SI4936CDY-T1-GE3

New Product Si4936CDY Vishay Siliconix Dual N-Channel 30-V (D-S) MOSFET PRODUCT SUMMARY VDS (V) 30 RDS(on) (Ω) 0.040 at VGS = 10 V 0.050 at VGS = 4.5 V ID (A)d 5.8 2.8 nC 5.5 Qg (Typ.) FEATURES • Halogen-free According to IEC 61249-2-21 Definition • TrenchFET® Power MOSFET APPLICATIONS • Low Current DC/DC Conversion • Notebook System Power SO-8 S1 G1 S2 G2 1 2 3 4 Top View 8 7 6 5 D1 D1 D2 D2 D1 D2 G1 G2 S1 Ordering Information: Si4936CDY-T1-GE3 (Lead (Pb)-free and Halogen-free) S2 N-Channel MOSFET N-Channel MOSFET ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted Parameter Drain-Source Voltage Gate-Source Voltage TC = 25 °C Continuous Drain Current (TJ = 150 °C) TC = 70 °C TA = 25 °C TA = 70 °C Pulsed Drain Current Continuous Source-Drain Diode Current TC = 25 °C TA = 25 °C TC = 25 °C Maximum Power Dissipation TC = 70 °C TA = 25 °C TA = 70 °C Operating Junction and Storage Temperature Range TJ, Tstg PD IDM IS ID Symbol VDS VGS Limit 30 ± 20 5.8 4.6 5.0a, b 4.0a, b 20 1.9 1.4a, b 2.3 1.5 1.7a, b 1.1a, b - 55 to 150 °C W A Unit V THERMAL RESISTANCE RATINGS Parameter Maximum Junction-to-Ambient a, c t ≤ 10 s Steady State Symbol RthJA RthJF Typical 58 42 Maximum 75 55 Unit °C/W Maximum Junction-to-Foot (Drain) Notes: a. Surface Mounted on 1" x 1" FR4 board. b. t = 10 s. c. Maximum under Steady State conditions is 110 °C/W. d. Based on TC = 25 °C. Document Number: 69097 S09-0390-Rev. C, 09-Mar-09 www.vishay.com 1 New Product Si4936CDY Vishay Siliconix SPECIFICATIONS TJ = 25 °C, unless otherwise noted Parameter Static Drain-Source Breakdown Voltage VDS Temperature Coefficient VGS(th) Temperature Coefficient Gate-Source Threshold Voltage Gate-Source Leakage Zero Gate Voltage Drain Current On-State Drain Currenta Drain-Source On-State Resistancea Forward Transconductancea Dynamic b Symbol VDS ΔVDS/TJ ΔVGS(th)/TJ VGS(th) IGSS IDSS ID(on) RDS(on) gfs Ciss Coss Crss Qg Qgs Qgd Rg td(on) tr td(off) tf td(on) tr td(off) tf IS ISM VSD trr Qrr ta tb Test Conditions VGS = 0 V, ID = 250 µA ID = 250 µA VDS = VGS , ID = 250 µA VDS = 0 V, VGS = ± 20 V VDS = 30 V, VGS = 0 V VDS = 30 V, VGS = 0 V, TJ = 55 °C VDS ≥ 5 V, VGS = 10 V VGS = 10 V, ID = 5 A VGS = 4.5 V, ID = 4.7 A VDS = 10 V, ID = 5 A Min. 30 Typ. Max. Unit V 32 -5 1.2 3 ± 100 1 10 15 0.033 0.041 15 325 0.040 0.050 µA A Ω S mV/°C V nA Input Capacitance Output Capacitance Reverse Transfer Capacitance Total Gate Charge Gate-Source Charge Gate-Drain Charge Gate Resistance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Drain-Source Body Diode Characteristics Continuous Source-Drain Diode Current Pulse Diode Forward Current Body Diode Voltage Body Diode Reverse Recovery Time Body Diode Reverse Recovery Charge Reverse Recovery Fall Time Reverse Recovery Rise Time VDS = 15 V, VGS = 0 V, f = 1 MHz VDS = 15 V, VGS = 10 V, ID = 5 A VDS = 15 V, VGS = 4.5 V, ID = 5 A f = 1 MHz VDD = 15 V, RL = 3.8 Ω ID ≅ 4 A, VGEN = 4.5 V, Rg = 1 Ω 0.6 60 30 6 2.8 1.1 0.8 2.8 12 13 16 11 4 5.6 18 20 25 17 8 18 20 15 1.9 20 0.8 11 4 6 5 1.2 20 8 9 4.2 pF nC Ω ns VDD = 15 V, RL = 3.8 Ω ID ≅ 4 A, VGEN = 10 V, Rg = 1 Ω 9 11 8 TC = 25 °C IS = 4 A, VGS = 0 V A V ns nC ns IF = 4 A, dI/dt = 100 A/µs, TJ = 25 °C Notes: a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 % b. Guaranteed by design, not subject to production testing. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. www.vishay.com 2 Document Number: 69097 S09-0390-Rev. C, 09-Mar-09 New Product Si4936CDY Vishay Siliconix TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted 20 VGS = 10 V thru 4 V 4 15 I D - Drain Current (A) I D - Drain Current (A) 3 5 10 2 TC = 25 °C 1 TC = 125 °C 5 VGS = 3 V VGS = 1 V, 2 V 0 0.0 0 0.5 1.0 1.5 2.0 2.5 0 1 2 TC = - 55 °C 3 4 VDS - Drain-to-Source Voltage (V) VGS - Gate-to-Source Voltage (V) Output Characteristics 0.06 400 Transfer Characteristics Ciss R DS(on) - On-Resistance (Ω) 0.05 VGS = 4.5 V 0.04 VGS = 10 V 0.03 C - Capacitance (pF) 300 200 100 Coss