IRFU110

IRFR110, IRFU110, SiHFR110, SiHFU110 Vishay Siliconix Power MOSFET PRODUCT SUMMARY VDS (V) RDS(on) (Ω) Qg (Max.) (nC) Qgs (nC) Qgd (nC) Configuration VGS = 10 V 8.3 2.3 3.8 Single D FEATURES 100 0.54 • Dynamic dV/dt Rating • Repetitive Avalanche Rated • Surface Mount (IRFR110/SiHFR110) • Straight Lead (IRFU110/SiHFU110) • Available in Tape and Reel • Fast Switching • Ease of Paralleling • Lead (Pb)-free Available Available RoHS* COMPLIANT DPAK (TO-252) IPAK (TO-251) G DESCRIPTION Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The DPAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. The straight lead version (IRFU/SiHFU series) is for through-hole mounting applications. Power dissipation levels up to 1.5 W are possible in typical surcace mount applications. S N-Channel MOSFET ORDERING INFORMATION Package Lead (Pb)-free SnPb DPAK (TO-252) IRFR110PbF SiHFR110-E3 IRFR110 SiHFR110 DPAK (TO-252) IRFR110TRLPbFa SiHFR110TL-E3a IRFR110TRLa SiHFR110TLa DPAK (TO-252) IRFR110TRPbFa SiHFR110T-E3a IRFR110TRa SiHFR110Ta DPAK (TO-252) IRFR110TRRPbFa SiHFR110TR-E3a IPAK (TO-251) IRFU110PbF SiHFU110-E3 IRFU110 SiHFU110 Note a. See device orientation. ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted PARAMETER Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Pulsed Drain Currenta VGS at 10 V TC = 25 °C TC = 100 °C SYMBOL VDS VGS ID IDM LIMIT 100 ± 20 4.3 2.7 17 0.20 0.020 EAS IAR EAR TC = 25 °C TA = 25 °C PD dV/dt 100 4.3 2.5 25 2.5 5.5 W/°C mJ A mJ W V/ns A UNIT V Linear Derating Factor Linear Derating Factor (PCB Mount)e Single Pulse Avalanche Energyb Repetitive Avalanche Currenta Repetitive Avalanche Energya Maximum Power Dissipation Maximum Power Dissipation (PCB Mount)e Peak Diode Recovery dV/dtc * Pb containing terminations are not RoHS compliant, exemptions may apply Document Number: 91265 S-81394-Rev. A, 21-Jul-08 www.vishay.com 1 IRFR110, IRFU110, SiHFR110, SiHFU110 Vishay Siliconix ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted PARAMETER Operating Junction and Storage Temperature Range Soldering Recommendations (Peak Temperature) for 10 s Notes a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11). b. VDD = 25 V, starting TJ = 25 °C, L = 8.1 mH, RG = 25 Ω, IAS = 4.3 A (see fig. 12). c. ISD ≤ 5.6 A, dI/dt ≤ 75 A/µs, VDD ≤ VDS, TJ ≤ 150 °C. d. 1.6 mm from case. e. When mounted on 1” square PCB (FR-4 or G-10 material). SYMBOL TJ, Tstg LIMIT - 55 to + 150 260d UNIT °C THERMAL RESISTANCE RATINGS PARAMETER Maximum Junction-to-Ambient Maximum Junction-to-Ambient (PCB Mount)a Maximum Junction-to-Case (Drain) SYMBOL RthJA RthJA RthJC TYP. MAX. 110 50 5.0 °C/W UNIT Note a. When mounted on 1” square PCB (FR-4 or G-10 material). SPECIFICATIONS TJ = 25 °C, unless otherwise noted PARAMETER Static Drain-Source Breakdown Voltage VDS Temperature Coefficient Gate-Source Threshold Voltage Gate-Source Leakage Zero Gate Voltage Drain Current Drain-Source On-State Resistance Forward Transconductance Dynamic Input Capacitance Output Capacitance Reverse Transfer Capacitance Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Internal Drain Inductance Internal Source Inductance Ciss Coss Crss Qg Qgs Qgd td(on) tr td(off) tf LD LS Between lead, 6 mm (0.25") from package and center of die contact D SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT VDS ΔVDS/TJ VGS(th) IGSS IDSS RDS(on) gfs VGS = 0 V, ID = 250 µA Reference to 25 °C, ID = 1 mA VDS = VGS, ID = 250 µA VGS = ± 20 V VDS = 100 V, VGS = 0 V VDS = 80 V, VGS = 0 V, TJ = 125 °C VGS = 10 V ID = 2.6 Ab 100 2.0 1.6 0.13 - 4.0 ± 100 25 250 0.54 - V V/°C V nA µA Ω S VDS = 50 V, ID = 2.6 A VGS = 0 