GT100DA120U
Vishay Semiconductors
Insulated Gate Bipolar Transistor (Trench IGBT), 100 A
FEATURES
• Trench IGBT technology temperature coefficient • Square RBSOA • 10 μs short circuit capability • HEXFRED® antiparallel diodes with ultrasoft reverse recovery
SOT-227
with
positive
• TJ maximum = 150 °C • Fully isolated package • Very low internal inductance ( 5 nH typical) • Industry standard outline • UL approved file E78996 • Compliant to RoHS directive 2002/95/EC
1200 V 100 A at 119 °C 1.73 V
PRODUCT SUMMARY
VCES IC DC VCE(on) typical at 100 A, 25 °C
BENEFITS
• Designed for increased operating efficiency in power conversion: UPS, SMPS, welding, induction heating • Easy to assemble and parallel • Direct mounting to heatsink • Plug-in compatible with other SOT-227 packages • Speed 4 kHz to 30 kHz • Very low VCE(on) • Low EMI, requires less snubbing
ABSOLUTE MAXIMUM RATINGS
PARAMETER Collector to emitter voltage Continuous collector current Pulsed collector current Clamped inductive load current Diode continuous forward current Peak diode forward current Gate to emitter voltage Power dissipation, IGBT SYMBOL VCES IC (1) ICM ILM IF IFSM VGE PD PD VISOL TC = 25 °C TC = 119 °C TC = 25 °C TC = 119 °C Any terminal to case, t = 1 min TC = 25 °C TC = 80 °C TC = 25 °C TC = 80 °C TEST CONDITIONS MAX. 1200 258 174 450 450 50 34 180 ± 20 893 221 176 44 2500 V W V A UNITS V
Power dissipation, diode Isolation voltage
Note (1) Maximum continuous collector current must be limited to 100 A to do not exceed the maximum temperature of terminals
Document Number: 93196 Revision: 22-Jul-10
For technical questions within your region, please contact one of the following: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
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GT100DA120U
Vishay Semiconductors
Insulated Gate Bipolar Transistor (Trench IGBT), 100 A
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER Collector to emitter breakdown voltage Collector to emitter voltage Gate threshold voltage Temperature coefficient of threshold voltage Collector to emitter leakage current SYMBOL VBR(CES) VCE(on) VGE(th) VGE(th)/TJ ICES TEST CONDITIONS VGE = 0 V, IC = 250 μA VGE = 15 V, IC = 100 A VGE = 15 V, IC = 100 A, TJ = 125 °C VCE = VGE, IC = 7.5 mA VCE = VGE, IC = 1 mA (25 °C to 125 °C) VGE = 0 V, VCE = 1200 V VGE = 0 V, VCE = 1200 V, TJ = 125 °C IF = 40 A, VGE = 0 V IF = 40 A, VGE = 0 V, TJ = 125 °C VGE = ± 20 V MIN. 1200 4.9 TYP. 1.73 1.98 5.9 - 17.6 0.6 0.6 2.81 3.07 MAX. 2.1 V 2.2 7.9 100 10 3.3 V 3.4 ± 200 nA mV/°C μA mA UNITS
Forward voltage drop Gate to emitter leakage current
VFM IGES
SWITCHING CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER Turn-on switching loss Turn-off switching loss Total switching loss Turn-on switching loss Turn-off switching loss Total switching loss Turn-on delay time Rise time Turn-off delay time Fall time Reverse bias safe operating area Diode reverse recovery time Diode peak reverse current Diode recovery charge Diode reverse recovery time Diode peak reverse current Diode recovery charge Short circuit safe operating area SYMBOL Eon Eoff Etot Eon Eoff Etot td(on) tr td(off) tf RBSOA trr Irr Qrr trr Irr Qrr SCSOA TJ = 150 °C, Rg = 22 , VGE = 15 V to 0 V, VCC = 900 V, Vp = 1200 V IF = 50 A, dIF/dt = 200 A/μs, Vrr = 400 V, TJ = 125 °C IF = 50 A, dIF/dt = 200 A/μs, Vrr = 400 V TJ = 150 °C, IC = 450 A, Rg = 22 VGE = 15 V to 0 V, VCC = 900 V, VP = 1200 V, L = 500 μH IC = 100 A, VCC = 720 V, VGE = 15 V, Rg = 5 L = 500 μH, TJ = 125 °C TEST CONDITIONS IC = 100 A, VCC = 720 V, VGE = 15 V, Rg = 5 L = 500 μH, TJ = 25 °C Energy losses include tail and diode recovery (see fig. 20) MIN. TYP. 5.2 7.1 12.3 6.1 9.8 15.9 350 75 374 493 Fullsquare 164 12 994 230 16.5 1864 10 194 15 1455 273 20 2730 ns A nC ns A nC μs MAX. mJ ns UNITS
