SiP12503
Vishay Siliconix
500-mA - Adjustable Boost Converter for Single or Dual Cell
DESCRIPTION
SiP12503 is a boost converter IC with adjustable output voltage for single or dual cell NiMH or Alkaline battery pack. Featuring with an internal low resistance power MOSFET, it is capable of starting up with a low battery voltage of 0.85 V. It only needs six external components (an inductor, a diode,two capacitors and two resistors) to construct a step-up converter. For best efficiency performance, it is designed to operate in PWM mode with 300 kHZ switching frequency under normal load and in PFM mode under light load. The voltage-mode control loop is internally compensated, simplifying converter design and reducing external parts count. It accepts input voltages from 0.85 V to 5.0 V, and adjustable output voltages from 2 V to 5 V. It also features low shutdown current of under 1 µA, over voltage protection, thermal shutdown protection, and antiring control to minimize EMI. SiP12503 is available in a lead (Pb)-free 6 pin, PowerPAK MLP33 package and is specified to operate over the industrial temperature range of - 40 °C to 85 °C.
FEATURES
• Voltage mode control with internal frequency compensation • 0.85 V to 5.0 V input voltage range • Adjustable output voltage range from 2.0 V to 5.0 V • Low startup voltage: 0.65 V • PWM control with 300 kHz fixed switching frequency • PFM control for light load • Powered from the output voltage supply • Integrated UVLO and soft-start • Logic controlled shutdown (< 1 µA) • 85 % typical efficiency • Internal power MOS switch: 0.2 Ω at 3.3 V output • Antiringing switch to minimize EMI • Shutdown input • Thermal shutdown • Minimum external components • PowerPAK® MLP33-6 package (DFN-6, 3 x 3) • Over voltage protection
APPLICATIONS
• • • • • • Portable applications Battery-powered equipment Handheld devices Digital cameras Wireless handsets LCD and OLED bias
TYPICAL APPLICATION CIRCUIT
VIN 10 µH 10 µF 2 VIN XSHD 1 XSHD LX 6 MBR0520 VOUT 47 µF 450 KΩ
SiP12503
3 VOUT GND 5 FB
4 100 KΩ
Document Number: 73579 S09-1454-Rev. B, 03-Aug-09
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SiP12503
Vishay Siliconix
ABSOLUTE MAXIMUM RATINGS (all voltages referenced to GND = 0 V)
Parameter Input Voltage, VIN LX Voltage Output Voltage, VOUT XSHD Voltage FB Voltage Maximum Junction Temperature Storage Temperature Operating Junction Temperature Power Dissipationa Thermal Resistance
b
Limit - 0.3 to 6 - 0.3 to VOUT + 0.5 - 0.3 to 6 - 0.3 to VIN + 0.5 - 0.3 to 6 150 - 55 to 150 125 PowerPAK MLP33-6 (TA = 70 °C)a PowerPAK MLP33-6 1100 50
Unit
V
°C mW °C/W
Notes: a. Derate 20 mW/°C above 70 °C. b. Device mounted with all leads soldered or welded to PC board.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING RANGE (all voltages referenced to GND = 0 V)
Parameter Input Voltage, VIN Output Voltage, VOUT XSHD Voltage LX Voltage FB Voltage Operating Temperature Range Limit 0.85 to 5.0 2.0 to 5 0 to VIN 0 to VOUT + 0.5 0 to 5 VOUT - 40 to 85 °C V Unit
SPECIFICATIONS
