Si4824DY
Vishay Siliconix
Asymmetric N-Channel, Reduced Qg, Fast Switching MOSFET
PRODUCT SUMMARY
VDS (V)
N-Channel 1 30 N-Channel 2
rDS(on) (W)
0.040 @ VGS = 10 V 0.065 @ VGS = 4.5 V 0.0175 @ VGS = 10 V 0.027 @ VGS = 4.5 V
ID (A)
"4.7 "3.7 "9 "7.3
D1
D2
D2 D2
SO-8
S1 G1 S2 G2 1 2 3 4 Top View S1 N-Channel MOSFET 1 S2 N-Channel MOSFET 2 8 7 6 5 D1 D2 D2 D2 G1 G2
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Drain-Source Voltage Gate-Source Voltage
a, Continuous Drain Current (TJ = 150_C)a, b Drain Current
Symbol
VDS VGS TA = 25_C TA = 70_C ID IDM IS TA = 25_C TA = 70_C PD TJ, Tstg
N-Channel 1
30 "20 "4.7 "3.7 "40 1.2 1.4 0.9 –55 to 150
N-Channel 2
30 "20 "9 "7.2 "60 2.0 2.25 1.5 –55 to 150
Unit
V
Pulsed Drain Current Continuous Source Current (Diode Conduction)a, b Maximum Power Dissipationa, b Power Dissipationa, Operating Junction and Storage Temperature Range
A
W _C
THERMAL RESISTANCE RATINGS
Parameter
N-Ch 1 Maximum Junction-to-Ambient Maximum Junction-to-Ambienta i N-Ch 2 Notes a. Surface Mounted on FR4 Board. b. t v10 sec. For SPICE model information via the Worldwide Web: http://www.vishay.com/www/product/spice.htm Document Number: 70800 S-56946—Rev. C, 23-Nov-98 www.vishay.com S FaxBack 408-970-5600 t v10 sec Steady State t v10 sec Steady State RthJA 80 125 55
Symbol
Typical
Maximum
90
Unit
_C/W
2-1
Si4824DY
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter Static
Gate Threshold Voltage Threshold Voltage VGS(th) VDS = VGS, ID = 250 mA VDS = 0 V, VGS = "20 V 20 N-Ch 1 N-Ch 2 N-Ch 1 N-Ch 2 N-Ch 1 VDS = 24 V, VGS = 0 V V, Zero Gate Voltage Drain Current Z Gate Voltage Drain Current l i IDSS VDS = 24 V, VGS = 0 V, TJ = 55_C V, N-Ch 2 N-Ch 1 N-Ch 2 N-Ch 1 N-Ch 2 N-Ch 1 N-Ch 2 N-Ch 1 N-Ch 2 N-Ch 1 N-Ch 2 N-Ch 1 N-Ch 2 20 A 30 0.033 0.014 0.048 0.020 12 S 25 0.7 0.7 1.2 V 1.2 0.040 0.0175 0.065 0.027 W 1.0 V 1.0 "100 "100 1 1 5 5 mA nA
Symbol
Test Condition
Min
Typ
Max
Unit
Gate-Body Leakage Leakage
IGSS
On-State Drain Currenta Drain Current
ID(on)
VDS w 5 V, VGS = 10 V VGS = 10 V, ID = 4.7 A
DiS i Drain-Source On-State Resistancea On S Resistance
VGS = 10 V, ID = 9 A rDS(on) VGS = 4.5 V, ID = 3.7 A VGS = 4.5 V, ID = 7.3 A
Forward Transconductancea Transconductance
gfs
VDS = 15 V, ID = 4.7 A VDS = 15 V, ID = 9 A IS = 1.2 A, VGS = 0 V IS = 2.0 A, VGS = 0 V
Diode Forward Voltagea Forward Voltage
VSD
Dynamicb
N-Ch 1 Total Gate Charge Gate Charge Qg N-Channel 1 N Ch l VDS = 15 V, VGS = 5 V, ID = 4.7 A 15 N-Channel 2 VDS = 15 V, VGS = 5 V, ID = 9 A N-Ch 2 N-Ch 1 N-Ch 2 N-Ch 1 Gate-Drain Charge Charge Qgd N-Ch 2 N-Ch 1 Turn-On Delay Time Delay Time td(on) N-Channel 1 N-Ch Channel l VDD = 15 V, RL =15 W ID ^ 1 A, VGEN = 10 V, RG = 6 W 10 N-Channel 2 VDD = 15 V, RL = 15 W ID ^ 1 A, VGEN = 10 V RG = 6 W 10 V, N-Ch 2 N-Ch 1 N-Ch 2 N-Ch 1 N-Ch 2 N-Ch 1 Fall Time Time tf IF = 1.2 A, di/dt = 100 A/ms IF = 2.0 A, di/dt = 100 A/ms N-Ch 2 N-Ch 1 N-Ch 2 6.5 17.5 3.0 nC C 7.5 2.5 6.5 10 15 12 15 20 45 10 20 40 40 20 30 20 30 35 ns 70 20 35 80 80 10 27
Gate-Source Charge Charge
Qgs
Rise Time Time
tr
Turn-Off Delay Time Delay Time
td(off)
Source-Drain Reverse Recovery Time Reverse Recovery Time Notes a. Pulse test; pulse width v 300 ms, duty cycle v 2%. b. For design aid only; not subject to production testing.
