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SI1470DH-T1-E3

SI1470DH-T1-E3

  • 厂商:

    VISHAY

  • 封装:

  • 描述:

    SI1470DH-T1-E3 - N-Channel 30-V (D-S) MOSFET - Vishay Siliconix

  • 数据手册
  • 价格&库存
SI1470DH-T1-E3 数据手册
Si1470DH New Product Vishay Siliconix N-Channel 30-V (D-S) MOSFET PRODUCT SUMMARY VDS (V) 30 rDS(on) (Ω) 0.066 at VGS = 4.5 V 0.095 at VGS = 2.5 V ID (A) 4.0a 4.0 Qg (Typ) 4.85 FEATURES • TrenchFET® Power MOSFET • 100 % Rg and UIS Tested APPLICATIONS • Load Switch RoHS COMPLIANT SOT-363 SC-70 (6-LEADS) D 6 D Marking Code AK XX YY D 1 D 2 5 D G Lot Traceability and Date Code G 3 4 S Part # Code S Top View Ordering Information: Si1470DH-T1-E3 (Lead (Pb)-free) N-Channel MOSFET ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted Parameter Drain-Source Voltage Gate-Source Voltage TC = 25 °C TC = 70 °C TA = 25 °C TA = 70 °C Symbol VDS VGS Limit 30 ± 12 5.1 4.0 3.8b, c 3.1b, c 12 10 5 2.3 1.3b, c 2.8 1.8 1.5b, c 1.0b, c - 55 to 150 Unit V Continuous Drain Current (TJ = 150 °C)a ID A Pulsed Drain Current Avalanche Current Repetitive Avalanche Energy Continuous Source-Drain Diode Current L = 0.1 mH TC = 25 °C TA = 25 °C TC = 25 °C TC = 70 °C TA = 25 °C TA = 70 °C IDM IAS EAS IS mJ A Maximum Power Dissipationa PD W Operating Junction and Storage Temperature Range TJ, Tstg °C THERMAL RESISTANCE RATINGS Parameter Maximum Junction-to-Ambientb, d Maximum Junction-to-Foot (Drain) Notes: a. Based on TC = 25 °C. b. Surface Mounted on 1" x 1" FR4 board. c. t = 5 sec. d. Maximum under Steady State conditions is 125 °C/W. Document Number: 74277 S-62443–Rev. A, 27-Nov-06 www.vishay.com 1 t ≤ 5 sec Steady State Symbol RthJA RthJF Typical 60 34 Maximum 80 45 Unit °C/W Si1470DH Vishay Siliconix SPECIFICATIONS TJ = 25 °C, unless otherwise noted Parameter Static Drain-Source Breakdown Voltage VDS Temperature Coefficient VGS(th) Temperature Coefficient Gate-Source Threshold Voltage Gate-Source Leakage Zero Gate Voltage Drain Current On-State Drain Currenta Drain-Source On-State Resistancea Forward Transconductance Dynamic Input Capacitance Output Capacitance Reverse Transfer Capacitance Total Gate Charge Gate-Source Charge Gate-Drain Charge Gate Resistance Turn-On Delay Time Rise Time Turn-Off DelayTime Fall Time Drain-Source Body Diode Characteristics Continous Source-Drain Diode Current Pulse Diode Forward Body Diode Voltage Currenta IS ISM VSD trr Qrr ta tb IF = 2.3 A, di/dt = 100 A/µs IS = 1.8 A 0.8 11.5 5.2 7.7 3.8 TC = 25 °C 2.3 12 1.2 17.25 7.8 ns A V nC b Symbol VDS ΔVDS/TJ ΔVGS(th)/ TJ VGS(th) IGSS IDSS ID(on) rDS(on) gfs Ciss Coss Crss Qg Qgs Qgd Rg td(on) tr td(off) tf Test Conditions VGS = 0 V, ID = 250 µA ID = 250 µA VDS = VGS, ID = 250 µA VDS = 0 V, VGS = ± 12 V VDS = 30 V, VGS = 0 V VDS = 30 V, VGS = 0 V, TJ = 85 °C VDS = ≥ 5 V, VGS = 4.5 V VGS = 4.5 V, ID = 3.8 A VGS = 2.5 V, ID = 3.1 A VDS = 15 V, ID = 3.8 A Min 30 Typ Max Unit V 27.41 - 3.83 0.6 1.6 ± 100 1 10 12 0.055 0.079 11.2 510 VDS = 15 V, VGS = 0 V, f = 1 MHz VDS = 15 V, VGS = 5 V, ID = 3.8 A VDS = 15 V, VGS = 4.5 V, ID = 3.8 A f = 1 MHz VDD = 15 V, RL = 5.0 Ω ID ≅ 3.0 A, VGEN = 4.5 V, Rg = 1 Ω 66 39 5 4.85 1.35 1.26 7.3 9.0 51 18 7.1 10.95 15 77 27 10.65 ns Ω 7.5 7.3 nC pF 0.066 0.095 mV/°C V nA nA µA A Ω S Body Diode Reverse Recovery Time Body Diode Reverse Recovery Charge Reverse Recovery Fall Time Reverse Recovery Rise Time Notes: a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %. b. Guaranteed by design, not subject to production testing. