SI4172DY

Si4172DY Vishay Siliconix N-Channel 30-V (D-S) MOSFET PRODUCT SUMMARY VDS (V) 30 RDS(on) (Ω) 0.012 at VGS = 10 V 0.015 at VGS = 4.5 V ID (A)a 15 13 Qg (Typ.) 6.8 nC FEATURES • Halogen-free • TrenchFET® Power MOSFET • Optimized for High-Side Synchronous Rectifier Operation • 100 % Rg Tested • 100 % UIS Tested APPLICATIONS • Notebook CPU Core - High-Side Switch SO-8 S S S G 1 2 3 4 Top View Ordering Information: Si4172DY-T1-GE3 (Lead (Pb)-free and Halogen-free) 8 7 6 5 D D D D G D S N-Channel MOSFET ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150 °C) TC = 25 °C TC = 70 °C TA = 25 °C TA = 70 °C TC = 25 °C TA = 25 °C L = 0.1 mH TC = 25 °C TC = 70 °C TA = 25 °C TA = 70 °C Symbol VDS VGS ID IDM IS IAS EAS PD TJ, Tstg Limit 30 ± 20 15 12 11b, c 9b, c 50 3.8 2.1b, c 22 24 4.5 2.8 2.5b, c 1.6b, c - 55 to 150 Unit V Pulsed Drain Current Continuous Source-Drain Diode Current Single Pulse Avalanche Current Avalanche Energy A mJ Maximum Power Dissipation W Operating Junction and Storage Temperature Range °C THERMAL RESISTANCE RATINGS Parameter Maximum Junction-to-Ambientb, d Maximum Junction-to-Foot (Drain) Notes: a. Base on TC = 25 °C. b. Surface Mounted on 1" x 1" FR4 board. c. t = 10 s. d. Maximum under Steady State conditions is 85 °C/W. Document Number: 69000 S-82665-Rev. A, 03-Nov-08 www.vishay.com 1 t ≤ 10 s Steady State Symbol RthJA RthJF Typical 38 22 Maximum 50 28 Unit °C/W Si4172DY Vishay Siliconix SPECIFICATIONS TJ = 25 °C, unless otherwise noted Parameter Static Drain-Source Breakdown Voltage VDS Temperature Coefficient VGS(th) Temperature Coefficient Gate-Source Threshold Voltage Gate-Source Leakage Zero Gate Voltage Drain Current On-State Drain Currenta Drain-Source On-State Resistancea Forward Transconductancea Dynamic b Symbol VDS ΔVDS/TJ ΔVGS(th)/TJ VGS(th) IGSS IDSS ID(on) RDS(on) gfs Ciss Coss Crss Qg Qgs Qgd Rg td(on) tr td(off) tf td(on) tr td(off) tf IS ISM VSD trr Qrr ta tb Test Conditions VGS = 0 V, ID = 250 µA ID = 250 µA VDS = VGS, ID = 250 µA VDS = 0 V, VGS = ± 20 V VDS = 30 V, VGS = 0 V VDS = 30 V, VGS = 0 V, TJ = 55 °C VDS ≥ 5 V, VGS = 10 V VGS = 10 V, ID = 11 A VGS = 4.5 V, ID = 10 A VDS = 15 V, ID = 11 A Min. 30 Typ. Max. Unit V 28 -6 1.2 2.5 ± 100 1 10 20 0.0097 0.0122 52 0.0120 0.0150 mV/°C V nA µA A Ω S Input Capacitance Output Capacitance Reverse Transfer Capacitance Total Gate Charge Gate-Source Charge Gate-Drain Charge Gate Resistance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Drain-Source Body Diode Characteristics Continuous Source-Drain Diode Current Pulse Diode Forward Body Diode Voltage Body Diode Reverse Recovery Time Body Diode Reverse Recovery Charge Reverse Recovery Fall Time Reverse Recovery Rise Time Currenta 820 VDS = 15 V, VGS = 0 V, f = 1 MHz VDS = 15 V, VGS = 10 V, ID = 11 A VDS = 15 V, VGS = 5 V, ID = 11 A f = 1 MHz VDD = 15 V, RL = 1.4 Ω ID ≅ 9 A, VGEN = 4.5 V, Rg = 1 Ω 0.36 195 73 15 6.8 2.5 2.3 1.8 16 12 16 10 8 VDD = 15 V, RL = 1.4 Ω ID ≅ 9 A, VGEN = 10 V, Rg = 1 Ω 10 16 8 TC = 25 °C IS = 9 A 0.8 15 IF = 9 A, dI/dt = 100 A/µs, TJ = 25 °C 6 8 7 3.6 24 18 24 20 16 20 24 15 25 50 1.2 30 12 ns Ω 23 10.2 nC pF A V ns nC ns Notes: a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %. b. Guaranteed by design, not subject to production testing. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. www.vishay.com 2 Document Number: 69000 S-82665-Rev. A, 03-Nov-08 Si4172DY Vishay Siliconix TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted 50 VGS = 10 thru 4 V 40 I D - Drain Current (A) I D - Drain Current (A) 4 TC = - 55 °C 3 5 30 20 VGS = 3 V 10 2 TC = 25 °C 1 TC = 125 °C 0 0 2 4 6 8 10 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 VDS - Drain-to-Source Voltage (V) VGS - Gate-to-Source Voltage (V) Output Characteristics 0.015 1200 Transfer Characteristics R DS(on) - On-Resistance (Ω) 0.013 VGS = 4.5 V C - Capacitance (pF) 900 Ciss 0.011 VGS = 10 V 0.009 600 300 0.007 Crss 0 6 Coss 0.005 0 10 20 30 40 50 0 12 18 24 30 ID - Drain Current (A) VDS - Drain-to-Source Voltage (V) On-Resistance vs. Drain Current and Gate Voltage 10 ID = 11 A VGS - Gate-to-Source Voltage (V) 8 R DS(on) - On-Resistance 1.5 1.8 ID = 11 A Capacitance 6 VDS = 24 V 4 (Normalized) VDS = 15 V VGS = 10 V 1.2 VGS = 4.5 V 0.9 2 0 0 4 8 12 16 0.6 - 50 - 25 0 25 50 75 100 125 150 Qg - Total Gate Charge (nC) TJ - Junction Temperature (°C) Gate Charge Document Number: 69000 S-82665-Rev. A, 03-Nov-08 On-Resistance vs. Junction Temperature www.vishay.com 3 Si4172DY Vishay Siliconix TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted 100 0.030 TJ = 150 °C 1 TJ = 25 °C R DS(on) - On-Resistance (Ω) 10 I S - Source Current (A) 0.025 0.020 TJ = 125 °C 0.015 0.1 0.010 TJ = 25 °C 0.005 0.01 0.001 0.0 0.000 0.2 0.4 0.6 0.8 1.0 1.2 0 2 4 6 8 10 VSD - Source-to-Drain Voltage (V) VGS - Gate-to-Source Voltage (V) Source-Drain Diode Forward Voltage 2.2 50 On-Resistance vs. Gate-to-Source Voltage 2.0 40 1.8 Power (W) VGS(th) (V) ID = 250 µA 1.6 30 20 1.4 10 1.2 1.0 - 50 - 25 0 25 50 75 100 125 150 0 10- 3 10- 2 10- 1 1 10 100 600 TJ - Temperature (°C) Time (s) Threshold Voltage 100 Limited by RDS(on)* Single Pulse Power, Junction-to-Ambient 100 µA 10 I D - Drain Current (A) 1 ms 1 10 ms 100 ms 0.1 TA = 25 °C Single Pulse BVDSS Limited 0.01 0.1 1 10 100 1s 10 s DC VDS - Drain-to-Source Voltage (V) * VGS > minimum VGS at which RDS(on) is specified Safe Operating Area, Junction-to-Ambient www.vishay.com 4 Document Number: 69000 S-82665-Rev. A, 03-Nov-08 Si4172DY Vishay Siliconix TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted 18 15 I D - Drain Current (A) 12 9 6 3 0 0 25 50 75 100 125 150 TC - Case Temperature (°C) Current Derating* 6 2.0 5 1.5 4 Power (W) Power (W) 0 25 50 75 100 125 150 3 1.0 2 0.5 1 0 0.0 0 25 50 75 100 125 150 TC - Case Temperature (°C) TA - Ambient Temperature (°C) Power Derating, Junction-to-Foot Power Derating, Junction-to-Ambient * The power dissipation PD is based on TJ(max) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package limit. Document Number: 69000 S-82665-Rev. A, 03-Nov-08 www.vishay.com 5 Si4172DY Vishay Siliconix TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted 2 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5 0.2 Notes: 0.1 0.1 0.05 0.02 Single Pulse 0.01 10 -4 10 -3 10 -2 10 -1 1 Square Wave Pulse Duration (s) PDM t1 t2 1. Duty Cycle, D = 2. Per Unit Base = R thJA = 70 °C/W 3. T JM - TA = PDMZthJA(t) 4. Surface Mounted t1 t2 10 100 600 Normalized Thermal Transient Impedance, Junction-to-Ambient 2 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5 0.2 0.1 0.1 0.05 0.02 Single Pulse 0.01 10-4 10-3 10-2 10-1 Square Wave Pulse Duration (s) 1 10 Normalized Thermal Transient Impedance, Junction-to-Foot Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see http://www.vishay.com/ppg?69000. www.vishay.com 6 Document Number: 69000 S-82665-Rev. A, 03-Nov-08 Legal Disclaimer Notice Vishay Disclaimer All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 18-Jul-08 www.vishay.com 1