TM8L106K016USA

TM8 Vishay Sprague MICROTANTM High Solid Tantalum Chip Capacitors Reliability, Low DCL, Leadframeless Molded FEATURES • High reliability solid surface mount tantalum capacitors • Low DCL for extended battery life • Small sizes for space constrained applications • L-shaped terminations for superior board mounting • Suitable for medical implantable applications additional screening • Compliant to RoHS directive 2002/95/EC with PERFORMANCE CHARACTERISTICS Operating Temperature: - 55 °C to + 85 °C (to + 125 °C with voltage derating) Capacitance Range: 1 µF to 47 µF Capacitance Tolerance: ± 10 % and ± 20 % standard Voltage Range: 2 WVDC to 40 WVDC ORDERING INFORMATION TM8 MODEL R CASE CODE See Ratings and Case Codes Table 106 CAPACITANCE M CAPACITANCE TOLERANCE K = ± 10 % M = ± 20 % 016 DC VOLTAGE RATING AT + 85 °C This is expressed in volts. To complete the three-digit block, zeros precede the voltage rating. A decimal point is indicated by an “R” (6R3 = 6.3 V). E TERMINATION/ PACKAGING E = Sn/Pb solder/ 7" (178 mm) reels R = Sn/Pb solder/ 7" (178 mm) 300 pcs. qty. C = 100 % tin/ 7" (178 mm) reels U = 100 % tin/ 7" (178 mm) 300 pcs. qty. B RELIABILITY LEVEL B = 0.1 % weibull FRL S = Hi-Rel std. (40 h burn-in) Z = Nonestablished reliability A SURGE CURRENT A = 10 cycles at 25 °C B = 10 cycles at - 55 °C/+ 85 °C Z = None This is expressed in picofarads. The first two digits are the significant figures. The third is the number of zeros to follow. Note • Standard options are in bold DIMENSIONS in inches [millimeters] Anode Polarity Bar Anode Termination Cathode Termination C W H P1 P2 P1 L CASE Q D E F K L 0.100 ± 0.015 [2.54 ± 0.38] 0.150 ± 0.015 [3.8 ± 0.38] 0.201 ± 0.015 [5.1 ± 0.38] 0.220 ± 0.015 [5.6 ± 0.38] 0.045 ± 0.002 [1.14 ± 0.05] W 0.053 ± 0.012 [1.35 ± 0.30] 0.100 ± 0.015 [2.54 ± 0.38] 0.100 ± 0.015 [2.54 ± 0.38] 0.138 ± 0.012 [3.5 ± 0.3] 0.026 ± 0.002 [0.66 ± 0.05] H 0.050 ± 0.012 [1.27 ± 0.30] 0.050 ± 0.012 [1.27 ± 0.30] 0.050 ± 0.012 [1.27 ± 0.30] 0.050 ± 0.012 [1.27 ± 0.30] 0.024 max. [0.61 max.] P1 0.031 + 0.004/- 0.006 [0.80 + 0.1/- 0.15] 0.031 + 0.004/- 0.006 [0.80 + 0.1/- 0.15] 0.031 + 0.004/- 0.006 [0.80 + 0.1/- 0.15] 0.039 ± 0.005 [1.0 ± 0.13] 0.010 ± 0.004 [0.25 ± 0.1] P2 (REF.) 0.038 ± 0.010 [0.96 ± 0.25] 0.088 ± 0.010 [2.24 ± 0.25] 0.139 ± 0.010 [3.5 ± 0.25] 0.142 ± 0.010 [3.6 ± 0.25] 0.020 min. [0.51 min.] C 0.046 + 0.009/- 0.001 [1.17 + 0.23/- 0.025] 0.091 + 0.009/- 0.001 [2.3 + 0.23/- 0.025] 0.091 + 0.009/- 0.001 [2.3 + 0.23/- 0.025] 0.126 + 0.009/- 0.001 [3.2 + 0.23/- 0.025] 0.015 ± 0.004 [0.38 ± 0.1] Document Number: 40133 Revision: 22-Jun-10 www.vishay.com 38 For technical questions, contact: tantalum@vishay.com TM8 Solid Tantalum Chip Capacitors MICROTANTM High Reliability, Low DCL, Leadframeless Molded DIMENSIONS in inches [millimeters] CASE L M N P R T W L 0.081 ± 0.008 [2.05 ± 0.2] 0.063 ± 0.006 [1.60 ± 0.15] 0.138 + 0.004/- 0.008 [3.505 + 0.101/- 0.203] 0.096 ± 0.006 [2.45 ± 0.15] 0.081 ± 0.006 [2.06 ± 0.15] 0.138 + 