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Document Number: 93196 Revision: 22-Jul-10
GT100DA120U
Insulated Gate Bipolar Transistor (Trench IGBT), 100 A
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER Maximum junction and storage temperature range IGBT Junction to case Diode Case to sink per module Mounting torque, 6-32 or M3 screw Weight RthJC RthCS SYMBOL TJ, TStg MIN. - 40 TYP. 0.1 30 MAX. 150 0.14 0.71 1.3 Nm g °C/W UNITS °C
Vishay Semiconductors
Allowable Case Temperature (°C)
160 140 IGBT DC 120 100
300 275 250 225 200 175 150 125 100 75 50 25 0 0 40 80 120 160 200 240 280
93196_03
TJ = 125 °C
IC (A)
80 60 40 20 0
TJ = 150 °C TJ = 25 °C
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
93196_01
IC - Continuous Collector Current (A)
Fig. 1 - Maximum DC IGBT Collector Current vs. Case Temperature
VCE (V)
Fig. 3 - Typical IGBT Collector Current Characteristics VGE = 15 V
Allowable Case Temperature (°C)
1000
180 160 140 120 100 80 60 40 20 0 0 10 20 30 40 50 60 Diode DC
100
IC (A)
10
1
0.1
0.01 1
93196_02
10
100
1000
10 000
93196_04
VCE (V)
Fig. 2 - IGBT Reverse Bias SOA TJ = 150 °C, VGE = 15 V
IF - Continuous Forward Current (A)
Fig. 4 - Maximum DC Forward Current vs. Case Temperature
Document Number: 93196 Revision: 22-Jul-10
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GT100DA120U
Vishay Semiconductors
200 175 150 125 TJ = 150 °C 2.25
Insulated Gate Bipolar Transistor (Trench IGBT), 100 A
2.75 2.50 150 A 100 A
VCE (V)
IF (A)
2.00 1.75
100 75 50 25 0 0 1 2
TJ = 25 °C TJ = 125 °C
50 A 1.50 1.25 27 A 1.00 3 4 5 6 7
93196_08
20
40
60
80
100
120
140
160
93196_05
VFM (V)
Fig. 5 - Typical Diode Forward Characteristics
TJ (°C)
Fig. 8 - Typical IGBT Collector to Emitter Voltage vs. Junction Temperature, VGE = 15 V
11
10 TJ = 150 °C 1 0.1 TJ = 125 °C
10 9 8
Energy (mJ)
ICES (mA)
7 6 5 4
Eoff
0.01 0.001 TJ = 25 °C 0.0001 0.00001 100
Eon
3 2 1
300
500
700
900
1100
1300 93196_09
20
30
40
50
60
70
80
90
100 110
93196_06
VCES (V)
IC (A)
Fig. 9 - Typical IGBT Energy Loss vs. IC TJ = 125 °C, L = 500 μH, VCC = 720 V, Rg = 5 , VGE = 15 V
Fig. 6 - Typical IGBT Zero Gate Voltage Collector Current
6.0 5.5 5.0 TJ = 25 °C
1000 tf td(off)
Switching Time (ns)
td(on)
Vgeth (V)
4.5 4.0 3.5 3.0 0 1 2 3 4 5 6 7 8 TJ = 125 °C
100
tr
10 20
93196_10
30
40
50
60
70
80
90
100 110
93196_07
IC (mA)
Fig. 7 - Typical IGBT Threshold Voltage
IC (A)
Fig. 10 - Typical IGBT Switching Time vs. IC TJ = 125 °C, L = 500 μH, VCC = 720 V, Rg = 5 , VGE = 15 V
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Document Number: 93196 Revision: 22-Jul-10
GT100DA120U
Insulated Gate Bipolar Transistor (Trench IGBT), 100 A
40 35 30 310 290 270 250 230
Vishay Semiconductors
Energy (mJ)
trr (ns)
25 20 15 10 5 0 10 20 30 40 50 Eoff Eon
210 190 170 150 130 110 90 100 TJ = 25 °C
TJ = 125 °C
1000
93196_11
Rg (Ω)
Fig. 11 - Typical IGBT Energy Loss vs. Rg TJ = 125 °C, IC = 100 A, L = 500 μH, VCC = 720 V, VGE = 15 V
93196_13
dIF/dt (A/μs)
Fig. 13 - Typical trr Diode vs. dIF/dt Vrr = 400 V, IF = 50 A
10 000
45 40
Switching Time (ns)
td(on) 1000 tf td(off)
35 30
Irr (A)
25 20 15 10 5
TJ = 125 °C
100
tr
TJ = 25 °C
10 0