trr
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Document Number: 70800 S-56946—Rev. C, 23-Nov-98
Si4824DY
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
40 VGS = 10 thru 6 V I D – Drain Current (A) I D – Drain Current (A) 30 5V 30 125_C 20 40 TC = –55_C 25_C
N CHANNEL 1
Transfer Characteristics
20 4V 10 2V 0 0 1 2 3 4
10
3V 0 0 1 2 3 4 5 6 7
VDS – Drain-to-Source Voltage (V)
VGS – Gate-to-Source Voltage (V)
On-Resistance vs. Drain Current
0.10 1200
Capacitance
0.08 r DS(on) – On-Resistance ( W ) VGS = 4.5 V 0.06 C – Capacitance (pF)
1000 Ciss 800
600
0.04
VGS = 10 V
400
Coss Crss
0.02
200
0 0 10 20 ID – Drain Current (A) 30 40
0 0 6 12 18 24 30
VDS – Drain-to-Source Voltage (V)
10 VDS = 15 V ID = 4.7 A
Gate Charge
1.55
On-Resistance vs. Junction Temperature
V GS – Gate-to-Source Voltage (V)
8
r DS(on) – On-Resistance ( W) (Normalized)
1.35
VGS = 10 V ID = 4.7 A
6
1.15
4
0.95
2
0 0 3 6 9 12 Qg – Total Gate Charge (nC)
0.75 –50
–25
0
25
50
75
100
125
150
TJ – Junction Temperature (_C)
Document Number: 70800 S-56946—Rev. C, 23-Nov-98
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2-3
Si4824DY
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Source-Drain Diode Forward Voltage
40 0.10
N CHANNEL 1
On-Resistance vs. Gate-to-Source Voltage
I S – Source Current (A)
TJ = 150_C 10 TJ = 25_C
r DS(on) – On-Resistance ( W )
0.08
0.06
ID = 4.7 A
0.04
0.02
1 0 0.4 0.8 1.2 1.6
0 0 2 4 6 8 10
VSD – Source-to-Drain Voltage (V)
VGS – Gate-to-Source Voltage (V)
Threshold Voltage
0.45 0.25 24 V GS(th) Variance (V) 0.05 –0.15 –0.35 –0.55 6 –0.75 –0.95 –50 0 –25 0 25 50 75 100 125 150 0.01 0.10 ID = 250 mA Power (W) 18 30
Single Pulse Power
12
1 Time (sec)
10
100
600
TJ – Temperature (_C)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2 1 Duty Cycle = 0.5 0.2 0.1 0.1 0.05 0.02 Single Pulse
Notes: PDM t1 t2 1. Duty Cycle, D = t1 t2 2. Per Unit Base = RthJA = 125_C/W 3. TJM – TA = PDMZthJA(t) 4. Surface Mounted
Normalized Effective Transient Thermal Impedance
0.01
0.001 10–4 10–3 10–2 10–1 1 10 100 600 Square Wave Pulse Duration (sec)
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Document Number: 70800 S-56946—Rev. C, 23-Nov-98
Si4824DY
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
60 60
N CHANNEL 2
Transfer Characteristics
50
VGS = 10 thru 5 V I D – Drain Current (A)
50
I D – Drain Current (A)
40
40
30
4V
30
20
20 TC = 125_C 10 25_C –55_C 3 4 5 6
10
2V 3V
0 0 1 2 3 4
0 0 1 2
VDS – Drain-to-Source Voltage (V)
VGS – Gate-to-Source Voltage (V)
On-Resistance vs. Drain Current
0.040 3000
Capacitance
0.035 r DS(on) – On-Resistance ( W ) C – Capacitance (pF) 2300 Ciss
0.030
0.025
VGS = 4.5 V VGS = 10 V
1600
0.020
900 Crss 200
Coss
0.015
0.01 0 10 20 30 40 50 60
0
6
12
18
24
30
ID – Drain Current (A)
VDS – Drain-to-Source Voltage (V)
10 VDS = 15 V ID = 9 A V GS – Gate-to-Source Voltage (V) 8
Gate Charge
1.55 1.45 1.35 1.25 1.15 1.05 0.95 0.85 0.75 –50
On-Resistance vs. Junction Temperature
VGS = 10 V ID = 9 A
6
4
2
0 0 4 8 12 16 20 24 28 32 Qg – Total Gate Charge (nC)
r DS(on) – On-Resistance ( W) (Normalized)
–25
0
25
50
75
100
125
150
TJ – Junction Temperature (_C)
Document Number: 70800 S-56946—Rev. C, 23-Nov-98
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2-5
Si4824DY
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Source-Drain Diode Forward Voltage
60 TJ = 150_C r DS(on) – On-Resistance ( W ) I S – Source Current (A) 0.03 ID = 4.7 A 0.02 0.04
N CHANNEL 2
On-Resistance vs. Gate-to-Source Voltage
TJ = 25_C 10
0.01
1 0 0.4 0.8 1.2 1.6
0 0 2 4 6 8 10
VSD – Source-to-Drain Voltage (V)
VGS – Gate-to-Source Voltage (V)
Threshold Voltage
0.50 50
Single Pulse Power
0.25 ID = 250 mA Power (W)
40
V GS(th) Variance (V)
0.00
30
–0.25
20
–0.50 10
–0.75
–1 –50
0 –25 0 25 50 75 100 125 150 0.01 0.10 1 Time (sec) 10 100 600
TJ – Temperature (_C)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2 1 Duty Cycle = 0.5 0.2 0.1 0.1 0.05 0.02 0.01 Single Pulse
Notes: PDM t1 t2 1. Duty Cycle, D = t1 t2 2. Per Unit Base = RthJA = 80_C/W 3. TJM – TA = PDMZthJA(t) 4. Surface Mounted
Normalized Effective Transient Thermal Impedance
0.001 10–4
10–3
10–2
10–1
1
10
100
600
Square Wave Pulse Duration (sec)
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Document Number: 70800 S-56946—Rev. C, 23-Nov-98