SI7892DP-T1

Si7892DP Vishay Siliconix N-Channel 30-V (D-S) MOSFET PRODUCT SUMMARY VDS (V) 30 FEATURES ID (A) 25 22 rDS(on) (W) 0.0045 @ VGS = 10 V 0.006 @ VGS = 4.5 V D TrenchFETr Power MOSFET D New Low Thermal Resistance PowerPAKr Package with Low 1.07-mm Profile D Low Gate Charge D 100% Rg Tested APPLICATIONS D Synchronous Rectifier PowerPAK SO-8 D 6.15 mm S 1 2 3 4 D 8 7 6 5 D D D S S G 5.15 mm G S N-Channel MOSFET Bottom View Ordering Information: Si7892DP-T1 ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED) Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150_C)a Pulsed Drain Current (10 ms Pulse Width) Continuous Source Current (Diode Conduction)a Maximum Power Dissipationa Operating Junction and Storage Temperature Range TA = 25_C TA = 70_C TA = 25_C TA = 70_C Symbol VDS VGS 10 secs 30 "20 25 Steady State Unit V 15 12 60 A 1.6 1.9 1.2 -55 to 150 W _C ID IDM IS PD TJ, Tstg 20 4.5 5.4 3.4 THERMAL RESISTANCE RATINGS Parameter t v 10 sec Maximum J Mi Junction-to-Ambienta ti t A bi t Maximum Junction-to-Foot (Drain) Notes a. Surface Mounted on 1” x 1” FR4 Board. Document Number: 71773 S-31727—Rev. B, 18-Aug-03 www.vishay.com Steady State Steady State RthJA RthJF Symbol Typical 18 50 1.0 Maximum 23 65 1.5 Unit _C/W 1 Si7892DP Vishay Siliconix SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED) Parameter Static Gate Threshold Voltage Gate-Body Leakage Zero Gate Voltage Drain Current On-State Drain Currenta Drain-Source On-State Resistancea Source Forward Transconductancea Diode Forward Voltagea VGS(th) IGSS IDSS ID(on) rDS(on) gfs VSD VDS = VGS, ID = 250 mA VDS = 0 V, VGS = "20 V VDS = 24 V, VGS = 0 V VDS = 24 V, VGS = 0 V, TJ = 55_C VDS w 5 V, VGS = 10 V VGS = 10 V, ID = 25 A VGS = 4.5 V, ID = 22 A VDS = 15 V, ID = 25 A IS = 4.5 A, VGS = 0 V 30 0.0037 0.0048 80 0.75 1.2 0.0045 0.006 S V 1.0 "100 1 5 V nA mA A W Symbol Test Condition Min Typ Max Unit Dynamicb Total Gate Charge Gate-Source Charge Gate-Drain Charge Gate Resistance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Source-Drain Reverse Recovery Time Qg Qgs Qgd Rg td(on) tr td(off) tf trr IF = 2.9 A, di/dt = 100 A/ms VDD = 15 V, RL = 15 W V, ID ^ 1 A, VGEN = 10 V, RG = 6 W 0.5 17 10 65 35 50 VDS = 15 V, VGS = 4.5 V, ID = 25 A 25 6.7 9.7 2.4 30 20 130 60 80 ns W 35 nC Notes a. Pulse test; pulse width v 300 ms, duty cycle v 2%. b. Guaranteed by design, not subject to production testing. TYPICAL CHARACTERISTICS (25_C UNLESS NOTED) Output Characteristics 60 VGS = 10 thru 4 V 50 40 I D - Drain Current (A) 50 Transfer Characteristics I D - Drain Current (A) 40 3V 30 30 TC = 125_C 20 25_C 10 -55_C 20 10 0 0 1 2 3 4 5 0 0 1 2 3 4 5 VDS - Drain-to-Source Voltage (V) VGS - Gate-to-Source Voltage (V) Document Number: 71773 S-31727—Rev. B, 18-Aug-03 www.vishay.com 2 Si7892DP Vishay Siliconix TYPICAL CHARACTERISTICS (25_C UNLESS NOTED) On-Resistance vs. Drain Current 0.010 4000 Capacitance r DS(on) - On-Resistance ( W ) 0.008 C - Capacitance (pF) 3000 Ciss 0.006 VGS = 4.5 V 0.004 VGS = 10 V 2000 Coss 1000 Crss 0.002 0.000 0 10 20 30 40 50 60 0 0 6 12 18 24 30 ID - Drain Current (A) VDS - Drain-to-Source Voltage (V) Gate Charge 10 V GS - Gate-to-Source Voltage (V) VDS = 15 V ID = 25 A 1.8 On-Resistance vs. Junction Temperature VGS = 10 V ID = 25 A r DS(on) - On-Resistance ( W) (Normalized) 20 30 40 50 60 8 1.6 1.4 6 1.2 4 1.0 2 0.8 0 0 10 0.6 -50 -25 0 25 50 75 100 125 150 Qg - Total Gate Charge (nC) TJ - Junction Temperature (_C) Source-Drain Diode Forward Voltage 60 0.020 On-Resistance vs. Gate-to-Source Voltage 10 TJ = 150_C TJ = 25_C r DS(on) - On-Resistance ( W ) 0.016 I S - Source Current (A) 0.012 0.008 ID = 25 A 0.004 1 0.00 0.2 0.4 0.6 0.8 1.0 1.2 VSD - Source-to-Drain Voltage (V) 0.000 0 2 4 6 8 10 VGS - Gate-to-Source Voltage (V) Document Number: 71773 S-31727—Rev. B, 18-Aug-03 www.vishay.com 3 Si7892DP Vishay Siliconix TYPICAL CHARACTERISTICS (25_C UNLESS NOTED) Threshold Voltage 0.6 0.4 160 0.2 V GS(th) Variance (V) -0.0 -0.2 -0.4 -0.6 40 -0.8 -1.0 -50 0 0.001 ID = 250 mA Power (W) 120 200 Single Pulse Power 80 -25 0 25 50 75 100 125 150 0.01 0.1 Time (sec) 1 10 TJ - Temperature (_C) Normalized Thermal Transient Impedance, Junction-to-Ambient 2 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5 0.2 Notes: 0.1 0.1 0.05 0.02 t1 t2 1. Duty Cycle, D = t1 t2 PDM 2. Per Unit Base = RthJA = 50_C/W Single Pulse 0.01 10 - 4 10 - 3 10 - 2 10 - 1 1 Square Wave Pulse Duration (sec) 3. TJM - TA = PDMZthJA(t) 4. Surface Mounted 10 100 600 Normalized Thermal Transient Impedance, Junction-to-Foot 2 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5 0.2 0.1 0.1 Single Pulse 0.05 0.02 0.01 10 - 4 10 - 3 10 - 2 10 - 1 Square Wave Pulse Duration (sec) 1 10 www.vishay.com 4 Document Number: 71773 S-31727—Rev. B, 18-Aug-03