Test Conditions Unless Specified Parameter Minimum Start-Up Voltage Minimum Operating Voltaged UVLO UVLO Hysteresis Symbol VSTART VHOLD VUVLO VUVLOHYST VIN = 1.2 V, VOUT = Vnome, TA = 25 °C ILOAD = 1 mA XSHD = VIN Rising VOUT Full Full - 1.5 FB Voltage Accuracy VFB - 25 to 85 °C Full Feedback Input Current Maximum PWM Duty Cycle PWM Switching Frequency IFB MAXDTY fOSC VFB = 0.6 V Full Full 80 225 - 3.0 - 3.5 1 87 300 375 Temp.a Full Min.b Limits Typ.c 0.65 0.55 1.8 0.100 + 1.5 + 3.0 + 3.5 nA % kHz % 2 Max.b 0.85 V Unit
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Document Number: 73579 S09-1454-Rev. B, 03-Aug-09
SiP12503
Vishay Siliconix
SPECIFICATIONS
Test Conditions Unless Specified Parameter Supply Current 1 Supply Current 2 Supply Current 3 Stand-By Current NMOS Switch Leakage NMOS Switch On Resistance PWM to PFM Current Threshold PFM to PWM Current Threshold XSHD Input High Level XSHD Input Low Level Softstart Time Over Voltage Threshold Over Voltage Hysteresis Thermal Shutdown Thermal Shutdown Hysteresis ISTB ILEAK RDS(on) IWTOF IFTOF 0.8 V ≤ VIN ≤ 0.9 V VXSHDH VXSHDL tSTART VOV VOVHYST TSHD THYST ViN = 1.8 V 0.9 V< VIN ≤ 2 V 2 V < VIN ≤ 5 V Full Full Full Full 1.6 110 10 160 20 0.55 0.8 1.2 0.2 ms % °C V OUT Symbol VIN = 1.2 V, VOUT = Vnome, TA = 25 °C VOUT = Vnom X 0.95 VOUT = Vnom + 0.5 V, VLX > VIN VOUT = Vnom + 0.5 V, VLX < VIN XSHD = 0 V, not including switch leakage LX = 5 V VOUT = 3.3 V Full 1 Full 0.2 3 22 Temp.
a
Limits Min.b Typ.c 330 134 44 1 2 10 Ω mA µA Max.b 450 Unit
Notes: a. Full = - 40 °C to 85 °C. b. The algebraic convention whereby the most negative value is a minimum and the most positive a maximum (- 40 °C to 85 °C). c. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing. d. Minimum operating voltage is determined by the battery’s capability to provide energy as it is deeply discharged. e. Vnom equals programmed output voltage.
Document Number: 73579 S09-1454-Rev. B, 03-Aug-09
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SiP12503
Vishay Siliconix
PIN CONFIGURATION AND TRUTH TABLE
PowerPAK MLP33-6
XSHD
1
6
LX
VIN
2
5
GND
VOUT
3
4
FB
Top View
ORDERING INFORMATION
Part Number SiP12503DMP-T1-E3 Temperature Range - 40 °C to 85 °C Marking 2503
PIN DESCRIPTION
Pin Number 1 2 3 4 5 6 Name XSDH VIN VOUT FB GND LX Input voltage Output of the boost converter and power source for the IC-battery Output voltage feedback pin Signal and power ground Switch pin Function Logic controlled shutdown Input, XSHD = high: normal operation, XSHD = low: shutdown
PIN FUNCTIONS
XSHD (Pin 1) XSHD is a logic-level shutdown control pin. When XSHD is low, the IC’s switching is disabled, and an antiringing switch is connected between LX and VIN. When XSHD is high, the IC is working in normal operation. VIN (Pin 2) VIN is the pin connected to battery input voltage. At start-up, SiP12503 is powered from the voltage at the VIN pin. Once VOUT exceeds VIN, the SiP12503 is powered from VOUT. This increases the drive to the gate of the internal power switch, to allow higher maximum output currents and higher converter efficiency. VOUT (Pin 3) VOUT is the output of the boost converter and also the power source for the IC. FB (Pin 4) FB is the output voltage feedback pin via an external resistor divider. The feedback voltage is nominally 0.6 V.
