HFB16PA60CPBF

HFA16PA60C Vishay High Power Products HEXFRED® Ultrafast, Soft Recovery Diode, 2 x 8 A FEATURES • • • • • • Ultrafast recovery Ultrasoft recovery Very low IRRM Very low Qrr Specified at operating conditions Designed and qualified for industrial level Base common cathode 2 BENEFITS • • • • • Reduced RFI and EMI Reduced power loss in diode and switching transistor Higher frequency operation Reduced snubbing Reduced parts count TO-247AC 1 3 Anode Anode 2 1 2 Common cathode DESCRIPTION HFA16PA60C is a state of the art center tap ultrafast recovery diode. Employing the latest in epitaxial construction and advanced processing techniques it features a superb combination of characteristics which result in performance which is unsurpassed by any rectifier previously available. With basic ratings of 600 V and 8 A per leg continuous current, the HFA16PA60C is especially well suited for use as the companion diode for IGBTs and MOSFETs. In addition to ultrafast recovery time, the HEXFRED® product line features extremely low values of peak recovery current (IRRM) and does not exhibit any tendency to “snap-off” during the tb portion of recovery. The HEXFRED features combine to offer designers a rectifier with lower noise and significantly lower switching losses in both the diode and the switching transistor. These HEXFRED advantages can help to significantly reduce snubbing, component count and heatsink sizes. The HEXFRED HFA16PA60C is ideally suited for applications in power supplies and power conversion systems (such as inverters), motor drives, and many other similar applications where high speed, high efficiency is needed. PRODUCT SUMMARY VR VF at 8 A at 25 °C IF(AV) trr (typical) TJ (maximum) Qrr dI(rec)M/dt 600 V 1.7 V 2x8A 18 ns 150 °C 65 nC 240 A/µs ABSOLUTE MAXIMUM RATINGS PARAMETER Cathode to anode voltage Maximum continuous forward current Single pulse forward current Maximum repetitive forward current Maximum power dissipation Operating junction and storage temperature range per leg per device SYMBOL VR IF IFSM IFRM PD TJ, TStg TC = 25 °C TC = 100 °C TC = 100 °C TEST CONDITIONS VALUES 600 8 16 60 24 36 14 - 55 to + 150 W °C A UNITS V Document Number: 93070 Revision: 29-Jul-08 For technical questions, contact: diodes-tech@vishay.com www.vishay.com 1 HFA16PA60C Vishay High Power Products HEXFRED® Ultrafast, Soft Recovery Diode, 2 x 8 A ELECTRICAL SPECIFICATIONS PER LEG (TJ = 25 °C unless otherwise specified) PARAMETER Cathode to anode breakdown voltage SYMBOL VBR IR = 100 µA IF = 8.0 A Maximum forward voltage VFM IF = 1 6 A IF = 8.0 A, TJ = 125 °C Maximum reverse leakage current Junction capacitance Series inductance IRM CT LS VR = VR rated TJ = 125 °C, VR = 0.8 x VR rated VR = 200 V See fig. 2 See fig. 3 See fig. 1 TEST CONDITIONS MIN. 600 TYP. 1.4 1.7 1.4 0.3 100 10 8.0 MAX. 1.7 2.1 1.7 5.0 500 25 µA pF nH V UNITS Measured lead to lead 5 mm from package body DYNAMIC RECOVERY CHARACTERISTICS PER LEG (TJ = 25 °C unless otherwise specified) PARAMETER Reverse recovery time See fig. 5, 6 and 16 Peak recovery current See fig. 7 and 8 Reverse recovery charge See fig. 9 and 10 Peak rate of fall recovery current during tb See fig. 11 and 12 SYMBOL trr trr1 trr2 IRRM1 IRRM2 Qrr1 Qrr2 dI(rec)M/dt1 dI(rec)M/dt2 TEST CONDITIONS IF = 1.0 A, dIF/dt = 200 A/µs, VR = 30 V TJ = 25 °C TJ = 125 °C TJ = 25 °C TJ = 125 °C TJ = 25 °C TJ = 125 °C TJ = 25 °C TJ = 125 °C IF = 8.0 A dIF/dt = 200 A/µs VR = 200 V MIN. TYP. 18 37 55 3.5 4.5 65 124 240 210 MAX. 55 90 5.0 8.0 138 360 A/µs A ns UNITS nC THERMAL - MECHANICAL SPECIFICATIONS PARAMETER Lead temperature Junction to case, single leg conducting Junction to case, both leg conducting Thermal resistance, junction to ambient Thermal resistance, case to heatsink Weight Mounting torque Marking device Case style TO-247AC (JEDEC) RthJA RthCS Typical socket mount Mounting surface, flat, smooth