Si7848DP
Vishay Siliconix
N-Channel 40-V (D-S) MOSFET
PRODUCT SUMMARY
VDS (V)
40
FEATURES
ID (A)
17 15
rDS(on) (W)
0.009 @ VGS = 10 V 0.012 @ VGS = 4.5 V
D TrenchFETr Power MOSFETS D New Low Thermal Resistance PowerPAKr Package with Low 1.07-mm Profile D PWM Optimized for Fast Switching D 100% Rg Tested
APPLICATIONS
D DC/DC Converters - Synchronous Buck - Synchronous Rectifier
PowerPAK SO-8
D 6.15 mm
S 1 2 S 3 S 4 D 8 7 D 6 D 5 D G
5.15 mm
G
S N-Channel MOSFET
Bottom View Ordering Information: Si7848DP-T1
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150_C)a Pulsed Drain Current Avalanche Current Continuous Source Current (Diode Conduction)a Maximum Power Dissipationa Operating Junction and Storage Temperature Range TA = 25_C TA = 70_C L = 0.1 mH TA = 25_C TA = 70_C
Symbol
VDS VGS ID IDM IAS IS PD TJ, Tstg
10 secs
40 "20 17 13.7 50 30 4.5 5 3.2
Steady State
Unit
V
10.4 8.3 A
1.67 1.83 1.2 -55 to 150 W _C
THERMAL RESISTANCE RATINGS
Parameter
Maximum J Mi Junction-to-Ambienta ti t A bi t Maximum Junction-to-Case (Drain) Notes a. Surface Mounted on 1” x 1” FR4 Board. Document Number: 71450 S-31728—Rev. C, 18-Aug-03 www.vishay.com t v 10 sec Steady State Steady State
Symbol
RthJA RthJC
Typical
20 55 1.8
Maximum
25 68 2.2
Unit
_C/W
1
Si7848DP
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter Static
Gate Threshold Voltage Gate-Body Leakage Zero Gate Voltage Drain Current On-State Drain Currenta Drain-Source On-State Resistancea Source Forward Transconductancea Diode Forward Voltagea VGS(th) IGSS IDSS ID(on) rDS(on) gfs VSD VDS = VGS, ID = 250 mA VDS = 0 V, VGS = "20 V VDS = 32 V, VGS = 0 V VDS = 32 V, VGS = 0 V, TJ = 55_C VDS w 5 V, VGS = 10 V VGS = 10 V, ID = 14 A VGS = 4.5 V, ID = 12 A VDS = 15 V, ID = 14 A IS = 2.8 A, VGS = 0 V 50 0.0075 0.0095 50 0.75 1.1 0.009 0.012 1.0 "100 1 5 V nA mA A W S V
Symbol
Test Condition
Min
Typ
Max
Unit
Dynamicb
Total Gate Charge Gate-Source Charge Gate-Drain Charge Gate Resistance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Source-Drain Reverse Recovery Time Qg Qgs Qgd Rg td(on) tr td(off) tf trr IF = 2.8 A, di/dt = 100 A/ms VDD = 20 V, RL = 20 W V, ID ^ 1 A, VGEN = 10 V, RG = 6 W 0.1 VDS = 20 V, VGS = 5 V, ID = 14 A 18.5 6 7.5 0.8 15 10 50 20 30 1.1 30 20 100 40 60 ns W 28 nC
Notes a. Pulse test; pulse width v 300 ms, duty cycle v 2%. b. Guaranteed by design, not subject to production testing.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
50 VGS = 10 thru 4 V 40 I D - Drain Current (A) I D - Drain Current (A) 40 50
Transfer Characteristics
30 3V 20
30
20 TC = 125_C 10 25_C -55_C
10 2 thru 0 V 0 0 1 2 3 4 5 6 VDS - Drain-to-Source Voltage (V)
0 0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
VGS - Gate-to-Source Voltage (V) Document Number: 71450 S-31728—Rev. C, 18-Aug-03
www.vishay.com
2
Si7848DP
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance vs. Drain Current
0.020 r DS(on) - On-Resistance ( W ) 3000 2500 C - Capacitance (pF) 2000 1500 1000 500 0 0 10 20 30 40 50 0 8 16 24 32 40 Coss Crss Ciss
Capacitance
0.016
0.012 VGS = 4.5 V 0.008 VGS = 10 V
0.004
0.000
ID - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
Gate Charge
10 V GS - Gate-to-Source Voltage (V) VDS = 20 V ID = 14 A 8 2.0
On-Resistance vs. Junction Temperature
VGS = 10 V ID = 14 A 1.6
6
r DS(on) - On-Resistance ( W) (Normalized) 14 21 28 35
1.2
4
0.8
2
0.4
0 0 7 Qg - Total Gate Charge (nC)
0.0 -50
-25
0
25
50
75
100
125
150
TJ - Junction Temperature (_C)
Source-Drain Diode Forward Voltage
50 TJ = 150_C I S - Source Current (A) 0.04
On-Resistance vs. Gate-to-Source Voltage
r DS(on) - On-Resistance ( W )
ID = 14 A 0.03
10
0.02
TJ = 25_C
0.01
1 0.0
0.00 0.2 0.4 0.6 0.8 1.0 1.2 0 2 4 6 8 10 VSD - Source-to-Drain Voltage (V) VGS - Gate-to-Source Voltage (V)
Document Number: 71450 S-31728—Rev. C, 18-Aug-03
www.vishay.com
3
Si7848DP
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Threshold Voltage
0.6 0.4 0.2 V GS(th) Variance (V) -0.0 -0.2 -0.4 -0.6 -0.8 -1.0 -50 0 -25 0 25 50 75 100 125 150 0.001 0.01 0.1 Time (sec) 1 10 TJ - Temperature (_C) 80 ID = 250 mA Power (W) 60 100
Single Pulse Power, Juncion-to-Ambient
40
20
Normalized Thermal Transient Impedance, Junction-to-Ambient
2 1
Normalized Effective Transient Thermal Impedance
Duty Cycle = 0.5
0.2 0.1 0.1 0.05 0.02 Single Pulse 0.01 10 - 4 10 - 3 10 - 2 10 - 1 1 Square Wave Pulse Duration (sec)
Notes: PDM t1 t2 1. Duty Cycle, D =
2. Per Unit Base = RthJA = 55_C/W 3. TJM - TA = PDMZthJA(t) 4. Surface Mounted
t1 t2
10
100
600
Normalized Thermal Transient Impedance, Junction-to-Case
2 1
Normalized Effective Transient Thermal Impedance
Duty Cycle = 0.5
0.2 0.1 0.1 0.05 0.02 Single Pulse 0.01 10 - 4 10 - 3 10 - 2 10 - 1 Square Wave Pulse Duration (sec) 1 10
www.vishay.com
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Document Number: 71450 S-31728—Rev. C, 18-Aug-03
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