T1090P

T1090P Vishay Semiconductors Silicon NPN Phototransistor FEATURES • Package type: chip • Package form: single chip • Dimensions (L x W x H in mm): 0.53 x 0.53 x 0.185 • High photo sensitivity • High radiant sensitivity • Suitable for visible and near infrared radiation • Fast response times 21650 E B DESCRIPTION T1090P is a silicon NPN phototransistor chip with high radiant sensitivity, sensitive to visible and near infrared radiation. • Compliant to RoHS Directive 2002/95/EC and in accordance to WEEE 2002/96/EC APPLICATIONS • Detector in electronic control and drive circuits GENERAL INFORMATION The datasheet is based on Vishay optoelectronics sample testing under certain predetermined and assumed conditions, and is provided for illustration purpose only. Customers are encouraged to perform testing in actual proposed packaged and used conditions. Vishay optoelectronics die products are tested using Vishay optoelectronics based quality assurance procedures and are manufactured using Vishay optoelectronics established processes. Estimates such as those described and set forth in this datasheet for semiconductor die will vary depending on a number of packaging, handling, use, and other factors. Therefore sold die may not perform on an equivalent basis to standard package products. PRODUCT SUMMARY COMPONENT T1090P Ica (mA) 0.43 to 0.77  (deg) ± 60 0.1 (nm) 440 to 1070 Note • Test condition see table “Basic Characteristics” ORDERING INFORMATION ORDERING CODE T1090P-SD-F Note • MOQ: minimum order quantity PACKAGING Wafer sawn on foil with disco frame REMARKS MOQ: 100 000 pcs PACKAGE FORM Chip ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER Collector emitter voltage Emitter collector voltage Collector current Junction temperature Operating temperature range Storage temperature range Storage temperature range on foil TEST CONDITION SYMBOL VCEO VECO IC Tj Tamb Tstg1 Tstg2 VALUE 70 5 50 100 - 40 to + 100 - 40 to + 100 - 40 to + 50 UNIT V V mA °C °C °C °C Document Number: 81123 Rev. 1.5, 23-Mar-11 For technical questions, contact: optochipsupport@vishay.com www.vishay.com 1 This datasheet is subject to change without notice. THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 T1090P Vishay Semiconductors Silicon NPN Phototransistor BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER Collector emitter breakdown voltage Collector emitter dark current Collector light current (Vishay selection type (1)) Wavelength of peak sensitivity Range of spectral bandwidth Rise time Fall time VCE = 5 V, IC = 2 mA, RL = 100  VCE = 5 V, IC = 2 mA, RL = 100  TEST CONDITION IC = 1 mA VCE = 20 V, E = 0 Ee = 1 mW/cm2,  = 950 nm, VCE = 5 V SYMBOL V(BR)CEO ICEO Ica p 0.1 tr, tf tr, tf 0.43 825 440 to 1070 4.3 7.7 MIN. 70 1 0.77 TYP. MAX. UNIT V nA mA nm nm μs μs Notes • The measurements are based on samples of die which are mounted on a TO-header without resin coating (1) Specific selection types possible BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) 100 90 tr/tf - Rise/Fall Time (µs) 80 70 60 50 40 30 20 10 0 0 250 500 750 1000 1250 1500 1750 2000 IC - Collector Current (µA) tr tf RL = 100 Ω 20599 Fig. 1 - Rise/Fall Time vs. Collector Current MECHANICAL DIMENSIONS PARAMETER Length of chip edge (x-direction) Length of chip edge (y-direction) Die height Diameter of bond pad base Bond pad emitter SYMBOL Lx Ly H d axb MIN. TYP. 0.52 0.52 0.185 0.1 0.1 x 0.1 MAX. UNIT mm mm mm mm mm2 ADDITIONAL INFORMATION Frontside metallization, base (B), emitter (E) Backside metallization, collector Dicing Die bonding technology Aluminum AuSb Sawing Epoxy bonding Note • All chips are checked in accordance with the Vishay Semiconductor, specification of visual inspection FVOV6870. The visual inspection shall be made in accordance with the “specification of visual inspection as referenced”. The visual inspection of chip backside is performed with stereo microscope with incident light and 40x to 80x magnification. The quality inspection (final visual inspection) is performed by production. An additional visual inspection step as special release procedure by QM is not installed. www.vishay.com 2 For technical questions, contact: optochipsupport@vishay.com Document Number: 81123 Rev. 1.5, 23-Mar-11 This datasheet is subject to change without notice. THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 T1090P Silicon NPN Phototransistor Vishay Semiconductors HANDLING AND STORAGE CONDITIONS • The hermetically sealed shipment lots shall be opened in temperature and moisture controlled cleanroom environment only. It is mandatory to follow the rules for disposition of material that can be hazardous for humans and environment. • Product must be handled only at ESD safe workstations. Standard ESD precautions and safe work environments are as defined in MIL-HDBK-263. • Singulated die are not to be handled with tweezers. A vacuum wand with non metallic ESD protected tip should be used. PACKING Chips are fixed on adhesive foil. Upon request the foils can be mounted on plastic frame or disco frame. For shipment, the wafers are arranged to stacks and hermetically sealed in plastic bags to ensure protection against environmental influence (humidity and contamination). Use for recycling reliable operators only. We can help getting in touch with your nearest sales office. By agreement we will take back packing material, if it is sorted. You will have to bear the costs of transport. We will invoice you for any costs incurred for packing material that is returned unsorted or which we are not obliged to accept. Document Number: 81123 Rev. 1.5, 23-Mar-11 For technical questions, contact: optochipsupport@vishay.com www.vishay.com 3 This datasheet is subject to change without notice. THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. 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It is the customer’s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein. Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk and agree to fully indemnify and hold Vishay and its distributors harmless from and against any and all claims, liabilities, expenses and damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that Vishay or its distributor was negligent regarding the design or manufacture of the part. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 11-Mar-11 www.vishay.com 1