Si7842DP
Vishay Siliconix
Dual N-Channel 30-V (D-S) MOSFET with Schottky Diode
PRODUCT SUMMARY
VDS (V)
30
rDS(on) (W)
0.022 @ VGS = 10 V 0.030 @ VGS = 4.5 V
FEATURES
ID (A)
10 8.5
D LITTLE FOOT Plust Schottky D New Low Thermal Resistance PowerPAKr Package with Low 1.07-mm Profile D 100% Rg Tested
SCHOTTKY PRODUCT SUMMARY
VDS (V)
30
APPLICATIONS
D Bus and Logic DC-DC IF (A)
3.0
VSD (V) Diode Forward Voltage
0.50 V @ 1.0 A
PowerPAK SO-8
D1
S1
D2
6.15 mm
1 2
5.15 mm
G1 S2
3 4
D1
G2
G1
D1
Schottky Diode G2
8 7
D2
6 5
D2
Bottom View Ordering Information: Si7842DP-T1
S1 N-Channel MOSFET
S2 N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150_C)a Pulsed Drain Current Continuous Source Current (Diode Conduction)a Maximum Power Dissipationa TA = 25_C TA = 70_C TA = 25_C TA = 70_C
Symbol
VDS VGS
10 secs
30 "20 10
Steady State
Unit
V
6.3 5.0 30 A 1.1 1.4 0.9 - 55 to 150 W _C
ID IDM IS PD TJ, Tstg
6.0
2.9 3.5 2.2
Operating Junction and Storage Temperature Range
THERMAL RESISTANCE RATINGS
MOSFET Parameter
t v 10 sec Maximum J Mi Junction-to-Ambienta ti t A bi t Maximum Junction-to-Case (Drain) Notes a. Surface Mounted on 1” x 1” FR4 Board. Document Number: 71617 S-31728—Rev. B, 18-Aug-03 www.vishay.com Steady-State Steady-State RthJA RthJC
Schottky Typ
26 60 3.9
Symbol
Typ
26 60 3.9
Max
35 85 5.5
Max
35 85 5.5
Unit
_C/W
1
Si7842DP
Vishay Siliconix
MOSFET SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED).
Parameter Static
Gate Threshold Voltage Gate-Body Leakage VGS(th) IGSS VDS = VGS, ID = 250 mA VDS = 0 V, VGS = "20 V VDS = 24 V, VGS = 0 V V Zero Gate Voltage Drain Current IDSS VDS = 24 V, VGS = 0 V, TJ = 85_C V On-State Drain Currentb Drain-Source On-State Drain Source On State Resistanceb Forward Transconductanceb Diode Forward Voltageb ID(on) rDS( ) DS(on) gfs VSD VDS = 5 V, VGS = 10 V VGS = 10 V, ID = 7.5 A VGS = 4.5 V, ID = 6.5 A VDS = 15 V, ID = 7.5 A IS = 1 A, VGS = 0 V Ch 1 Ch-1 Ch-2 Ch 1 Ch-1 Ch-2 Ch 1 Ch-1 Ch-2 20 0.018 0.024 22 0.8 0.47 1.2 0.5 V 0.022 0.030 0.8 "100 1 100 15 2000 A W S mA V nA
Symbol
Test Condition
Min
Typa
Max
Unit
Dynamica
Total Gate Charge Gate-Source Charge Gate-Drain Charge Gate Resistance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Source-Drain Source Drain Reverse Recovery Time Qg Qgs Qgd Rg td(on) tr td(off) tf trr IF = 1.7 A di/dt = 100 A/ms 7 A, Ch 1 Ch-1 Ch-2 VDD = 15 V, RL = 15 W V, ID ^ 1 A, VGEN = 10 V, RG = 6 W 0.5 VDS = 15 V, VGS = 10 V, ID = 7.5 A , , 13 2 2.7 1.2 8 10 21 10 40 32 3.2 16 20 40 20 80 70 ns W 20 nC
Notes a. Guaranteed by design, not subject to production testing. b. Pulse test; pulse width v 300 ms, duty cycle v 2%.
