Si9410BDY
New Product
Vishay Siliconix
N-Channel 30-V (D-S) MOSFET
PRODUCT SUMMARY
VDS (V)
30
FEATURES
ID (A)
8.1 6.9
rDS(on) (W)
0.024 @ VGS = 10 V 0.033 @ VGS = 4.5 V
D TrenchFETr Power MOSFETS
D
SO-8
S S S G 1 2 3 4 Top View Ordering Information: Si9410BDY Si9410BDY-T1 (with Tape and Reel) 8 7 6 5 D D D D G
S N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150_C)a Pulsed Drain Current (10 ms Pulse Width) Continuous Source Current (Diode Conduction)a Maximum Power Dissipationa Operating Junction and Storage Temperature Range TA = 25_C TA = 70_C TA = 25_C TA = 70_C
Symbol
VDS VGS
10 secs
30 "20 8.1
Steady State
Unit
V
6.2 5.0 30 A 1.2 1.5 0.9 - 55 to 150 W _C
ID IDM IS PD TJ, Tstg
6.5
2.1 2.5 1.6
THERMAL RESISTANCE RATINGS
Parameter
t v 10 sec Maximum J Mi Junction-to-Ambienta ti t A bi t Maximum Junction-to-Foot Notes a. Surface Mounted on 1” x 1” FR4 Board. Document Number: 72269 S-31409—Rev. A, 07-Jul-03 www.vishay.com Steady State Steady State RthJA RthJF
Symbol
Typical
40 70 20
Maximum
50 85 24
Unit
_C/W
1
Si9410BDY
Vishay Siliconix
New Product
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter Static
Gate Threshold Voltage Gate-Body Leakage Zero Gate Voltage Drain Current On-State Drain Currenta Drain-Source On-State Resistance Drain-Source On-State Resistancea Forward Transconductancea Diode Forward Voltagea VGS(th) IGSS IDSS ID(on) rDS(on) gfs VSD VDS = VGS, ID = 250 mA VDS = 0 V, VGS = "20 V VDS = 24 V, VGS = 0 V VDS = 24 V, VGS = 0 V, TJ = 55_C VDS w 5 V, VGS = 10 V VGS = 10 V, ID = 8.1 A VGS = 4.5 V, ID = 6.9 A VDS = 15 V, ID = 8.1 A IS = 2.1 A, VGS = 0 V 30 0.019 0.026 20 0.8 1.2 0.024 0.033 S V 1.0 3.0 "100 1 5 V nA mA A W
Symbol
Test Condition
Min
Typ
Max
Unit
Dynamicb
Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Source-Drain Reverse Recovery Time Qg Qgs Qgd td(on) tr td(off) tf trr IF = 2.1 A, di/dt = 100 A/ms VDD = 15 V, RL = 15 W V, ID ^ 1 A, VGEN = 10 V, RG = 6 W VDS = 15 V, VGS = 10 V, ID = 8.1 A 15 3.2 2.5 10 15 30 11 25 15 25 45 20 50 ns 23 nC
Notes a. Pulse test; pulse width v 300 ms, duty cycle v 2%. b. Guaranteed by design, not subject to production testing.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
30 VGS = 10 thru 5 V 24 I D - Drain Current (A) I D - Drain Current (A) 4V 24 30
Transfer Characteristics
18
18
12
12 TC = - 125_C 6
6 3V 0 0.0
25_C 0 0.0
- 55_C 2.5 3.0 3.5 4.0 4.5
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0.5
1.0
1.5
2.0
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
www.vishay.com
2
Document Number: 72269 S-31409—Rev. A, 07-Jul-03
Si9410BDY
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance vs. Drain Current
0.040 r DS(on) - On-Resistance ( W ) 0.035 0.030 0.025 0.020 0.015 0.010 200 0.005 0.000 0 5 10 15 20 25 30 0 0 Crss 5 10 15 20 25 30 VGS = 4.5 V VGS = 10 V C - Capacitance (pF) 1200
Vishay Siliconix
Capacitance
1000
Ciss
800
600
400 Coss
ID - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
Gate Charge
10 V GS - Gate-to-Source Voltage (V) VDS = 15 V ID = 8.1 A 8 1.6
On-Resistance vs. Junction Temperature
VGS = 10 V ID = 8.1 A 1.4
6
r DS(on) - On-Resistance (W ) (Normalized) 6 9 12 15
1.2
4
1.0
2
0.8
0 0 3 Qg - Total Gate Charge (nC)
0.6 - 50
- 25
0
25
50
75
100
125
150
TJ - Junction Temperature (_C)
Source-Drain Diode Forward Voltage
30 0.10
On-Resistance vs. Gate-to-Source Voltage
10
r DS(on) - On-Resistance ( W )
TJ = 150_C I S - Source Current (A)
0.08
0.06
ID = 8.1 A
0.04
TJ = 25_C
0.02
1 0.0
0.00 0.2 0.4 0.6 0.8 1.0 1.2 0 2 4 6 8 10 VSD - Source-to-Drain Voltage (V) VGS - Gate-to-Source Voltage (V)
Document Number: 72269 S-31409—Rev. A, 07-Jul-03
www.vishay.com
3
Si9410BDY
Vishay Siliconix
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Threshold Voltage
0.4 50
Single Pulse Power
0.2 V GS(th) Variance (V) ID = 250 mA - 0.0 Power (W)
40
30
- 0.2
20
- 0.4 10
- 0.6
- 0.8 - 50
- 25
0
25
50
75
100
125
150
0 10 -3
10 -2
10 -1
1
10
100
600
TJ - Temperature (_C)
Time (sec)
Safe Operating Area
100 rDS(on) Limited IDM Limited
10 I D - Drain Current (A)
P(t) = 0.0001
P(t) = 0.001 1 ID(on) Limited P(t) = 0.01 P(t) = 0.1 TA = 25_C Single Pulse BVDSS Limited 0.01 0.1 1 10 100 P(t) = 1 P(t) = 10 dc
0.1
VDS - Drain-to-Source Voltage (V)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5
0.2
Notes:
0.1 0.1 0.05
t1 PDM
0.02
t2 1. Duty Cycle, D =
2. Per Unit Base = RthJA = 70_C/W
t1 t2
Single Pulse 0.01 10 -4 10 -3 10 -2 10 -1 1 Square Wave Pulse Duration (sec)
3. TJM - TA = PDMZthJA(t) 4. Surface Mounted
10
100
600
www.vishay.com
4
Document Number: 72269 S-31409—Rev. A, 07-Jul-03
Si9410BDY
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Normalized Thermal Transient Impedance, Junction-to-Foot
2 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5
Vishay Siliconix
0.2 0.1 0.1 0.05 0.02
Single Pulse 0.01 10 -4 10 -3 10 -2 10 -1 Square Wave Pulse Duration (sec) 1 10
Document Number: 72269 S-31409—Rev. A, 07-Jul-03
www.vishay.com
5
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