Crss 0.02 0 5 10 ID - Drain Current (A) 15 20 0 0 5 10 15 20 25 30 VDS - Drain-to-Source Voltage (V) On-Resistance vs. Drain Current 10 ID = 5 A VGS - Gate-to-Source Voltage (V) 8 R DS(on) - On-Resistance 1.5 1.7 Capacitance VGS = 10 V; ID = 5 A (Normalized) 6 VDS = 15 V VDS = 24 V 4 1.3 VGS = 4.5 V; ID = 4.7 A 1.1 2 0.9 0 0 1 2 3 4 5 6 0.7 - 50 - 25 0 25 50 75 100 125 150 Qg - Total Gate Charge (nC) TJ - Junction Temperature (°C) Gate Charge On-Resistance vs. Junction Temperature Document Number: 69097 S09-0390-Rev. C, 09-Mar-09 www.vishay.com 3 New Product Si4936CDY Vishay Siliconix TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted 100 0.10 10 TJ = 150 °C TJ = 25 °C R DS(on) - On-Resistance (Ω) 0.08 I S - Source Current (A) 0.06 TJ = 125 °C 0.04 TJ = 25 °C 0.02 1 0.1 0.0 0.3 0.6 0.9 1.2 1.5 VSD - Source-to-Drain Voltage (V) 0.00 0 2 4 6 8 10 VGS - Gate-to-Source Voltage (V) Source-Drain Diode Forward Voltage 2.3 20 On-Resistance vs. Gate-to-Source Voltage 2.1 16 1.9 VGS(th) (V) ID = 250 µA 1.7 Power (W) 12 8 1.5 4 1.3 1.1 - 50 - 25 0 25 50 75 100 125 150 0 0.001 0.01 0.1 1 Time (s) 10 100 1000 TJ - Temperature (°C) Threshold Voltage 100 Limited by RDS(on)* I D - Drain Current (A) 10 Single Pulse Power 100 µA 1 1 ms 10 ms 0.1 100 ms TA = 25 °C Single Pulse BVDSS Limited 0.01 0.1 1 10 100 1s 10 s, DC VDS - Drain-to-Source Voltage (V) * VGS > minimum VGS at which RDS(on) is specified Safe Operating Area, Junction-to-Ambient www.vishay.com 4 Document Number: 69097 S09-0390-Rev. C, 09-Mar-09 New Product Si4936CDY Vishay Siliconix TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted 8 I D - Drain Current (A) 6 4 2 0 0 25 50 75 100 125 150 TC - Case Temperature (°C) Current Derating* 3.0 1.5 2.5 1.2 2.0 Power (W) Power (W) 0 25 50 75 100 125 150 0.9 1.5 0.6 1.0 0.3 0.5 0.0 0.0 0 25 50 75 100 125 150 TC - Case Temperature (°C) TA - Ambient Temperature (°C) Power, Junction-to-Case Power, Junction-to-Ambient * The power dissipation PD is based on TJ(max) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package limit. Document Number: 69097 S09-0390-Rev. C, 09-Mar-09 www.vishay.com 5 New Product Si4936CDY Vishay Siliconix TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted 1 Duty Cycle = 0.5 Normalized Effective Transient Thermal Impedance 0.2 0.1 0.1 0.05 0.02 Notes: PDM t1 t2 1. Duty Cycle, D = t1 t2 2. Per Unit Base = RthJA = 110 °C/W 3. TJM - TA = PDMZthJA(t) 4. Surface Mounted Single Pulse 0.01 10 -4 10 -3 10 -2 10 -1 1 10 100 1000 Square Wave Pulse Duration (s) Normalized Thermal Transient Impedance, Junction-to-Ambient 1 Duty Cycle = 0.5 Normalized Effective Transient Thermal Impedance 0.2 0.1 0.1 0.02 Single Pulse 0.05 0.01 10 -4 10 -3 10 -2 10 -1 1 10 Square Wave Pulse Duration (s) Normalized Thermal Transient Impedance, Junction-to-Foot Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?69097. www.vishay.com 6 Document Number: 69097 S09-0390-Rev. C, 09-Mar-09 Package Information Vishay Siliconix SOIC (NARROW): 8-LEAD JEDEC Part Number: MS-012 8 7 6 5 E 1 2 3 4 H S D 0.25 mm (Gage Plane) A h x 45 C All Leads q L 0.101 mm 0.004" e B A1 MILLIMETERS DIM A A1 B C D E e H h L q S 5.80 0.25 0.50 0° 0.44 Min 1.35 0.10 0.35 0.19 4.80 3.80 1.27 BSC 6.20 0.50 0.93 8° 0.64 0.228 0.010 0.020 0° 0.018 Max 1.75 0.20 0.51 0.25 5.00 4.00 Min 0.053 0.004 0.014 0.0075 0.189 0.150 INCHES Max 0.069 0.008 0.020 0.010 0.196 0.157 0.050 BSC 0.244 0.020 0.037 8° 0.026 ECN: C-06527-Rev. I, 11-Sep-06 DWG: 5498 Document Number: 71192 11-Sep-06 www.vishay.com 1 VISHAY SILICONIX TrenchFET® Power MOSFETs Application Note 808 Mounting LITTLE FOOT®, SO-8 Power MOSFETs Wharton McDaniel Surface-mounted LITTLE FOOT power MOSFETs use integrated circuit and small-signal packages which have been been modified to provide the heat transfer capabilities required by power devices. Leadframe materials and design, molding compounds, and die attach materials have been changed, while the footprint of the packages