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GND (Pin 5) GND is the ground pin for signal and power ground. LX (Pin 6) LX connects to the drain of the internal power MOSFET (boost switch). Externally, the LX pin should be connected to the boost inductor and Schottky diode. If the inductor current falls to zero, or XSHD is low, an internal antiringing switch is short from LX to VIN to minimize EMI.
SiP12503
Vishay Siliconix
FUNCTIONAL BLOCK DIAGRAM
VOUT VIN GND Over Voltage Compensation Start-Up LX FB E/A + + PWM PFM Antiringing SW
Driver
XSHD
Reference and Soft-Start
Oscillator
DETAILED OPERATION
SiP12503 is a 300 kHz boost converter IC, packaged in 6 pin MLP33 PowerPAKTM package. With start-up from input voltages as low as 0.65 V, this device features fixed frequency voltage mode PWM control with internal frequency compensation. With its low RDS(on) internal power MOSFET, this device maintains high efficiency over a wide range of load current. Under light load conditions, it switches to in PFM mode to maintain high efficiency. A FB pin is available to adjust the output voltage. Low Voltage Start-Up SiP12503 is designed to start-up at input voltage of typically 0.65 V. At start-up, VOUT is lower than VIN due to the voltage drop of the Schottky diode. Therefore, the device uses VIN as the power source for its control logic and internal gate drive, until VOUT exceeds VIN. During the start-up interval, the boost switch’s conduction interval during each cycle is determined by the time taken for the inductor current to reach internal current limit, followed by a fixed off time before the switch is allowed to turn on again. Once VOUT exceeds VIN, the device uses VOUT as the IC’s power source. When VOUT exceeds 1.89 V, the device engages is built-in soft-start circuitry. Soft-Start During soft-start, the loop compensation guarantees the slow increase of output voltage, so that no large voltage overshoot or inrush current transients occur when the soft-start period ends. PWM operation After the soft-start interval is over, the device works in PWM operation with a fixed frequency of 300 kHz, with automatic switch-over to PFM operation during light load conditions. PFM Operation When operating into light loads, the SiP12502 automatically switches to PFM operation. This reduces gate charge losses in the boost switch, hence raising converter efficiency.
Document Number: 73579 S09-1454-Rev. B, 03-Aug-09 www.vishay.com 5
Over Voltage Protection If the output voltage is above 10 % of the regulation voltage, the device will turn off the internal power mosfet and wait until the output voltage fails below the regulation voltage, then the PWM operation is enabled again. Thermal Shutdown Protection If the internal device temperature rises above 160 °C, the device will turn off the internal power MOSFET. Once the die temperature falls below 140 °C, then the device performs a new soft-start cycle, and the converter resumes normal operation. Antiringing Control The antiringing control circuitry prevents high frequency ringing at the LX pin as the inductor current goes to zero by damping the resonant circuit formed by L and CLX (capacitance on LX pin). When the IC is shutdown, this antiringing switch is also turned on.