SCHOTTKY SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Forward Voltage Drop
Symbol
VF
Test Condition
IF = 1.0 A IF = 1.0 A, TJ = 125_C Vr = 30 V Vr = 30 V, TJ = 100_C Vr = - 30 V, TJ = 125_C Vr = 10 V
Min
Typ
0.47 0.36 0.004 0.7 3.0 50
Max
0.50 0.42 0.100 10 20
Unit
V
Maximum Reverse Leakage Current g
Irm
mA
Junction Capacitance
CT
pF
www.vishay.com
2
Document Number: 71617 S-31728—Rev. B, 18-Aug-03
Si7842DP
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
20 VGS = 10 thru 4 V 16 I D - Drain Current (A) I D - Drain Current (A) 3V 16 20
MOSFET
Transfer Characteristics
12
12
8
8 TC = 125_C 4 25_C - 55_C
4 2V 0 0.0
0.5
1.0
1.5
2.0
2.5
3.0
0 0.0
0.5
1.0
1.5
2.0
2.5
3.0
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
On-Resistance vs. Drain Current
0.040 r DS(on) - On-Resistance ( W ) 1000
Capacitance
C - Capacitance (pF)
0.032
800 Ciss 600
0.024
VGS = 4.5 V VGS = 10 V
0.016
400 Coss 200 Crss
0.008
0.000 0 4 8 12 16 20
0 0 6 12 18 24 30
ID - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
Gate Charge
10 V GS - Gate-to-Source Voltage (V) VDS = 15 V ID = 7.5 A 8 1.6
On-Resistance vs. Junction Temperature
VGS = 10 V ID = 7.5 A 1.4
6
r DS(on) - On-Resistance (W ) (Normalized)
1.2
4
1.0
2
0.8
0 0 3 6 9 12 15 Qg - Total Gate Charge (nC) Document Number: 71617 S-31728—Rev. B, 18-Aug-03
0.6 - 50
- 25
0
25
50
75
100
125
150
TJ - Junction Temperature (_C) www.vishay.com
3
Si7842DP
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Source-Drain Diode Forward Voltage
20 TJ = 150_C I S - Source Current (A) 10 0.04
MOSFET
On-Resistance vs. Gate-to-Source Voltage
r DS(on) - On-Resistance ( W )
ID = 7.5 A 0.03
0.02
TJ = 25_C
0.01
1 0.0
0.00 0.2 0.4 0.6 0.8 1.0 1.2 0 2 4 6 8 10 VSD - Source-to-Drain Voltage (V) VGS - Gate-to-Source Voltage (V)
Threshold Voltage
0.4 100
Single Pulse Power
0.2 V GS(th) Variance (V) ID = 250 mA - 0.0 Power (W)
80
60
- 0.2
40
- 0.4 20
- 0.6
- 0.8 - 50
- 25
0
25
50
75
100
125
150
0 0.001
0.01
0.1 Time (sec)
1
10
TJ - Temperature (_C)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5
0.2
Notes:
0.1 0.1 0.05 0.02 Single Pulse 0.01 10 -4 10 -3 10 -2 10 -1 1 Square Wave Pulse Duration (sec) 10 100 600
t1 t2 1. Duty Cycle, D = t1 t2 PDM
2. Per Unit Base = RthJA = 60_C/W 3. TJM - TA = PDMZthJA(t) 4. Surface Mounted
www.vishay.com
4
Document Number: 71617 S-31728—Rev. B, 18-Aug-03
Si7842DP
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
2 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5
MOSFET
Normalized Thermal Transient Impedance, Junction-to-Case
0.2 0.1 0.1 0.05 0.02 Single Pulse 0.01
10 -5
10 -4
10 -3
10 -2
10 -1
1
Square Wave Pulse Duration (sec)
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
20 10 I R - Reverse Current (mA)
SCHOTTKY
Forward Voltage Drop
10 TJ = 150_C
Reverse Current vs. Junction Temperature
1
0.1
30 V 24 V
I F - Forward Current (A)
TJ = 25_C
0.01
0.001
0.0001 0 25 50 75 100 125 150 TJ - Temperature (_C)
1 0.0
0.3
0.6
0.9
1.2
1.5
VF - Forward Voltage Drop (V)
Capacitance
200
160 C - Capacitance (pF)
120
80 Coss 40
0 0 6 12 18 24 30
VDS - Drain-to-Source Voltage (V)
Document Number: 71617 S-31728—Rev. B, 18-Aug-03
www.vishay.com
5
很抱歉,暂时无法提供与“SI7842DP”相匹配的价格&库存,您可以联系我们找货
免费人工找货