0.004/- 0.008 [3.505 + 0.101/- 0.203] 0.081 ± 0.006 [2.06 ± 0.15] W 0.051 ± 0.004 [1.3 ± 0.10] 0.033 ± 0.006 [0.84 ± 0.15] 0.110 ± 0.004 [2.80 ± 0.1] 0.059 ± 0.006 [1.5 ± 0.15] 0.053 ± 0.006 [1.35 ± 0.15] 0.110 ± 0.004 [2.80 ± 0.1] 0.053 ± 0.006 [1.35 ± 0.15] H 0.04 max. [1.0 max.] 0.033 ± 0.006 [0.84 ± 0.15] 0.04 max. [1.0 max.] 0.049 max. [1.25 max.] 0.058 ± 0.004 [1.47 ± 0.10] 0.06 max. [1.52 max.] 0.047 max. [1.2 max.] P1 0.020 ± 0.004 [0.50 ± 0.1] 0.020 ± 0.004 [0.51 ± 0.1] 0.031 + 0.004/- 0.006 [0.80 + 0.1/- 0.15] 0.020 ± 0.004 [0.51 ± 0.1] 0.020 ± 0.004 [0.51 ± 0.1] 0.031 + 0.004/- 0.006 [0.80 + 0.1/- 0.15] 0.020 ± 0.004 [0.51 ± 0.1] P2 (REF.) 0.027 min. [0.70 min.] 0.019 min. [0.48 min.] 0.088 ± 0.010 [2.24 ± 0.25] 0.043 min. [1.1 min.] 0.028 min. [0.71 min.] 0.088 ± 0.010 [2.24 ± 0.25] 0.028 min. [0.71 min.] C 0.035 + 0.009/- 001 [0.9+0.23/- 0.02] 0.024 ± 0.004 [0.61 ± 0.1] 0.091 + 0.009/- 0.001 [2.3 + 0.23/- 0.025] 0.035 ± 0.004 [0.90 ± 0.1] 0.035 ± 0.004 [0.90 ± 0.1] 0.091 + 0.009/- 0.001 [2.3 + 0.23/- 0.025] 0.035 ± 0.004 [0.90 ± 0.1] Vishay Sprague RATINGS AND CASE CODES F 1.0 2.2 3.3 4.7 7.5 10 15 22 33 47 T M M M L R R N* R P 6.3 V 10 V M 16 V M 20 V W 25 V R 40 V P Note * Preliminary values, contact factory for availability. MARKING M-Case Polarity Bar Voltage Code P-Case Polarity Bar Voltage Capacitance Code Code A K-Case Polarity band GJ D, E, F, N, T-Case Capacitance Voltage XXX - XX Vishay logo (if space allows) Document Number: 40133 Revision: 22-Jun-10 For technical questions, contact: tantalum@vishay.com www.vishay.com 39 TM8 Vishay Sprague Solid Tantalum Chip Capacitors MICROTANTM High Reliability, Low DCL, Leadframeless Molded MAX. DC LEAKAGE PART NUMBER AT + 25 °C (µA) 6.3 WVDC AT + 85 °C, 4 WVDC AT + 125 °C TM8M106(1)6R3(2)(3)(5) 0.32 TM8M156(1)6R3(2)(3)(5) 0.47 10 WVDC AT + 85 °C, 7 WVDC AT + 125 °C TM8M105(1)010(2)(3)(5) TM8M475(1)010(2)(3)(5) TM8L755(1)010(2)(3)(5) TM8R106(1)010(2)(3)(5) 0.20 0.24 0.38 0.50 MAX. ESR AT + 25 °C 100 kHz STD. (Ω) 5.0 5.0 12.0 6.0 8.0 6.0 1.0 12.0 6.0 8.0 8.0 8.0 10.0 6.0 10.0 STANDARD RATINGS CAPACITANCE (µF) CASE CODE MAX. DF AT + 25 °C (%) 10 15 1.0 4.7 7.5 10 47 1.0 10 1.0 3.3 7.5 1.0 4.7 1.0 M M M M L R T M R W R N R P P 8 8 6 8 8 8 8 6 8 8 8 8 6 6 8 TM8T476(1)010(2)(3)(5) 2.35 16 WVDC AT + 85 °C, 10 WVDC AT + 125 °C TM8M105(1)016(2)(3)(5) 0.20 TM8R106(1)016(2)(3)(5) 0.80 20 WVDC AT + 85 °C, 13 WVDC AT + 125 °C TM8W105(1)020(2)(3)(5) TM8R335(1)020(2)(3)(5) 0.20 0.33 TM8N755(1)020(2)(3)(5)* 0.93 25 WVDC AT + 85 °C, 17 WVDC AT + 125 °C TM8R105(1)025(2)(3)(5) 0.20 TM8P475(1)025(2)(3)(5) 0.59 40 WVDC AT + 85 °C, 27 WVDC AT + 125 °C TM8P105(1)040(2)(3)(5) 0.20 Notes (1) Capacitance tolerance: K, M (2) Termination and Packaging: E, C (3) Reliability level: Z, S, B (4) Reliability level: Z only (5) Surge current: Z, A, B (6) Surge current: Z only * Preliminary ratings: contact factory for availability www.vishay.com 40 For technical questions, contact: tantalum@vishay.com Document Number: 40133 Revision: 