Si7445DP
Vishay Siliconix
P-Channel 20-V (D-S) MOSFET
PRODUCT SUMMARY
VDS (V) rDS(on) (W)
0.0077 @ VGS = - 4.5 V - 20 0.0094 @ VGS = - 2.5 V 0.0125 @ VGS = - 1.8 V
FEATURES
ID (A)
- 19 - 17 - 15
D TrenchFETr Power MOSFET D New Low Thermal Resistance PowerPAKr Package with Low 1.07-mm Profile D 100% Rg Tested
APPLICATIONS
D Load Switch Battery Applications
PowerPAK SO-8
S 6.15 mm
S 1 2 3 4 D 8 7 6 5 D D D S S G
5.15 mm
G
D P-Channel MOSFET
Bottom View Ordering Information: Si7445DP-T1
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Continuous Drain Current (TJ = 150_C)a Pulsed Drain Current continuous Source Current (Diode Conduction)a Maximum Power Dissipationa Operating Junction and Storage Temperature Range TA = 25_C TA = 70_C PD TJ, Tstg TA = 25_C TA = 70_C ID - 15 IDM IS - 4.3 5.4 3.4 - 55 to 150 - 50 - 1.6 1.9 1.2 W _C -9 A
Symbol
VDS VGS
10 secs
Steady State
- 20 "8
Unit
V
- 19
- 12
THERMAL RESISTANCE RATINGS
Parameter
t v 10 sec Maximum J Mi Junction-to-Ambienta ti t A bi t Maximum Junction-to-Case (Drain) Notes a. Surface Mounted on 1” x 1” FR4 Board. Document Number: 71626 S-31728—Rev. B, 18-Aug-03 www.vishay.com Steady State Steady State RthJA RthJC
Symbol
Typical
18 52 1.0
Maximum
23 65 1.3
Unit
_C/W
1
Si7445DP
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter Static
Gate Threshold Voltage Gate-Body Leakage Zero Gate Voltage Drain Current On-State Drain Currenta VGS(th) IGSS IDSS ID(on) VDS = VGS, ID = - 250 mA VDS = 0 V, VGS = "8 V VDS = - 16 V, VGS = 0 V VDS = - 16 V, VGS = 0 V, TJ = 70_C VDS v - 5 V, VGS = - 4.5 V VGS = - 4.5 V, ID = - 19 A Drain-Source On-State Resistancea rDS(on) VGS = - 2.5 V, ID = - 17 A VGS = - 1.8 V, ID = - 10 A Forward Transconductancea Diode Forward Voltagea gfs VSD VDS = - 15 V, ID = - 19 A IS = - 4.3 A, VGS = 0 V - 40 0.0064 0.0078 0.0105 75 - 0.65 - 1.1 0.0077 0.0094 0.0125 S V W - 0.45 "100 -1 - 10 V nA mA A
Symbol
Test Condition
Min
Typ
Max
Unit
Dynamicb
Total Gate Charge Gate-Source Charge Gate-Drain Charge Gate-Resistance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Source-Drain Reverse Recovery Time Qg Qgs Qgd Rg td(on) tr td(off) tf trr IF = - 4.3 A, di/dt = 100 A/ms VDD = - 15 V, RL = 15 W V, ID ^ - 1 A, VGEN = - 4.5 V, RG = 6 W 1 VDS = - 15 V, VGS = - 5 V, ID = - 19 A 92 19 16.5 2 40 45 400 190 50 3.4 60 65 600 290 80 ns W 140 nC
Notes a. Pulse test; pulse width v 300 ms, duty cycle v 2%. b. Guaranteed by design, not subject to production testing.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
50 VGS = 5 thru 2 V 40 I D - Drain Current (A) I D - Drain Current (A) 40 50
Transfer Characteristics
30 1.5 V 20
30
20 TC = 125_C 10 25_C - 55_C 1.0 1.5 2.0
10
0 0 2 4 6 8 10
0 0.0
0.5
VDS - Drain-to-Source Voltage (V) www.vishay.com
VGS - Gate-to-Source Voltage (V) Document Number: 71626 S-31728—Rev. B, 18-Aug-03
2
Si7445DP
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance vs. Drain Current
0.020 15000
Capacitance
r DS(on) - On-Resistance ( W )
0.016 C - Capacitance (pF)
12000
Ciss
0.012
VGS = 1.8 V VGS = 2.5 V
9000
0.008 VGS = 4.5 V 0.004
6000
3000
Coss Crss 0 4 8 12 16 20
0.000 0 5 10 15 20 25 30
0
ID - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
Gate Charge
5 V GS - Gate-to-Source Voltage (V) VDS = 15 V ID = 19 A 1.6
On-Resistance vs. Junction Temperature
VGS = 4.5 V ID = 19 A
3
r DS(on) - On-Resistance (W ) (Normalized)
4
1.4
1.2
2
1.0
1
0.8
0 0 20 40 60 80 100
0.6 - 50
- 25
0
25
50
75
100
125
150
Qg - Total Gate Charge (nC)
TJ - Junction Temperature (_C)
Source-Drain Diode Forward Voltage
0.030 50 0.024
On-Resistance vs. Gate-to-Source Voltage
r DS(on) - On-Resistance ( W )
I S - Source Current (A)
TJ = 150_C 10
ID = 19 A 0.018
0.012
TJ = 25_C
0.006
1 0.0
0.000 0.2 0.4 0.6 0.8 1.0 1.2 0 2 4 6 8
VSD - Source-to-Drain Voltage (V)
VGS - Gate-to-Source Voltage (V)
Document Number: 71626 S-31728—Rev. B, 18-Aug-03
www.vishay.com
3
Si7445DP
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Threshold Voltage
0.6 ID = 250 mA 0.4 V GS(th) Variance (V) 160 200
Single Pulse Power, Juncion-To-Ambient
Power (W)
0.2
120
0.0
80
- 0.2
40
- 0.4 - 50
0 - 25 0 25 50 75 100 125 150 0.001 0.01 0.1 Time (sec) 1 10 TJ - Temperature (_C)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5
0.2
Notes:
0.1 0.1 0.05 0.02
t1 t2 1. Duty Cycle, D = t1 t2 PDM
2. Per Unit Base = RthJA = 65_C/W
Single Pulse 0.01 10 -4 10 -3 10 -2 10 -1 1 Square Wave Pulse Duration (sec)
3. TJM - TA = PDMZthJA(t) 4. Surface Mounted
10
100
600
Normalized Thermal Transient Impedance, Junction-to-Case
2 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5 0.2 0.1 0.1 0.02 Single Pulse 0.05
0.01 10 -4 10 -3 10 -2 10 -1 Square Wave Pulse Duration (sec) 1 10
www.vishay.com
4
Document Number: 71626 S-31728—Rev. B, 18-Aug-03
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