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. www.vishay.com 2 Document Number: 74277 S-62443–Rev. A, 27-Nov-06 Si1470DH Vishay Siliconix TYPICAL CHARACTERISTICS 12 VGS = 5 thru 3 V 2.5 I D – Drain Current (A) 9 VGS = 2.5 V I D – Drain Current (A) TA = 25 °C, unless otherwise noted 3.0 2.0 6 1.5 TC = 125 °C 1.0 TC = 25 °C 0.5 3 V GS = 2 V V GS = 1.5 V 0 0.0 0.5 1.0 1.5 2.0 2.5 0.0 0.0 0.5 1.0 1.5 TC = - 55 °C 2.0 2.5 VDS – Drain-to-Source Voltage (V) VGS – Gate-to-Source Voltage (V) Output Characteristics 0.15 800 Transfer Characteristics curves vs. Temp rDS(on) – On-Resistance (Ω) 0.12 C – Capacitance (pF) VGS = 2.5 V 0.09 VGS = 4.5 V 600 Ciss 400 0.06 200 0.03 Coss Crss 0 6 12 18 24 30 0.00 0 3 6 ID – Drain Current (A) 9 12 0 VDS – Drain-to-Source Voltage (V) On-Resistance vs. Drain Current 5 ID = 3.7 A V GS – Gate-to-Source Voltage (V) 4 VDS = 15 V 1.4 rDS(on) – On-Resistance (Normalized) 1.6 Capacitance VGS = 4.5 V ID = 3.7 A, 4.1 A VGS = 2.5 V ID = 3.1 A 3 VDS = 24 V 1.2 2 1.0 1 0.8 0 0 2 4 6 0.6 - 50 - 25 0 25 50 75 100 125 150 Qg – Total Gate Charge (nC) TJ – Junction Temperature (°C) Qg - Gate Charge On-Resistance vs. Junction Temperature Document Number: 74277 S-62443–Rev. A, 27-Nov-06 www.vishay.com 3 Si1470DH Vishay Siliconix TYPICAL CHARACTERISTICS TA = 25 °C, unless otherwise noted 10 rDS(on) – Drain-to-Source On-Resistance (Ω) 0.16 ID = 3.7 A 0.12 TA = 125 °C 0.08 TA = 25 °C I S – Source Current (A) 1 TJ = 150 °C TJ = 25 °C 0.1 0.04 0.01 0 0.2 0.4 0.6 0.8 1 1.2 VSD – Source-to-Drain Voltage (V) 0.00 0 1 2 3 4 5 VGS – Gate-to-Source Voltage (V) Source-Drain Diode Forward Voltage 1.5 30 25 1.3 ID = 250 µA VGS(th) (V) 1.1 Power (W) 20 rDS(on) vs VGS vs Temperature 15 0.9 10 0.7 5 0.5 - 50 - 25 0 25 50 75 100 125 150 0 0.001 0.01 0.1 1 Time (sec) 10 100 600 TJ – Temperature (°C) Threshold Voltage 100 *Limited by rDS(on) Single Pulse Power 10 I D – Drain Current (A) 10 ms 1 100 ms 1s 10 s dc 0.01 TA = 25 °C Single Pulse 0.1 *VGS 1 10 100 0.1 0.001 VDS – Drain-to-Source Voltage (V) minimum VGS at which rDS(on) is specified Safe Operating Area, Junction-to-Ambient www.vishay.com 4 Document Number: 74277 S-62443–Rev. A, 27-Nov-06 Si1470DH Vishay Siliconix TYPICAL CHARACTERISTICS 6 TA = 25 °C, unless otherwise noted 3.6 5 3.0 ID – Drain Current (A) Package Limited 3 Power (W) 4 2.4 1.8 2 1.2 1 0.6 0 0 25 50 75 100 125 150 0.0 0 25 50 75 100 125 150 TC – Case Temperature (°C) TC – Case Temperature (°C) Current Derating* Power Derating * The power dissipation PD is based on TJ(max) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package limit. Document Number: 74277 S-62443–Rev. A, 27-Nov-06 www.vishay.com 5 Si1470DH Vishay Siliconix TYPICAL CHARACTERISTICS TA = 25 °C, unless otherwise noted 2 1 Duty Cycle = 0.5 Normalized Effective Transient Thermal Impedance 0.2 Notes: 0.1 0.1 0.05 t1 PDM 0.02 t2 1. Duty Cycle, D = t1 t2 2. Per Unit Base = RthJA = 100 °C/W Single Pulse 0.01 10-4 10-3 10-2 10-1 1 Square Wave Pulse Duration (sec) 3. TJM – TA = PDMZthJA(t) 4. Surface Mounted 10 100 600 Normalized Thermal Transient Impedance, Junction-to-Ambient 2 1 Duty Cycle = 0.5 Normalized Effective Transient Thermal Impedance 0.2 0.1 0.1 0.05 0.02 Single Pulse 0.01 10-4 10-3 10-2 10-1 Square Wave Pulse Duration (sec) 1 10 Normalized Thermal Transient Impedance, Junction-to-Foot Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see http://www.vishay.com/ppg?74277. www.vishay.com 6 Document Number: 74277 S-62443–Rev. A, 27-Nov-06 Legal Disclaimer Notice Vishay Disclaimer All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 18-Jul-08 www.vishay.com 1
SI1470DH-T1-E3 价格&库存

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