22-Jun-10 TM8 Solid Tantalum Chip Capacitors MICROTANTM High Reliability, Low DCL, Leadframeless Molded CAPACITORS PERFORMANCE CHARACTERISTICS ELECTRICAL PERFORMANCE CHARACTERISTICS ITEM Category Temperature Range Capacitance Tolerance Dissipation Factor (at 120 Hz) ESR (100 kHz) Leakage Current PERFORMANCE CHARACTERISTICS - 55 °C to + 85 °C (to + 125 °C with voltage derating) ± 20 %, ± 10 % (at 120 Hz) 1 Vrms at + 25 °C using a capacitance bridge Limits per Standard Ratings table. Tested via bridge method, at 25 °C, 120 Hz. Limits per Standard Ratings table. Tested via bridge method, at 25 °C, 100 kHz. After application of rated voltage applied to capacitors for 5 minutes using a steady source of power with 1 kΩ resistor in series with the capacitor under test, leakage current at 25 °C is not more than described in Standard Ratings Table. Note that the leakage current varies with temperature and applied voltage. See graph below for the appropriate adjustment factor. Capacitors are capable of withstanding peak voltages in the reverse direction equal to: 10 % of the DC rating at + 25 °C or 5 % of the DC rating at + 85 °C. Vishay does not recommended intentional or repetitive application of reverse voltage. If capacitors are to be used at temperatures above + 25 °C, the permissible rms ripple current or voltage shall be calculated using the derating factors: 1.0 at + 25 °C 0.9 at + 85 °C 0.4 at + 125 °C + 85 °C RATING + 125 °C RATING WORKING VOLTAGE (V) WORKING VOLTAGE (V) 2 1.3 4 2.7 6.3 4 10 7 15 10 16 10 20 13 25 17 40 27 Vishay Sprague Reverse Voltage Temperature Derating Operating Temperature TYPICAL LEAKAGE CURRENT FACTOR RANGE 100 LEAKAGE CURRENT FACTOR + 125 °C 10 + 85 °C + 55 °C 1.0 + 25 °C 0 °C 0.1 - 55 °C 0.01 0.001 0 10 20 30 40 50 60 70 80 90 100 PERCENT OF RATED VOLTAGE Notes • At + 25 °C, the leakage current shall not exceed the value listed in the Standard Ratings table • At + 85 °C, the leakage current shall not exceed 10 times the value listed in the Standard Ratings table • At + 125 °C, the leakage current shall not exceed 12 times the value listed in the Standard Ratings table Document Number: 40133 Revision: 22-Jun-10 For technical questions, contact: tantalum@vishay.com www.vishay.com 41 TM8 Vishay Sprague Solid Tantalum Chip Capacitors MICROTANTM High Reliability, Low DCL, Leadframeless Molded TYPICAL CURVES AT + 25 °C, IMPEDANCE AND ESR VS. FREQUENCY “M” Case 1000 IMPEDANCE ESR 100 100 1000 IMPEDANCE ESR “M” Case ESR/Z, Ω ESR/Z, Ω 10 4.7 µF - 10 V 1 10 10 µF - 6 V 1 0.1 1 10 100 1000 0.1 0.1 1 10 100 1000 FREQUENCY, kHz FREQUENCY, kHz “M” Case 10 000 IMPEDANCE ESR 1000 100.0 1000.0 “P” CASE IMPEDANCE ESR 100 ESR, Z, Ω 1 µF - 16 V ESR/Z, Ω 10.0 10 1.0 4.7 µF - 25 V 1 0.1 1 10 100 1000 0.1 0.1 1 10 100 1000 FREQUENCY, kHz FREQUENCY, kHz www.vishay.com 42 For technical questions, contact: tantalum@vishay.com Document Number: 40133 Revision: 22-Jun-10 TM8 Solid Tantalum Chip Capacitors MICROTANTM High Reliability, Low DCL, Leadframeless Molded PLASTIC