Si6469DQ
Vishay Siliconix
P-Channel 1.8-V (G-S) MOSFET
PRODUCT SUMMARY
VDS (V) rDS(on) (W)
0.028 @ VGS = –4.5 V –8 0.031 @ VGS = –3.3 V 0.040 @ VGS = –2.5 V 0.065 @ VGS = –1.8 V
ID (A)
"6.0 "5.8 "5.0 "3.6
S
TSSOP-8
D S S G 1 2 3 4 Top View D D 8 D S S D G
Si6469DQ
7 6 5
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150_C)a, b Drain Current C) Pulsed Drain Current Continuous Source Current (Diode Conduction)a, b Maximum Power Dissipationa, b Power Dissipationa, Operating Junction and Storage Temperature Range TA = 25_C TA = 70_C TA = 25_C TA = 70_C
Symbol
VDS VGS ID IDM IS PD TJ, Tstg
Limit
–8 "8 "6.0 "5.0 "30 –1.25 1.5 1.0 –55 to 150
Unit
V
A
W _C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambient Maximum Junction-to-Ambienta Notes a. Surface Mounted on FR4 Board. b. t v 10 sec. For SPICE model information via the Worldwide Web: http://www.vishay.com/www/product/spice.htm Document Number: 70858 S-60717—Rev. A, 01-Feb-99 www.vishay.com S FaxBack 408-970-5600 t v 10 sec Steady State
Symbol
RthJA
Typical
Maximum
83
Unit
_C/W
95
2-1
Si6469DQ
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter Static
Gate Threshold Voltage Gate-Body Leakage Zero Gate Voltage Drain Current Gate Voltage Drain Current On-State Drain Currenta VGS(th) IGSS IDSS ID(on) VDS = VGS, ID = –250 mA VDS = 0 V, VGS = "8 V VDS = –6.4 V, VGS = 0 V VDS = –6.4 V, VGS = 0 V, TJ = 70_C VDS w –8 V, VGS = –4.5 V VGS = –4.5 V, ID = –6.0 A VGS = –3.3 V, ID = –5.8 A Drain-Source On-State R i Drain Source On State Resistancea DiS OS rDS( ) DS(on) VGS = –2.5 V, ID = –5.0 A VGS = –1.8 V, ID = –3.6 A Forward Transconductancea gfs VSD VDS = –8 V, ID = –6.0 A IS = –1.25 A, VGS = 0 V –30 0.021 0.024 0.030 0.048 18 –0.68 –1.1 0.028 0.031 0.040 0.065 S V W –0.45 "100 –1 –25 V nA mA A
Symbol
Test Condition
Min
Typb
Max
Unit
Diode Forward Voltagea
Dynamicb
Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Source-Drain Reverse Recovery Time Qg Qgs Qgd td(on) tr td(off) tf trr IF = –1.25 A, di/dt = 100 A/ms VDD = –6 V, RL = 6 W V, ID ^ –1 A, VGEN = –4 5 V RG = 6 W A 4.5 V, VDS = –6 V, VGS = –4 5 V ID = –6 0 A V 4.5 V, 6.0 20 4.5 3.6 20 30 85 50 50 50 60 150 90 100 ns 40 nC C
Notes a. Pulse test; pulse width v 300 ms, duty cycle v 2%. b. Guaranteed by design, not subject to production testing
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2-2
Document Number: 70858 S-60717—Rev. A, 01-Feb-99
Si6469DQ
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
30 30 TC = –55_C 24 I D – Drain Current (A) VGS = 5 thru 2,5 V I D – Drain Current (A) 24 25_C
Transfer Characteristics
18
2V
18
125_C
12
12
6
1.5 V
6
1V 0 0 2 4 6 8 0 0 0.5 1.0 1.5 2.0 2.5 3.0
VDS – Drain-to-Source Voltage (V)
VGS – Gate-to-Source Voltage (V)
On-Resistance vs. Drain Current
0.10 4000
Capacitance
r DS(on) – On-Resistance ( W )
0.08 VGS = 1.8 V 0.06 VGS = 2.5 V VGS = 4.5 V 0.02 C – Capacitance (pF)
3200
Ciss
2400
0.04
1600 Coss 800 Crss
0 0 6 12 18 24 30
0 0 2 4 6 8
ID – Drain Current (A)
VDS – Drain-to-Source Voltage (V)
4.5 V GS – Gate-to-Source Voltage (V) VDS = 6 V ID = 6.0 A
Gate Charge
1.6
On-Resistance vs. Junction Temperature
VGS = 4.5 V ID = 6.0 A
3.6
r DS(on) – On-Resistance ( W) (Normalized) 8 12 16 20
1.4
1.2
2.7
1.0
1.8
0.8
0.9
0.6
0 0 4
0.4 –50
–25
0
25
50
75
100
125
150
Qg – Total Gate Charge (nC)
TJ – Junction Temperature (_C)
Document Number: 70858 S-60717—Rev. A, 01-Feb-99
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2-3
Si6469DQ
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Source-Drain Diode Forward Voltage
30 0.06
On-Resistance vs. Gate-to-Source Voltage
10
r DS(on) – On-Resistance ( W )
TJ = 150_C I S – Source Current (A)
0.05
0.04 ID = 6.0 A 0.03
0.02
TJ = 25_C
0.01
1 0.00 0.2 0.4 0.6 0.8 1..0 1.2
0 0 2 4 6 8
VSD – Source-to-Drain Voltage (V)
VGS – Gate-to-Source Voltage (V)
Threshold Voltage
0.8 0.6 0.4 20 0.2 –0.0 –0.2 –0.4 –0.6 –50 5 Power (W) ID = 250 mA 30 25
Single Pulse Power
V GS(th) Variance (V)
15
10
0 –25 0 25 50 75 100 125 150 0.01 0.1 Time (sec) 1 10 30 TJ – Temperature (_C)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2 1 Duty Cycle = 0.5 Normalized Effective Transient Thermal Impedance
0.2 0.1 0.1 0.05
Notes: PDM t1 t2 1. Duty Cycle, D = t1 t2 2. Per Unit Base = RthJA = 95_C/W 3. TJM – TA = PDMZthJA(t) 4. Surface Mounted
0.02 Single Pulse 0.01 10–4 10–3 10–2 10–1 1
10
100
600
Square Wave Pulse Duration (sec)
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2-4
Document Number: 70858 S-60717—Rev. A, 01-Feb-99
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