Si4864DY
New Product
Vishay Siliconix
N-Channel 20-V (D-S) MOSFET
FEATURES PRODUCT SUMMARY
VDS (V)
20
rDS(on) (W)
0.0035 @ VGS = 4.5 V 0.0047 @ VGS = 2.5 V
ID (A)
25 20
D TrenchFETr Power MOSFETS: 2.5-V Rated D Low 3.5-mW rDS(on) D PWM (Qgd and RG) Optimized
APPLICATIONS
D Low-Side MOSFET in Synchronous Buck DC/DC Converters in Servers and Routers
D
SO-8
S S S G 1 2 3 4 Top View 8 7 6 5 D D D D S N-Channel MOSFET G
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150_C)a Pulsed Drain Current (10 ms Pulse Width) Continuous Source Current (Diode Conduction)a Maximum Power Dissipationa Operating Junction and Storage Temperature Range TA = 25_C TA = 70_C TA = 25_C TA = 70_C
Symbol
VDS VGS
10 secs
20 "8 25
Steady State
Unit
V
17 13 60 A 1.3 1.6 1 - 55 to 150 W _C
ID IDM IS PD TJ, Tstg
20
2.9 3.5 2.2
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction to Ambienta Junction-to-Ambient Maximum Junction-to-Foot (Drain) Notes a. Surface Mounted on 1” x 1” FR4 Board. Document Number: 71449 S-03662—Rev. B, 14-Apr-03 www.vishay.com t v 10 sec Steady State Steady State RthJA RthJF
Symbol
Typical
29 67 13
Maximum
35 80 16
Unit
_C/W
1
Si4864DY
Vishay Siliconix
New Product
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter Static
Gate Threshold Voltage Gate-Body Leakage Zero Gate Voltage Drain Current On-State Drain Currenta Drain Source Drain-Source On-State Resistancea Forward Transconductancea Diode Forward Voltagea VGS(th) IGSS IDSS ID(on) rDS(on) gfs VSD VDS = VGS, ID = 250 mA VDS = 0 V, VGS = "8 V VDS = 16 V, VGS = 0 V VDS = 16 V, VGS = 0 V, TJ = 55_C VDS w 5 V, VGS = 4.5 V VGS = 4.5 V, ID = 25 A VGS = 2.5 V, ID = 20 A VDS = 6 V, ID = 25 A IS = 2.9 A, VGS = 0 V 30 0.0028 0.0038 70 0.70 1.1 0.0035 0.0047 S V 0.6 "100 1 5 V nA mA A W
Symbol
Test Condition
Min
Typ
Max
Unit
Dynamicb
Total Gate Charge Gate-Source Charge Gate-Drain Charge Gate Resistance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Source-Drain Reverse Recovery Time Qg Qgs Qgd Rg td(on) tr td(off) tf trr IF = 2.9 A, di/dt = 100 A/ms VDD = 10 V, RL = 10 W V, ID ^ 1 A, VGEN = 4.5 V, RG = 6 W 0.5 VDS = 10 V, VGS = 4.5 V, ID = 25 A 47 10 13.4 1.5 40 44 150 72 57 2.6 60 65 240 110 80 ns ns W 70 nC
Notes a. Pulse test; pulse width v 300 ms, duty cycle v 2%. b. Guaranteed by design, not subject to production testing.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
60 VGS = 5 thru 2.5 V 50 2V 50 60
Transfer Characteristics
I D - Drain Current (A)
40
I D - Drain Current (A)
40
30
30 TC = 125_C 20 25_C - 55_C
20
10
10
0 0 1 2 3 4 5
0 0.0
0.5
1.0
1.5
2.0
2.5
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
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Document Number: 71449 S-03662—Rev. B, 14-Apr-03
Si4864DY
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance vs. Drain Current
0.005 7500
Vishay Siliconix
Capacitance
r DS(on) - On-Resistance ( W )
0.004
VGS = 2.5 V C - Capacitance (pF)
6000
Ciss
0.003
VGS = 4.5 V
4500
0.002
3000 Coss
0.001
1500 Crss
0.000 0 10 20 30 40 50 60
0 0 4 8 12 16 20
ID - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
Gate Charge
5 V GS - Gate-to-Source Voltage (V) VDS = 10 V ID = 25 A 1.6
On-Resistance vs. Junction Temperature
VGS = 4.5 V ID = 25 A
3
r DS(on) - On-Resistance (W ) (Normalized) 24 36 48 60
4
1.4
1.2
2
1.0
1
0.8
0 0 12
0.6 - 50
- 25
0
25
50
75
100
125
150
Qg - Total Gate Charge (nC)
TJ - Junction Temperature (_C)
Source-Drain Diode Forward Voltage
60 0.010
On-Resistance vs. Gate-to-Source Voltage
TJ = 150_C 10 TJ = 25_C
r DS(on) - On-Resistance ( W )
0.008
I S - Source Current (A)
0.006 ID = 25 A 0.004
0.002
1 0.00 0.2 0.4 0.6 0.8 1.0 1.2 VSD - Source-to-Drain Voltage (V)
0.000 0 1 2 3 4 5 6 7 8
VGS - Gate-to-Source Voltage (V)
Document Number: 71449 S-03662—Rev. B, 14-Apr-03
www.vishay.com
3
Si4864DY
Vishay Siliconix
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Threshold Voltage
0.4 0.2 - 0.0 - 0.2 - 0.4 - 0.6 - 0.8 - 1.0 - 50 10 ID = 250 mA 40 Power (W) 60 50
Single Pulse Power
V GS(th) Variance (V)
30
20
- 25
0
25
50
75
100
125
150
0 10 - 2
10 - 1
1 Time (sec)
10
100
600
TJ - Temperature (_C)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2 1 Duty Cycle = 0.5
Normalized Effective Transient Thermal Impedance
0.2
Notes:
0.1 0.1 0.05
t1 PDM
0.02
t2 1. Duty Cycle, D =
2. Per Unit Base = RthJA = 67_C/W
t1 t2
Single Pulse 0.01 10 - 4 10 - 3 10 - 2 10 - 1 1 Square Wave Pulse Duration (sec)
3. TJM - TA = PDMZthJA(t) 4. Surface Mounted
10
100
600
Normalized Thermal Transient Impedance, Junction-to-Foot
2 1 Duty Cycle = 0.5
Normalized Effective Transient Thermal Impedance
0.2 0.1 0.1 0.05 0.02
Single Pulse 0.01 10 - 4 10 - 3 10 - 2 10 - 1 Square Wave Pulse Duration (sec) 1 10
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Document Number: 71449 S-03662—Rev. B, 14-Apr-03
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