ESH2D

ESH2B, ESH2C & ESH2D New Product Vishay General Semiconductor Surface Mount Ultrafast Plastic Rectifiers Major Ratings and Characteristics IF(AV) VRRM trr VF TJ max. 2A 100 V, 150 V, 200 V 25 ns 0.93 V 175 °C DO-214AA (SMB) Features • • • • • • • Glass passivated chip junction Ideal for automated placement Ultrafast recovery times for high efficiency Low forward voltage, low power loss High forward surge capability Meets MSL level 1 per J-STS-020C Solder Dip 260 °C, 40 seconds Mechanical Data Case: DO-214AA (SMB) Epoxy meets UL 94V-0 Flammability rating Terminals: Matte tin plated leads, solderable per J-STD-002B and JESD22-B102D E3 suffix for commercial grade, HE3 suffix for high reliability grade (AEC Q101 qualified) Polarity: Color band denotes cathode end Typical Applications For use in high frequency rectification and freewheeling application in switching mode converter and inverter for both consumer and automotive Maximum Ratings TA = 25 °C, unless otherwise specified Parameter Device marking code Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current (Fig. 1) Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load Operating junction and storage temperature range VRRM VRMS VDC IF(AV) IFSM TJ, TSTG Symbol ESH2B EHB 100 70 100 ESH2C EHC 150 105 150 2.0 60 - 55 to + 175 ESH2D EHD 200 140 200 V V V A A °C Unit Document Number 84649 17-Oct-05 www.vishay.com 1 ESH2B, ESH2C & ESH2D Vishay General Semiconductor Electrical Characteristics TA = 25 °C, unless otherwise specified Parameter Maximum instantaneous forward voltage Maximum DC reverse current at rated DC blocking voltage Maximum reverse recovery time Typical reverse recovery time Typical stored charge Typical junction capacitance Note: (1) Pulse test: 300 µs pulse width, 1 % duty cycle at IF = 2 A(1) TA = 25 °C TA = 125 °C at IF = 0.5 A, IR = 1 A, Irr = 0.25 A at IF = 2 A, VR = 30 V di/dt = 50 A/µs, Irr = 10 % IRM TJ = 25 °C TJ = 100 °C at IF = 2 A, VR = 30 V di/dt = 50 A/µs, Irr = 10 % IRM TJ = 25 °C TJ = 100 °C at 4.0 V, 1 MHz Test condition Symbol VF IR trr trr Qrr CJ Value 0.93 2.0 50 25 35 55 20 35 30 Unit V µA ns ns nC pF Thermal Characteristics TA = 25 °C, unless otherwise specified Parameter Typical thermal Note: (1) Units mounted on P.C.B. with 8.0 x 8.0 mm land areas. resistance(1) Symbol RθJA RθJL ESH2B ESH2C 65 20 ESH2D Unit °C/W Ratings and Characteristics Curves (TA = 25 °C unless otherwise specified) 2.5 60 Average Forward Rectified Current (A) Peak Forward Surge Current (A) 0 25 50 75 100 125 150 175 2 50 40 1.5 30 20 1 0.5 10 0 0 1 10 100 Lead Temperature (°C) Number of Cycles at 60 Hz Figure 1. Maximum Forward Current Derating Curve Figure 2. Maximum Non-Repetitive Peak Forward Surge Current www.vishay.com 2 Document Number 84649 17-Oct-05 ESH2B, ESH2C & ESH2D Vishay General Semiconductor 100 100 TJ = 175 °C 10 TJ = 150 °C TJ = 125 °C 1 Instantaneous Forward Current (A) Junction Capacitance (pF) 10 TJ = 25 °C 0.1 0.01 0.2 0.4 0.6 0.8 1 1.2 1.4 1 0.1 1 10 100 Instantaneous Forward Voltage (V) Reverse Voltage (V) Figure 3. Typical Instantaneous Forward Characteristics Figure 5. Typical Junction Capacitance 1000 TJ = 175 °C 100 TJ = 150 °C 10 TJ = 125 °C 100 Transient Thermal Impedance (°C/W) Instantaneous Reverse Leakage Current (µA) 10 1 0.1 TJ = 25 °C 0.01 20 40 60 80 100 1 0.01 0.1 1 10 100 Percent of Rated Peak Reverse Voltage (%) tp-Pulse Duration (sec.) Figure 4. Typical Reverse Leakage Characteristics Figure 6. Typical Transient Thermal Impedance Package dimensions in inches (millimeters) DO-214AA (SMB) Mounting Pad Layout Cathode Band 0.085 MAX. (2.159 MAX.) 0.086 (2.20) 0.077 (1.95) 0.155 (3.94) 0.130 (3.30) 0.086 MIN. (2.18 MIN.) 0.180 (4.57) 0.160 (4.06) 0.012 (0.305) 0.006 (0.152) 0.096 (2.44) 0.084 (2.13) 0.060 MIN. (1.52 MIN.) 0.220 REF 0.060 (1.52) 0.030 (0.76) 0.220 (5.59) 0.205 (5.21) 0.008 (0.2) 0 (0) Document Number 84649 17-Oct-05 www.vishay.com 3 Legal Disclaimer Notice Vishay Notice Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc., or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Vishay for any damages resulting from such improper use or sale. Document Number: 91000 Revision: 08-Apr-05 www.vishay.com 1