMBOL
A A1 A2 b b1 4 b2 b3 4 c c1 4 D 3 D1 D2 6 Notes (1) Dimensioning and tolerancing as per ASME Y14.5M-1994 (2) Lead dimension and finish uncontrolled in L1 (3) Dimension D, D1 and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at the outermost extremes of the plastic body (4) Dimension b1, b3 and c1 apply to base metal only (5) Controlling dimensions: inches (6) Thermal pad contour optional within dimensions E, H1, D2 and E1 Document Number: 95222 Revision: 08-Mar-11
MILLIMETERS MIN. MAX. 4.25 4.65 1.14 1.40 2.56 2.92 0.69 1.01 0.38 0.97 1.20 1.73 1.14 1.73 0.36 0.61 0.36 0.56 14.85 15.25 8.38 9.02 11.68 12.88
INCHES MIN. MAX. 0.167 0.183 0.045 0.055 0.101 0.115 0.027 0.040 0.015 0.038 0.047 0.068 0.045 0.068 0.014 0.024 0.014 0.022 0.585 0.600 0.330 0.355 0.460 0.507
NOTES
SYMBOL E E1 E2 e e1 H1 L L1 ØP Q
MILLIMETERS MIN. MAX. 10.11 10.51 6.86 8.89 0.76 2.41 2.67 4.88 5.28 6.09 6.48 13.52 14.02 3.32 3.82 3.54 3.73 2.60 3.00 90° to 93°
INCHES MIN. MAX. 0.398 0.414 0.270 0.350 0.030 0.095 0.105 0.192 0.208 0.240 0.255 0.532 0.552 0.131 0.150 0.139 0.147 0.102 0.118 90° to 93°
NOTES 3, 6 6 7
6, 7 2
(7) (8)
Dimensions E2 x H1 define a zone where stamping and singulation irregularities are allowed Outline conforms to JEDEC TO-220, except A2 (maximum) and D2 (minimum) where dimensions are derived from the actual package outline
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Revision: 12-Mar-12
1
Document Number: 91000