HFA30TA60C

HFA30TA60C Vishay High Power Products HEXFRED® Ultrafast Soft Recovery Diode, 2 x 15 A FEATURES • • • • • • • Ultrafast recovery Ultrasoft recovery Very low IRRM Very low Qrr Guaranteed avalanche Specified at operating conditions Designed and qualified for industrial level Base common cathode 2 BENEFITS • • • • • Anode 3 Anode 1 2 Common cathode Reduced RFI and EMI Reduced power loss in diode and switching transistor Higher frequency operation Reduced snubbing Reduced parts count DESCRIPTION HFA30TA60C is a state of the art center tap ultrafast recovery diode. Employing the latest in epitaxial construction and advanced processing techniques it features a superb combination of characteristics which result in performance which is unsurpassed by any rectifier previously available. With basic ratings of 600 V and 15 A per leg continuous current, the HFA30TA60C is especially well suited for use as the companion diode for IGBTs and MOSFETs. In addition to ultrafast recovery time, the HEXFRED® product line features extremely low values of peak recovery current (IRRM) and does not exhibit any tendency to “snap-off” during the tb portion of recovery. The HEXFRED features combine to offer designers a rectifier with lower noise and significantly lower switching losses in both the diode and the switching transistor. These HEXFRED advantages can help to significantly reduce snubbing, component count and heatsink sizes. The HEXFRED HFA30TA60C is ideally suited for applications in power supplies and power conversion systems (such as inverters), motor drives, and many other similar applications where high speed, high efficiency is needed. TO-220AB PRODUCT SUMMARY VR VF at 15 A at 25 °C IF(AV) trr (typical) TJ (maximum) Qrr (typical) dI(rec)M/dt (typical) at 125 °C IRRM (typical) 600 V 1.7 V 2 x 15 A 19 ns 150 °C 80 nC 160 A/µs 4.0 A ABSOLUTE MAXIMUM RATINGS PARAMETER Cathode to anode voltage Maximum continuous forward current Single pulse forward current Maximum repetitive forward current Maximum power dissipation Operating junction and storage temperature range per leg per device SYMBOL VR IF IFSM IFRM PD TJ, TStg TC = 25 °C TC = 100 °C TC = 100 °C TEST CONDITIONS VALUES 600 15 30 150 60 74 29 - 55 to + 150 W °C A UNITS V Document Number: 93091 Revision: 29-Jul-08 For technical questions, contact: diodes-tech@vishay.com www.vishay.com 1 HFA30TA60C Vishay High Power Products HEXFRED® Ultrafast Soft Recovery Diode, 2 x 15 A ELECTRICAL SPECIFICATIONS PER LEG (TJ = 25 °C unless otherwise specified) PARAMETER Cathode to anode breakdown voltage SYMBOL VBR IR = 100 µA IF = 1 5 A Maximum forward voltage VFM IF = 3 0 A IF = 15 A, TJ = 125 °C Maximum reverse leakage current Junction capacitance Series inductance IRM CT LS VR = VR rated TJ = 125 °C, VR = 0.8 x VR rated VR = 200 V See fig. 2 See fig. 3 See fig. 1 TEST CONDITIONS MIN. 600 TYP. 1.3 1.5 1.2 1.0 400 25 8 MAX. 1.7 2.0 1.6 10 1000 50 µA pF nH V UNITS Measured lead to lead 5 mm from package body DYNAMIC RECOVERY CHARACTERISTICS PER LEG (TJ = 25 °C unless otherwise specified) PARAMETER Reverse recovery time See fig. 5 and 10 Peak recovery current See fig. 6 Reverse recovery charge See fig. 7 Peak rate of fall of recovery current during tb See fig. 8 SYMBOL trr trr1 trr2 IRRM1 IRRM2 Qrr1 Qrr2 dI(rec)M/dt1 dI(rec)M/dt2 TEST CONDITIONS IF = 1.0 A, dIF/dt = 200 A/µs, VR = 30 V TJ = 25 °C TJ = 125 °C TJ = 25 °C TJ = 125 °C TJ = 25 °C TJ = 125 °C TJ = 25 °C TJ = 125 °C IF = 1 5 A dIF/dt = 200 A/µs VR = 200 V MIN. TYP. 19 42 70 4.0 6.5 80 220 250 160 MAX. 60 120 6.0 10 180 600 A/µs A ns UNITS nC THERMAL - MECHANICAL SPECIFICATIONS PER LEG PARAMETER Lead temperature Junction to case, single leg conducting Junction to case, both legs