Si6542DQ
Vishay Siliconix
Dual N- and P-Channel 20-V (D-S) MOSFET
PRODUCT SUMMARY
VDS (V)
N-Channel 20
rDS(on) (W)
0.09 @ VGS = 10 V 0.175 @ VGS = 4.5 V
ID (A)
"2.5 "1.8 "1.9 "1.3
P-Channel
–20
0.17 @ VGS = –10 V 0.32 @ VGS = –4.5 V
D1
S2
TSSOP-8
D1 S1 S1 G1 1 2 3 4 Top View S N-Channel MOSFET D2 P-Channel MOSFET D 8 D2 S2 S2 G2 G1 G2
Si6542DQ
7 6 5
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150_C)a (T 150 Pulsed Drain Current Continuous Source Current (Diode Conduction)a Maximum Power Dissipationa Power Dissipation Operating Junction and Storage Temperature Range TA = 25_C TA = 70_C TA = 25_C TA = 70_C ID IDM IS PD TJ, Tstg
Symbol
VDS VGS
N-Channel
20 "20 "2.5 "2.0 "20 1.25 1.0
P-Channel
–20 "20 "1.9 "1.5 "15 –1.25
Unit
V
A
W 0.64 –55 to 150 _C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambienta Notes a. Surface Mounted on FR4 Board, t v 10 sec. For SPICE model information via the Worldwide Web: http://www.vishay.com/www/product/spice.htm Document Number: 70171 S-00873—Rev. F, 01-May-00 www.vishay.com S FaxBack 408-970-5600
Symbol
RthJA
N- or P-Channel
125
Unit
_C/W
2-1
Si6542DQ
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter Static
Gate Threshold Voltage Gate Threshold Voltage Gate-Body Leakage VGS(th) IGSS VDS = VGS, ID = 250 mA VDS = VGS, ID = –250 mA VDS = 0 V, VGS = "20 V VDS = 20 V, VGS = 0 V Zero Gate Voltage Drain Current Z Gate Voltage Drain Current l i IDSS VDS = –20 V, VGS = 0 V VDS = 20 V, VGS = 0 V, TJ = 55_C VDS = –20 V, VGS = 0 V, TJ = 55_C On-State Drain Currenta Drain Current ID(on) VDS = 5 V, VGS = 10 V VDS = –5 V, VGS = –10 V VGS = 10 V, ID = 2.5 A Drain-Source On-State Resistance S Drain-Source On-State Resistancea rDS(on) VGS = –10 V, ID = 1.9 A VGS = 4.5 V, ID = 1.8 A VGS = –4.5 V, ID = 1.3 A Forward Transconductancea Transconductance gfs VDS = 15 V, ID = 2.5 A VDS = –15 V, ID = – 1.9 A IS = 1.25 A, VGS = 0 V IS = –1.25 A, VGS = 0 V N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch 14 A –10 0.065 0.13 0.100 0.26 5 S 3 0.8 0.8 1.2 V –1.2 0.09 0.17 0.175 0.32 W N-Ch P-Ch 1.0 V –1.0 "100 1 –1 25 –25 mA nA
Symbol
Test Condition
Min
Typ
Max
Unit
Diode Forward Voltagea Forward Voltage
VSD
Dynamicb
N-Ch Total Gate Charge Total Gate Charge Qg N-Channel N Ch Channel l VDS = 10 V, VGS = 10 V, ID = 2.5 A P-Channel VDS = –10 V VGS = –10 V ID = –1.9 A V, V, 19 Gate-Drain Charge Charge Qgd P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch Turn-On Delay Time Delay Time td(on) N-Channel N Ch l VDD = 10 V, RL = 10 W ID ^ 1 A, VGEN = 10 V, RG = 6 W P-Channel VDD = –10 V RL = 10 W V, 10 ID ^ –1 A, VGEN = –10 V, RG = 6 W 10 A, P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch Fall Time Time tf IF = 1.25 A, di/dt = 100 A/ms IF = –1.25 A, di/dt = 100 A/ms P-Ch N-Ch P-Ch 7 7 0.9 nC C 1.3 2.1 1.7 11 9 11 12 16 17 6 6 45 35 20 20 20 25 30 ns 30 15 15 70 70 10 10
Gate-Source Charge Charge
Qgs
Rise Time Time
tr
Turn-Off Delay Time Delay Time
td(off)
Source-Drain Reverse Recovery Time Reverse Recovery Time
trr
Notes a. Pulse test; pulse width v 300 ms, duty cycle v 2%. b. Guaranteed by design, not subject to production testing.