V, VDS = 25 V, f = 1.0 MHz, see fig. 5 - 180 80 15 6.9 16 15 9.4 4.5 7.5 8.3 2.3 3.8 nH ns nC pF VGS = 10 V ID = 5.6 A, VDS = 80 V, see fig. 6 and 13b - VDD = 50 V, ID = 5.6 A, RG = 24 Ω, RD = 8.4 Ω, see fig. 10b - G S www.vishay.com 2 Document Number: 91265 S-81394-Rev. A, 21-Jul-08 IRFR110, IRFU110, SiHFR110, SiHFU110 Vishay Siliconix SPECIFICATIONS TJ = 25 °C, unless otherwise noted PARAMETER Drain-Source Body Diode Characteristics Continuous Source-Drain Diode Current Pulsed Diode Forward Currenta Body Diode Voltage Body Diode Reverse Recovery Time Body Diode Reverse Recovery Charge Forward Turn-On Time IS ISM VSD trr Qrr ton MOSFET symbol showing the integral reverse p - n junction diode D SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT - 100 0.44 4.3 A 17 2.5 200 0.88 V ns µC G S TJ = 25 °C, IS = 4.3 A, VGS = 0 Vb TJ = 25 °C, IF = 5.6 A, dI/dt = 100 A/µsb Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD) Notes a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11). b. Pulse width ≤ 300 µs; duty cycle ≤ 2 %. TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted Fig. 1 - Typical Output Characteristics, TC = 25 °C Fig. 3 - Typical Transfer Characteristics Fig. 2 -Typical Output Characteristics, TC = 150 °C Document Number: 91265 S-81394-Rev. A, 21-Jul-08 Fig. 4 - Normalized On-Resistance vs. Temperature www.vishay.com 3 IRFR110, IRFU110, SiHFR110, SiHFU110 Vishay Siliconix Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage Fig. 7 - Typical Source-Drain Diode Forward Voltage Fig. 6 - Typical Gate Charge vs. Gate-to-Source Voltage Fig. 8 - Maximum Safe Operating Area www.vishay.com 4 Document Number: 91265 S-81394-Rev. A, 21-Jul-08 IRFR110, IRFU110, SiHFR110, SiHFU110 Vishay Siliconix RD VDS VGS RG D.U.T. + - VDD 10 V Pulse width ≤ 1 µs Duty factor ≤ 0.1 % Fig. 10a - Switching Time Test Circuit VDS 90 % Fig. 9 - Maximum Drain Current vs. Case Temperature 10 % VGS td(on) tr td(off) tf Fig. 10b - Switching Time Waveforms Fig. 11 - Maximum Effective Transient Thermal Impedance, Junction-to-Case L Vary tp to obtain required IAS RG VDS VDS tp VDD D.U.T. IAS + - V DD A VDS 10 V tp 0.01 Ω IAS Fig. 12a - Unclamped Inductive Test Circuit Fig. 12b - Unclamped Inductive Waveforms Document Number: 91265 S-81394-Rev. A, 21-Jul-08 www.vishay.com 5 IRFR110, IRFU110, SiHFR110, SiHFU110 Vishay Siliconix Fig. 12c - Maximum Avalanche Energy vs. Drain Current Current regulator Same type as D.U.T. 50 kΩ 12 V 10 V QGS QG 0.2 µF 0.3 µF QGD D.U.T. + - VDS VG VGS 3 mA Charge IG ID Current sampling resistors Fig. 13a - Basic Gate Charge Waveform Fig. 13b - Gate Charge Test Circuit www.vishay.com 6 Document Number: 91265 S-81394-Rev. A, 21-Jul-08 IRFR110, IRFU110, SiHFR110, SiHFU110 Vishay Siliconix Peak Diode Recovery dV/dt Test Circuit D.U.T. + Circuit layout considerations • Low stray inductance • Ground plane • Low leakage inductance current transformer + + - RG • dV/dt controlled by R G • ISD controlled by duty factor "D" • D.U.T. - device under test + VDD Driver gate drive P.W. Period D= P.W. Period VGS = 10 V* D.U.T. ISD waveform Reverse recovery current Body diode forward current dI/dt D.U.T. VDS waveform Diode recovery dV/dt VDD Re-applied voltage Inductor current Body diode forward drop Ripple ≤ 5 % ISD * VGS = 5 V for logic level devices and 3 V drive devices Fig. 14 -For N-Channel Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see http://www.vishay.com/ppg?91265. Document Number: 91265 S-81394-Rev. A, 21-Jul-08 www.vishay.com 7 Legal Disclaimer Notice Vishay Disclaimer All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 18-Jul-08 www.vishay.com 1