remains the same. See Application Note 826, Recommended Minimum Pad Patterns With Outline Drawing Access for Vishay Siliconix MOSFETs, (http://www.vishay.com/ppg?72286), for the basis of the pad design for a LITTLE FOOT SO-8 power MOSFET. In converting this recommended minimum pad to the pad set for a power MOSFET, designers must make two connections: an electrical connection and a thermal connection, to draw heat away from the package. In the case of the SO-8 package, the thermal connections are very simple. Pins 5, 6, 7, and 8 are the drain of the MOSFET for a single MOSFET package and are connected together. In a dual package, pins 5 and 6 are one drain, and pins 7 and 8 are the other drain. For a small-signal device or integrated circuit, typical connections would be made with traces that are 0.020 inches wide. Since the drain pins serve the additional function of providing the thermal connection to the package, this level of connection is inadequate. The total cross section of the copper may be adequate to carry the current required for the application, but it presents a large thermal impedance. Also, heat spreads in a circular fashion from the heat source. In this case the drain pins are the heat sources when looking at heat spread on the PC board. 0.288 7.3 0.288 7.3 0.050 1.27 0.088 2.25 0.027 0.69 0.078 1.98 0.088 2.25 0.2 5.07 Figure 2. Dual MOSFET SO-8 Pad Pattern With Copper Spreading The minimum recommended pad patterns for the single-MOSFET SO-8 with copper spreading (Figure 1) and dual-MOSFET SO-8 with copper spreading (Figure 2) show the starting point for utilizing the board area available for the heat-spreading copper. To create this pattern, a plane of copper overlies the drain pins. The copper plane connects the drain pins electrically, but more importantly provides planar copper to draw heat from the drain leads and start the process of spreading the heat so it can be dissipated into the ambient air. These patterns use all the available area underneath the body for this purpose. Since surface-mounted packages are small, and reflow soldering is the most common way in which these are affixed to the PC board, “thermal” connections from the planar copper to the pads have not been used. Even if additional planar copper area is used, there should be no problems in the soldering process. The actual solder connections are defined by the solder mask openings. By combining the basic footprint with the copper plane on the drain pins, the solder mask generation occurs automatically. A final item to keep in mind is the width of the power traces. The absolute minimum power trace width must be determined by the amount of current it has to carry. For thermal reasons, this minimum width should be at least 0.020 inches. The use of wide traces connected to the drain plane provides a low impedance path for heat to move away from the device. www.vishay.com 1 APPLICATION NOTE 0.050 1.27 0.196 5.0 0.027 0.69 0.078 1.98 0.2 5.07 Figure 1. Single MOSFET SO-8 Pad Pattern With Copper Spreading Document Number: 70740 Revision: 18-Jun-07 Application Note 826 Vishay Siliconix RECOMMENDED MINIMUM PADS FOR SO-8 0.172 (4.369) 0.028 (0.711) (6.248) 0.022 (0.559) 0.050 (1.270) Recommended Minimum Pads Dimensions in Inches/(mm) Return to Index Return to Index APPLICATION NOTE www.vishay.com 22 (1.194) 0.047 (3.861) 0.246 0.152 Document Number: 72606 Revision: 21-Jan-08 Legal Disclaimer Notice Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. 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Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk and agree to fully indemnify and hold Vishay and its distributors harmless from and against any and all claims, liabilities, expenses and damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that Vishay or its distributor was negligent regarding the design or manufacture of the part. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 11-Mar-11 www.vishay.com 1