Si4462DY
New Product
Vishay Siliconix
N-Channel 200-V (D-S) MOSFET
FEATURES PRODUCT SUMMARY
VDS (V)
200
D TrenchFETr Power MOSFET D PWM Optimized for Fast Switching ID (A)
1.50 1.45
rDS(on) (W)
0.480 @ VGS = 10 V 0.510 @ VGS = 6.0 V
APPLICATIONS
D Primary Side Switch
D
SO-8
S S S G 1 2 3 4 Top View 8 7 6 5 D D D D S N-Channel MOSFET G
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150_C)a Pulsed Drain Current Single Avalanch Current Single Avalanch Energy Continuous Source Current (Diode Conduction)a Maximum Power Dissipationa Operating Junction and Storage Temperature Range TA = 25_C TA = 70_C L = 0.1 mH TA = 25_C TA = 70_C
Symbol
VDS VGS
10 secs
200 "20 1.50
Steady State
Unit
V
1.15 0.92 5 1.5 0.11 mJ 1.1 1.3 0.85 -55 to 150 W _C A A
ID IDM IAS EAS IS PD TJ, Tstg
1.20
2.1 2.5 1.6
THERMAL RESISTANCE RATINGS
Parameter
t v 10 sec Maximum Junction-to-Ambienta Maximum Junction-to-Foot (Drain) Notes a. Surface Mounted on 1” x 1” FR4 Board. Document Number: 72093 S-22098—Rev. A, 02-Dec-02 www.vishay.com Steady State Steady State RthJA RthJF
Symbol
Typical
40 70 20
Maximum
50 85 24
Unit
_C/W
1
Si4462DY
Vishay Siliconix
New Product
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter Static
Gate Threshold Voltage Gate-Body Leakage Zero Gate Voltage Drain Current On-State Drain Currenta VGS(th) IGSS IDSS ID(on) VDS = VGS, ID = 250 mA VDS = 0 V, VGS = "20 V VDS = 160 V, VGS = 0 V VDS = 160 V, VGS = 0 V, TJ = 55_C VDS w 5 V, VGS = 10 V VGS = 10 V, ID = 1.5 A rDS(on) VGS = 6.0 V, ID = 1.45 A Forward Transconductancea Diode Forward Voltagea gfs VSD VDS = 15 V, ID = 1.5A IS = 2.1 A, VGS = 0 V 5 0.39 0.420 5 0.8 1.2 0.480 0.510 W S V 2.0 4 "100 1 5 V nA mA A
Symbol
Test Condition
Min
Typ
Max
Unit
Drain-Source On-State Resistancea
Dynamicb
Total Gate Charge Gate-Source Charge Gate-Drain Charge Gate Resistance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Source-Drain Reverse Recovery Time Qg Qgs Qgd RG td(on) tr td(off) tf trr IF = 2.1 A, di/dt = 100 A/ms VDD = 100 V, RL = 100 W ID ^ 1.0 A, VGEN = 10 V, RG = 6 W VDS = 100 V, VGS = 10 V, ID = 1.5 A 6 0.9 1.9 3.7 10 12 10 15 55 15 20 15 25 90 ns W 9 nC
Notes a. Pulse test; pulse width v 300 ms, duty cycle v 2%. b. Guaranteed by design, not subject to production testing.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
5 VGS = 10 thru 5 V 4 I D - Drain Current (A) I D - Drain Current (A) 4 5
Transfer Characteristics
3
3
2
2 TC = 125_C 1
1
4V 3V
25_C -55 _C 0 1 2 3 4 5
0 0 2 4 6 8 10
0
VDS - Drain-to-Source Voltage (V) www.vishay.com
VGS - Gate-to-Source Voltage (V) Document Number: 72093 S-22098—Rev. A, 02-Dec-02
2
Si4462DY
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance vs. Drain Current
0.8 r DS(on) - On-Resistance ( W ) 400
Vishay Siliconix
Capacitance
0.6 VGS = 6 V 0.4 VGS = 10 V
C - Capacitance (pF)
300
Ciss
200
0.2
100
Crss Coss
0.0 0 1 2 3 4 5
0 0 20 40 60 80
ID - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
Gate Charge
10 V GS - Gate-to-Source Voltage (V) VDS = 100 V ID = 1.5 A 8 2.5
On-Resistance vs. Junction Temperature
VGS = 10 V ID = 1.5 A 2.1
6
r DS(on) - On-Resistance ( W) (Normalized) 2 3 4 5 6
1.7
4
1.3
2
0.9
0 0 1 Qg - Total Gate Charge (nC)
0.5 -50
-25
0
25
50
75
100
125
150
TJ - Junction Temperature (_C)
Source-Drain Diode Forward Voltage
5 0.8
On-Resistance vs. Gate-to-Source Voltage
r DS(on) - On-Resistance ( W )
I S - Source Current (A)
0.6
TJ = 150_C 1 TJ = 25_C
ID = 1.5 A
0.4
0.2
0.1 0.0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 2 4 6 8 10 VSD - Source-to-Drain Voltage (V) VGS - Gate-to-Source Voltage (V)
Document Number: 72093 S-22098—Rev. A, 02-Dec-02
www.vishay.com
3
Si4462DY
Vishay Siliconix
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Threshold Voltage
0.8 50
Single Pulse Power
0.4 V GS(th) Variance (V)
40 ID = 250 mA Power (W) 30
0.0
-0.4
20
-0.8
10
-1.2 -50
-25
0
25
50
75
100
125
150
0 0.001
0.01
0.1
1
10
100
600
TJ - Temperature (_C)
Time (sec)
Safe Operating Area
10 rDS(on) Limited ID(on) Limited IDM Limited P(t) = 0.0001
1 I D - Drain Current (A)
P(t) = 0.001 0.1 P(t) = 0.01 P(t) = 0.1 P(t) = 1 0.01 TA = 25_C Single Pulse BVDSS Limited 0.001 0.1 1 10 100 1000 P(t) = 10 dc
VDS - Drain-to-Source Voltage (V)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5
0.2
Notes:
0.1 0.1
0.1 0.05 0.02
PDM t1 t2 1. Duty Cycle, D =
2. Per Unit Base = RthJA = 70_C/W
t1 t2
Single Pulse 0.01 10- 4 0.01 10- 3 10- 2 10- 1 1 Square Wave Pulse Duration (sec)
3. TJM - TA = PDMZthJA(t) 4. Surface Mounted
10
100
600
www.vishay.com
4
Document Number: 72093 S-22098—Rev. A, 02-Dec-02
Si4462DY
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Normalized Thermal Transient Impedance, Junction-to-Foot
2 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5
Vishay Siliconix
0.2 0.1 0.1 0.05 0.02
Single Pulse 0.01 10- 4 10- 3 10- 2 10- 1 Square Wave Pulse Duration (sec) 1 10
Document Number: 72093 S-22098—Rev. A, 02-Dec-02
www.vishay.com
5
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