and greased SYMBOL Tlead TEST CONDITIONS 0.063" from case (1.6 mm) for 10 s MIN. RthJC 6.0 (5.0) 0.25 6.0 0.21 1.75 K/W 40 12 (10) g oz. kgf · cm (lbf · in) TYP. MAX. 300 3.5 UNITS °C HFA16PA60C www.vishay.com 2 For technical questions, contact: diodes-tech@vishay.com Document Number: 93070 Revision: 29-Jul-08 HFA16PA60C HEXFRED® Vishay High Power Products Ultrafast, Soft Recovery Diode, 2 x 8 A 1000 TJ = 150°C 100 100 10 1 0.1 0.01 TJ = 125°C TJ = 25°C 10 TJ = 150°C TJ = 125°C T = 25°C J 0.001 0 100 200 300 400 500 600 Reverse Voltage - V R(V) Fig. 2 - Typical Reverse Current vs. Reverse Voltage (Per Leg) 1 100 A TJ = 25°C 10 0.1 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 A Forward Voltage Drop - VFM (V) 1 1 10 100 1000 Reverse Voltage - V R V) ( Fig. 1 - Maximum Forward Voltage Drop vs. Instantaneous Forward Current (Per Leg) Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage (Per Leg) 10 Thermal Response (Z thJC ) D = 0.50 1 0.20 0.10 0.05 0.02 0.01 SINGLE PULSE (THERMAL RESPONSE) PDM t1 t2 Notes: 1. Duty factor D = t 1 / t 2 2. Peak TJ = P DM x Z thJC + TC 0.0001 0.001 0.01 0.1 1 0.1 0.01 0.00001 t1 , Rectangular Pulse Duration (sec) Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics (Per Leg) Document Number: 93070 Revision: 29-Jul-08 For technical questions, contact: diodes-tech@vishay.com www.vishay.com 3 HFA16PA60C Vishay High Power Products HEXFRED® Ultrafast, Soft Recovery Diode, 2 x 8 A 500 80 I F = 16A IF = 8.0A F I F = 4.0A 60 VR = 200V TJ = 125°C TJ = 25°C 400 I F = 16A IF = 8.0A IF = 4.0A trr - (ns) 300 40 200 20 100 VR = 200V TJ = 125°C TJ = 25°C 0 100 1000 dI f /dt - (A/µs) 0 100 dI f /dt - (A/µs) 1000 Fig. 5 - Typical Reverse Recovery Time vs. dIF/dt (Per Leg) Fig. 7 - Typical Stored Charge vs. dIF/dt (Per Leg) 20 VR = 200V TJ = 125°C TJ = 25°C 16 10000 VR = 200V TJ = 125°C TJ = 25°C I F = 16A I F = 8.0A I F = 4.0A IF = 16A I F = 8.0A IF = 4.0A 1000 12 8 4 0 100 dI f /dt - (A/µs) 1000 100 100 dI f /dt - (A/µs) Fig. 8 - Typical dI(rec)M/dt vs. dIF/dt (Per Leg) 1000 Fig. 6 - Typical Recovery Current vs. dIF/dt (Per Leg) www.vishay.com 4 For technical questions, contact: diodes-tech@vishay.com Document Number: 93070 Revision: 29-Jul-08 HFA16PA60C HEXFRED® Vishay High Power Products Ultrafast, Soft Recovery Diode, 2 x 8 A VR = 200 V 0.01 Ω L = 70 µH D.U.T. dIF/dt adjust D G IRFP250 S Fig. 9 - Reverse Recovery Parameter Test Circuit (3) IF 0 trr ta tb Qrr (2) (4) IRRM 0.5 IRRM dI(rec)M/dt (5) 0.75 IRRM (1) dIF/dt (1) dIF/dt - rate of change of current through zero crossing (2) IRRM - peak reverse recovery current (3) trr - reverse recovery time measured from zero crossing point of negative going IF to point where a line passing through 0.75 IRRM and 0.50 IRRM extrapolated to zero current. (4) Qrr - area under cur ve defined by trr and IRRM Qrr = trr x IRRM 2 (5) dI(rec)M/dt - peak rate of change of current during tb portion of trr Fig. 10 - Reverse Recovery Waveform and Definitions Document Number: 93070 Revision: 29-Jul-08 For technical questions, contact: diodes-tech@vishay.com www.vishay.com 5 HFA16PA60C Vishay High Power Products HEXFRED® Ultrafast, Soft Recovery Diode, 2 x 8 A ORDERING INFORMATION TABLE Device code HF 1 1 2 - A 2 16 3 PA 4 60 5 C 6 7 HEXFRED® family Process designator: A = Subs. elec. irrad. B = Subs. platinum 3 4 5 6 7 - Current rating (16 = 16 A) Package outline (PA = TO-247, 3 pins) Voltage rating (60 = 600 V) Configuration (C = Center tap common cathode) None = Standard production PbF = Lead (Pb)-free LINKS TO RELATED DOCUMENTS Dimensions Part marking information http://www.vishay.com/doc?95223 http://www.vishay.com/doc?95226 www.vishay.com 6 For technical questions, contact: diodes-tech@vishay.com Document Number: 93070 Revision: 29-Jul-08 Legal Disclaimer Notice Vishay Disclaimer All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 18-Jul-08 www.vishay.com 1