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Document Number: 70171 S-00873—Rev. F, 01-May-00
Si6542DQ
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
20 6V 16 I D – Drain Current (A) 16 I D – Drain Current (A) TC = –55_C 25_C 12 125_C 20
N CHANNEL
Transfer Characteristics
VGS = 10, 9 ,8 ,7 V 5V
12
8 4V 4 3V 0 0 1 2 3 4 5
8
4
0 0 2 4 6 8 10
VDS – Drain-to-Source Voltage (V)
VGS – Gate-to-Source Voltage (V)
On-Resistance vs. Drain Current
0.30 1000
Capacitance
0.25 r DS(on) – On-Resistance ( Ω ) C – Capacitance (pF) VGS = 4.5 V
800
0.20
600 Ciss 400 Coss 200 Crss 0
0.15
0.10 VGS = 10 V 0.05
0 0 2 4 6 8 10
0
4
8
12
16
20
ID – Drain Current (A)
VDS – Drain-to-Source Voltage (V)
10 VGS = 10 V ID = 2.5 A
Gate Charge
2.0
On-Resistance vs. Junction Temperature
VGS = 10 V ID = 2.5 A
V GS – Gate-to-Source Voltage (V)
r DS(on) – On-Resistance ( Ω ) (Normalized) 0 1 2 3 4 5 6 7 8
8
1.5
6
1.0
4
0.5
2
0
0 –50
–25
0
25
50
75
100
125
150
Qg – Total Gate Charge (nC)
TJ – Junction Temperature (_C)
Document Number: 70171 S-00873—Rev. F, 01-May-00
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2-3
Si6542DQ
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Source-Drain Diode Forward Voltage
20 TJ = 150_C I S – Source Current (A) 10 r DS(on) – On-Resistance ( Ω ) 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 1.0 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.00 0 2 4 6 8 10 ID = 2.5 A
N CHANNEL
On-Resistance vs. Gate-to-Source Voltage
TJ = 25_C
VSD – Source-to-Drain Voltage (V)
VGS – Gate-to-Source Voltage (V)
Threshold Voltage
1.0 120
Single Pulse Power
100 0.5 V GS(th) Variance (V) 80 Power (W) ID = 250 µA 0.0
60
40 –0.5 20
–1.0 –50
0 –25 0 25 50 75 100 125 150 0.001 0.010 0.100 Time (sec) 1.000 10.000 TJ – Temperature (_C)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2 1 Normalized Effective Transient Thermal Impedance
Duty Cycle = 0.5
0.2
Notes:
0.1 0.1 0.05
PDM t1 t2 1. Duty Cycle, D = t1 t2 2. Per Unit Base = RthJA = 125_C/W
0.02 Single Pulse
3. TJM – TA = PDMZthJA(t) 4. Surface Mounted
0.01 10–4
10–3
10–2
10–1
1
10
30
Square Wave Pulse Duration (sec)
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2-4
Document Number: 70171 S-00873—Rev. F, 01-May-00
Si6542DQ
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
15 VGS = 10, 9 V 12 I D – Drain Current (A) 7V 8V 6V 5V 6 I D – Drain Current (A) 12 25_C 9 15 TC = –55_C 125_C
P CHANNEL
Transfer Characteristics
9
6
3
4V 3V
3
0 0 1 2 3 4 5
0 0 2 4 6 8 10
VDS – Drain-to-Source Voltage (V)
VGS – Gate-to-Source Voltage (V)
On-Resistance vs. Drain Current
0.5 1000
Capacitance
r DS(on) – On-Resistance ( Ω )
0.4
VGS = 4.5 V C – Capacitance (pF)
800 Ciss 600
0.3
0.2 VGS = 10 V 0.1
400 Coss 200 Crss
0 0 2 4 6 8 10
0 0 4 8 12 16 20
ID – Drain Current (A)
VDS – Drain-to-Source Voltage (V)
10 VGS = 10 V ID = 1.9 A
Gate Charge
2.0
On-Resistance vs. Junction Temperature
V GS – Gate-to-Source Voltage (V)
r DS(on) – On-Resistance ( Ω ) (Normalized)
8
1.5
VGS = 10 V ID = 1.9 A
6
1.0
4
0.5
2
0 0 2 4 6 8
0 –50
–25
0
25
50
75
100
125
150
Qg – Total Gate Charge (nC)
TJ – Junction Temperature (_C)
Document Number: 70171 S-00873—Rev. F, 01-May-00
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2-5
Si6542DQ
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Source-Drain Diode Forward Voltage
20 0.7 0.6 r DS(on) – On-Resistance ( Ω ) 0.5 0.4 0.3 0.2 0.1 0 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 0 2 4 6 8 10
P CHANNEL
On-Resistance vs. Gate-to-Source Voltage
TJ = 150_C I S – Source Current (A) 10 TJ = 25_C
ID = 1.9 A
VSD – Source-to-Drain Voltage (V)
VGS – Gate-to-Source Voltage (V)
Threshold Voltage
1.0 ID = 250 µA 0.5 V GS(th) Variance (V) 80 Power (W) 120
Single Pulse Power
100
0.0
60
40 –0.5 20 –1.0 –50
–25
0
25
50
75
100
125
150
0 0.001 0.010 0.100 Time (sec) 1.000 10.000
TJ – Temperature (_C)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2 1 Normalized Effective Transient Thermal Impedance
Duty Cycle = 0.5
0.2
Notes:
0.1 0.1 0.05
PDM t1 t2 1. Duty Cycle, D = t1 t2 2. Per Unit Base = RthJA = 125_C/W
0.02 Single Pulse 0.01 10–4
3. TJM – TA = PDMZthJA(t) 4. Surface Mounted
10–3
10–2
10–1 Square Wave Pulse Duration (sec)
1
10
30
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Document Number: 70171 S-00873—Rev. F, 01-May-00