APPLICATION INFORMATION
Setting the Adjustable Output Voltage The SiP12503 regulated output can be adjusted from 1.8 V to 5.0 V via a resistor divider network from VOUT to GND. R1 and R2 should be kept in the 50 kΩ to 100 kΩ range for low power consumption while maintaing adequate noise immunity. The value of R1 is calculated using the following formula: R1 = R2 * [(VOUT/VFB) - 1] VFB = 0.6 V
SiP12503
Vishay Siliconix
TYPICAL CHARACTERISTICS
320 310 Supply Current 1 (mA) 300 Frequency (kHz) 290 280 270 260 250 - 50 0.20 - 50 0.35 0.40
0.30
0.25
- 30
- 10
10
30
50
70
90
- 30
- 10
10
30
50
70
90
Temperature (°C)
Temperature (°C)
Frequency vs. Temperature
0.180 0.175 Supply Current 2 (mA) 0.170 90 % Duty Cycle 0.165 0.160 0.155 0.150 85 0.145 0.140 - 50 - 30 - 10 10 30 50 70 90 84 83 - 60 89 88 87 86 93 92 91
Supply Current 1 vs Temperature
- 40
- 20
0
20
40
60
80
100
Temperature (°C)
Temperature (°C)
Supply Current 2 vs. Temperature
0.18 0.16 Shutdown Input Voltage Threshold (V) 0.14 0.12 RDS(on) Ω 0.10 0.08 0.06 0.04 0.02 0.00 0 1 2 3 VOUT (V) 4 5 6 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3
Maximum PWM Duty Cycle vs. Temperature
0.2 0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
VIN (V)
RDS(on) vs. Output Voltage
Shutdown Input Voltage Threshold vs. VIN
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Document Number: 73579 S09-1454-Rev. B, 03-Aug-09
SiP12503
Vishay Siliconix
TYPICAL CHARACTERISTICS
4 3 Feedback Voltage Accuracy (%) 2 1 0 -1 -2 0.2 -3 -4 - 50 0.0 - 50 Shutdown Threshold (V) 1.2 VIN = 5.0 V 1.0
0.8 VIN = 2.0 V 0.6 VIN = 0.8 V 0.4
- 30
- 10
10
30
50
70
90
- 30
- 10
10
30
50
70
90
Temperature (°C)
Temperature (°C)
Feedback Voltage vs. Temperature
90 80 70 60 Efficiency (%) Efficiency (%) 50 40 30 20 10 0 0.1 100 90 80 70 60 50 40 30 20 10 0 0.1
Shutdown Threshold vs. Temperature
1
10 Load Current (mA)
100
1000
1
10 Load Current (mA)
100
1000
VIN = 1.2 V, VOUT = 2 V
100 90 80 70 Efficiency (%) 60 50 40 30 20 10 0 0.1
VIN = 2.4 V, VOUT = 3.3 V
1
10 Load Current (mA)
100
1000
VIN = 2.4 V, VOUT = 5 V
Document Number: 73579 S09-1454-Rev. B, 03-Aug-09
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SiP12503
Vishay Siliconix
TYPICAL WAVEFORMS
VOUT 50 mV/div
VOUT 20 mV/div
LX 2 V/div
LX 2 V/div
1 µs/div
100 µs/div
Typical Switching Waveform PWM Mode VIN = 1.2 V, VOUT = 3.3 V, Load Current = 150 mA, L = 10 µH; COUT = 47 µF
Typical Switching Waveform PFM Mode VIN = 1.2 V, VOUT = 3.3 V, Load Current = 10 mA, L = 10 µH; COUT = 47 µF
VOUT 1 V/div
5 ms/div
Soft Start VIN = 1.2 V, VOUT = 3.3 V, Load Current = 50 mA, L = 10 µH; COUT = 47 µF
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?73579.