conducting Thermal resistance, junction to ambient Thermal resistance, case to heatsink Weight Mounting torque Marking device Case style TO-220AB SYMBOL Tlead TEST CONDITIONS 0.063" from case (1.6 mm) for 10 s MIN. TYP. MAX. 300 1.7 RthJC RthJA RthCS Typical socket mount Mounting surface, flat, smooth and greased 6.0 (5.0) 0.25 6.0 0.21 0.85 K/W 40 12 (10) g oz. kgf · cm (lbf · in) UNITS °C HFA30TA60C www.vishay.com 2 For technical questions, contact: diodes-tech@vishay.com Document Number: 93091 Revision: 29-Jul-08 HFA30TA60C HEXFRED® Vishay High Power Products Ultrafast Soft Recovery Diode, 2 x 15 A 10000 1000 100 100 10 1 0.1 T = 150°C J T = 125°C J TJ = 25°C 0.01 0 100 200 300 400 500 A 600 TJ = 150°C 10 Reverse Voltage - V R (V) Fig. 2 - Typical Reverse Current vs. Reverse Voltage (Per Leg) TJ = 125°C TJ = 25°C 100 A T = 25°C J 1 1.0 A 1.2 1.4 1.6 1.8 2.0 2.2 2.4 Forward Voltage Drop - V FM (V) 10 0 100 200 300 400 500 A 600 Reverse Voltage - V R (V) Fig. 1 - Maximum Forward Voltage Drop vs. Instantaneous Forward Current (Per Leg) Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage (Per Leg) 10 Thermal Response (Z thJC ) 1 D = 0.50 0.20 0.10 P DM t1 SINGLE PULSE (THERMAL RESPONSE) Notes: 1. Duty factor D = t 1 / t 2 2. Peak TJ = P DM x ZthJC + TC 0.0001 0.001 0.01 0.1 1 t2 0.1 0.05 0.02 0.01 0.01 0.00001 t1 , Rectangular Pulse Duration (sec) Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics (Per Leg) Document Number: 93091 Revision: 29-Jul-08 For technical questions, contact: diodes-tech@vishay.com www.vishay.com 3 HFA30TA60C Vishay High Power Products HEXFRED® Ultrafast Soft Recovery Diode, 2 x 15 A 800 100 I F = 30A I F = 15A 80 VR = 200V TJ = 125°C TJ = 25°C I F = 5.0A 600 I F = 30A I F = 15A 60 400 40 IF = 5.0A 200 20 VR = 200V TJ = 125°C TJ = 25°C 0 100 A A 0 100 di f /dt - (A/µs) 1000 di f /dt - (A/µs) 1000 Fig. 5 - Typical Reverse Recovery Time vs. dIF/dt (Per Leg) Fig. 7 - Typical Stored Charge vs. dIF/dt (Per Leg) 25 VR = 200V TJ = 125°C TJ = 25°C 20 10000 VR = 200V TJ = 125°C TJ = 25°C I F = 30A I F = 15A I F = 5.0A 15 1000 10 I F = 30A I F = 15A I F = 5.0A 5 0 100 A di f /dt - (A/µs) 1000 100 100 A di f /dt - (A/µs) 1000 Fig. 6 - Typical Recovery Current vs. dIF/dt (Per Leg) Fig. 8 - Typical dI(rec)M/dt vs. dIF/dt (Per Leg) www.vishay.com 4 For technical questions, contact: diodes-tech@vishay.com Document Number: 93091 Revision: 29-Jul-08 HFA30TA60C HEXFRED® Vishay High Power Products Ultrafast Soft Recovery Diode, 2 x 15 A VR = 200 V 0.01 Ω L = 70 µH D.U.T. dIF/dt adjust D G IRFP250 S Fig. 9 - Reverse Recovery Parameter Test Circuit (3) IF 0 trr ta tb Qrr (2) (4) IRRM 0.5 IRRM dI(rec)M/dt (5) 0.75 IRRM (1) dIF/dt (1) dIF/dt - rate of change of current through zero crossing (2) IRRM - peak reverse recovery current (3) trr - reverse recovery time measured from zero crossing point of negative going IF to point where a line passing through 0.75 IRRM and 0.50 IRRM extrapolated to zero current. (4) Qrr - area under cur ve defined by trr and IRRM Qrr = trr x IRRM 2 (5) dI(rec)M/dt - peak rate of change of current during tb portion of trr Fig. 10 - Reverse Recovery Waveform and Definitions L = 100 µH High-speed switch Rg = 25 Ω Current monitor Freewheel diode IL(PK) D.U.T. + Vd = 50 V V(AVAL) VR(RATED) Decay time Fig. 11 - Avalanche Test Circuit and Waveforms LINKS TO RELATED DOCUMENTS Dimensions Part marking information http://www.vishay.com/doc?95222 http://www.vishay.com/doc?95225 Document Number: 93091 Revision: 29-Jul-08 For technical questions, contact: diodes-tech@vishay.com www.vishay.com 5 Legal Disclaimer Notice Vishay Disclaimer All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. 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