93196_12
10
20
30
40
50 93196_14
0 100
1000
Rg (Ω)
Fig. 12 - Typical IGBT Switching Time vs. Rg TJ = 125 °C, L = 500 μH, VCC = 720 V, IC = 100 A, VGE = 15 V
3000 2500 TJ = 125 °C 2000
dIF/dt (A/μs)
Fig. 14 - Typical Irr Diode vs. dIF/dt Vrr = 400 V, IF = 50 A
Qrr (nC)
1500 1000 500 0 100 TJ = 25 °C
1000
93196_15
dIF/dt (A/μs)
Fig. 15 - Typical Qrr Diode vs. dIF/dt Vrr = 400 V, IF = 50 A
Document Number: 93196 Revision: 22-Jul-10
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GT100DA120U
Vishay Semiconductors
1
Insulated Gate Bipolar Transistor (Trench IGBT), 100 A
ZthJC - Thermal Impedance Junction to Case (°C/W)
0.1
0.01
D = 0.50 D = 0.20 D = 0.10 D = 0.05 D = 0.02 D = 0.01 DC 0.0001 0.001 0.01 0.1 1 10
0.001 0.00001
93196_16
t1 - Rectangular Pulse Duration (s)
Fig. 16 - Maximum Thermal Impedance ZthJC Characteristics (IGBT)
10
ZthJC - Thermal Impedance Junction to Case (°C/W)
1
0.1 D = 0.50 D = 0.20 D = 0.10 D = 0.05 D = 0.02 D = 0.01 DC 0.0001 0.001 0.01 0.1 1 10
0.01
0.001 0.00001
93196_17
t1 - Rectangular Pulse Duration (s)
Fig. 17 - Maximum Thermal Impedance ZthJC Characteristics (Diode)
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Document Number: 93196 Revision: 22-Jul-10
GT100DA120U
Insulated Gate Bipolar Transistor (Trench IGBT), 100 A
Vishay Semiconductors
R= L VC * 50 V 1000 V
1 2
VCC
D.U.T.
ICM
D.U.T.
Rg
+ -V
CC
* Driver same type as D.U.T.; VC = 80 % of Vce(max) * Note: Due to the 50 V power supply, pulse width and inductor will increase to obtain Id
Fig. 18a - Clamped Inductive Load Test Circuit
Fig. 18b - Pulsed Collector Current Test Circuit
Diode clamp/ D.U.T.
L
-+ -5V D.U.T./ driver Rg
+ VCC
Fig. 19a - Switching Loss Test Circuit
1
2 90 % 3 VC 90 % 10 %
td(off)
10 % IC 5% tr
td(on)
tf
t = 5 µs
Eon Ets = (Eon + Eoff)
Eoff
Fig. 19b - Switching Loss Waveforms Test Circuit
Document Number: 93196 Revision: 22-Jul-10
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GT100DA120U
Vishay Semiconductors
ORDERING INFORMATION TABLE
Device code
Insulated Gate Bipolar Transistor (Trench IGBT), 100 A
G
1 1 2 3 4 5 6 7 -
T
2
100
3
D
4
A
5
120
6
U
7
Insulated Gate Bipolar Transistor (IGBT) T = Trench IGBT technology Current rating (100 = 100 A) Circuit configuration (D = Single switch with antiparallel diode) Package indicator (A = SOT-227) Voltage rating (120 = 1200 V) Speed/type (U = Ultrafast)
CIRCUIT CONFIGURATION
3 (C)
2 (G)
1, 4 (E)
LINKS TO RELATED DOCUMENTS Dimensions Packaging information www.vishay.com/doc?95036 www.vishay.com/doc?95037
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Document Number: 93196 Revision: 22-Jul-10
Outline Dimensions
Vishay Semiconductors
SOT-227
DIMENSIONS in millimeters (inches)
38.30 (1.508) 37.80 (1.488) Ø 4.40 (0.173) Ø 4.20 (0.165) 4 4 x M4 nuts -A3 6.25 (0.246) 12.50 (0.492) 1 7.50 (0.295) 15.00 (0.590) 30.20 (1.189) 29.80 (1.173) 8.10 (0.319) 4x 7.70 (0.303) 2.10 (0.082) 1.90 (0.075) 2 R full 25.70 (1.012) 25.20 (0.992) -BChamfer 2.00 (0.079) x 45°
0.25 (0.010) M C A M B M 2.10 (0.082) 1.90 (0.075) -C0.12 (0.005)
12.30 (0.484) 11.80 (0.464)
Notes • Dimensioning and tolerancing per ANSI Y14.5M-1982 • Controlling dimension: millimeter
Document Number: 95036 Revision: 28-Aug-07
For technical questions, contact: indmodules@vishay.com
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Vishay
Disclaimer
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Document Number: 91000 Revision: 11-Mar-11
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