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Document Number: 73579 S09-1454-Rev. B, 03-Aug-09
Package Information
Vishay Siliconix
PowerPAKr MLP33-6, 8 and 10 (POWER IC ONLY)
4xQ
// ccc C
TopView
Detail D
A
NX
A2 A1 A3 Side View NX b e 1 2 5
bbb M C A A ddd M C
8
0.08 C
Detail C
C
Seating Plane
Detail C A1
Exposed Pad (Optional) R2 R
L 7 11 D L2 NxK 8 A B
See Detail B
6 (ND-1) x D2
D2/2 e 9 9
2X
4
Pin 1 Mark
aaa C 2X
Bottom View
aaa C
Datum A or B NX R1 NX R1
Datum A or B
L e/2 e Even pin/Side L2 pin Tip 5 Detail B 0.17 min Exposed Slug/Heat Sink L1 L2 10 e Odd pin/Side pin Tip 5
0.17 0.30
B
This Feature Applies To Both Ends of The Package Detail A
Exposed Metalized Feature Edge of Plastic Body
Document Number: 72820 28-Jan-04
ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ
1
ÉÉÉ ÇÇ ÉÉÉ ÇÇ ÉÉÉ
Detail D
E2 E2/2
See Detail A N N-1
7
E
L2
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1
Package Information
Vishay Siliconix
PowerPAKr MLP33-6, 8, 10 N = 6 PITCH: 0.95 mm N = 8 PITCH: 0.65 mm N = 10 PITCH: 0.50 mm MILLIMETERS*
Dim A A1 A2 A3 aaa b-6 b-8 b-10 bbb ccc D D2 ddd E E2 e-6 e-8 e-10 K L L1-6 L1-8 L1-10 L2 R Ref R1 Ref-6 R1 Ref-8 R1 Ref-10 Q Basic
− − − − − − − − − − 3.00 − − 3.00 − − − − − − − − − − − − − − −
INCHES
Min Nom
0.035 0.001 0.028 0.008 0.004 0.014 0.012 0.008 0.004 0.004 − 0.080 0.002 − − 0.047 0.037 0.026 0.020 − 0.011 0.009 0.009 − − 0.006 0.005 0.006 0.003 10_ − 0.051 − − − − 0.018 0.016 0.016 − 0.005 − − − − 12_
Min
0.80 0.00 0.65 0.15 − 0.33 0.285 0.18 − − − 1.92 − − 1.10 − − − 0.20 0.20 0.16 0.16 − − − − − − 0_
Nom
0.90 0.025 0.70 0.20 0.10 0.35 0.305 0.20 0.10 0.10 − 2.02 0.05 − 1.20 0.95 0.65 0.50 − 0.29 0.24 0.24 − − 0.15 0.127 0.15 0.075 10_
Max
1.00 0.05 0.75 0.25 − 0.43 0.385 0.28 − − − 2.12 − − 1.30 − − − − 0.45 0.40 0.40 − 0.125 − − − − 12_
Basic
− − − − − − − − − − 0.118 − − 0.118 − − − − − − − − − − − − − − −
Max
0.039 0.002 0.030 0.010 − 0.017 0.015 0.011 − − − 0.083
Notes
1, 2 1, 2 1, 2 1, 2 1, 2 1, 2, 8 1, 2, 8 1, 2, 8 1, 2 1, 2 1, 2, 8 1, 2, 8 1, 2 1, 2, 8 1, 2, 8 1, 2 1, 2 1, 2 5, 11 1, 2, 8 1, 2, 8 1, 2, 8 1, 2, 8 5, 11 1, 2, 8 1, 2, 8 1, 2, 8 1, 2, 8 1, 2
0.031 0.000 0.026 0.006 − 0.013 0.011 0.007 − − − 0.076
0.043 − − − 0.008 0.008 0.006 0.006 − − − − − − 0_
* Use millimeters as the primary measurement. ECN: S-40082—Rev. A, 02-Feb-04 DWG: 5925 NOTES: 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. www.vishay.com Dimensioning and tolerancing conform to ASME Y14.5M-1994. All dimensions are in millimeters. All angels are in degrees. N is the total number of pins. The pin #1 identifier and pin numbering convention shall conform to JESD 95-1 SPP-012. Details of pin #1 identifier is located within the zone indicated. The pin #1 identifier is marked. Dimension b applies to metallized pin and is measured between 0.15 mm and 0.20 mm from the pin tip. ND refers to the maximum number of pins on the D side. Depopulation of pins is allowed and will be called out on the individual variation. Coplanarity applies to the exposed heat sink slug as well as the pins. Profile tolerance (aaa) will be applicable only to the plastic body and not to the metallized features (such as the pin tips and tie bars.) Metallized features may protrude a maximum of L2 from the plastic body profile. L1 max is not called out, the metallized feature will extend to the exposed pad. Thus, the 0.17-mm gap does not apply. The corner will be sharp unless otherwise specified with radius dimensions. Document Number: 72820 28-Jan-04
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Document Number: 91000 Revision: 11-Mar-11
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