TAPE AND REEL PACKAGING in inches [millimeters] 0.157 ± 0.004 [4.0 ± 0.10] Deformation Between Embossments 0.059 + 0.004 - 0.0 [1.5 + 0.10 - 0.0] Vishay Sprague Tape Thickness 0.014 [0.35] MAX. 10 pitches cumulative tolerance on tape ± 0.008 [0.200] Embossment 0.069 ± 0.004 0.079 ± 0.002 [1.75 ± 0.10] [2.0 ± 0.05] Top Cover Tape B1 MAX. (Note 6) K0 Top Cover Tape 0.004 [0.1] MAX. For Tape Feeder Reference only including draft. Concentric around B0 (Note 5) Center Lines of Ca vity A0 B0 0.030 [0.75] MIN. (Note 3) 0.030 [0.75] MIN. (Note 4) 20° F W Maximum Component Rotation (Side or Front Sectional Vie w) P1 D1 MIN. For Components 0.079 x 0.047 [2.0 x 1.2] and Larger . (Note 5) USER DIRECTION OF FEED Maximum Cavity Siz e (Note 1) Cathode (-) Anode (+) Direction of Feet 20° Maximum Component Rotation Ty pical Component Cavity Center Line Ty pical Component Center Line 3.937 [100.0] 0.039 [1.0] MAX. Tape 0.039 [1.0] MAX. 0.9843 [250.0] Camber (Top View) Allo wable Camber to be 0.039/3.937 [1/100] Non-Cumulative Ov er 9.843 [250.0] B0 Tape and Reel Specifications: All case sizes are available on plastic embossed tape per EIA-481-1. Tape reeling per IEC 286-3 is also available. Standard reel diameter is 7" [178 mm], 13" [330 mm] reels are available and recommended as the most cost effective packaging method. The most efficient packaging quantities are full reel increments on a given reel diameter. The quantities shown allow for the sealed empty pockets required to be in conformance with EIA-481-1. Reel size and packaging orientation must be specified in the Vishay Sprague part number. A0 (Top Vie w) Note Metric dimensions will govern. Dimensions in inches are rounded and for reference only. CASE CODE TM8 P Q L R W D E F N T TAPE SIZE 8 mm 8 mm 8 mm 8 mm 8 mm 12 mm 12 mm 12 mm 12 mm 12 mm B1 (MAX.) 0.108 (2.75) 0.135 (3.43) 0.094 (2.4) 0.112 (2.85) 0.112 (2.85) 0.154 (3.9) 0.235 (5.97) 0.231 (5.88) 0.150 (3.8) 0.150 (3.8) D1 (MIN.) 0.039 (1.0) 0.039 (1.0) 0.039 (1.0) 0.039 (1.0) 0.039 (1.0) 0.059 (1.5) 0.059 (1.5) 0.059 (1.5) 0.059 (1.5) 0.059 (1.5) K0 (MAX.) 0.054 (1.37) 0.065 (1.65) 0.047 (1.2) 0.066 (1.68) 0.053 (1.35) 0.051 (1.3) 0.070 (1.78) 0.060 (1.53) 0.047 (1.2) 0.063 (1.60) F 0.138 (3.5) 0.138 (3.5) 0.138 (3.5) 0.138 (3.5) 0.138 (3.5) 0.216 (5.5) 0.216 (5.5) 0.216 (5.5) 0.216 (5.5) 0.216 (5.5) P1 0.157 (4.0) 0.157 (4.0) 0.157 (4.0) 0.157 (4.0) 0.157 (4.0) 0.157 (4.0) 0.157 (4.0) 0.157 (4.0) 0.157 (4.0) 0.157 (4.0) W 0.315 (8.0) 0.315 (8.0) 0.315 (8.0) 0.315 (8.0) 0.315 (8.0) 0.472 (12.0) 0.472 (12.0) 0.472 (12.0) 0.472 (12.0) 0.472 (12.0) www.vishay.com 43 Document Number: 40133 Revision: 22-Jun-10 For technical questions, contact: tantalum@vishay.com TM8 Vishay Sprague Solid Tantalum Chip Capacitors MICROTANTM High Reliability, Low DCL, Leadframeless Molded PAPER TAPE AND REEL PACKAGING in inches [millimeters] P2 T Ø D0 [10 pitches cumulative tolerance on tape ± 0.2 mm] E1 P0 A0 F B0 W E2 Bottom Cover Tape Top Cover Tape Cavity Center Lines P1 Anode Cavity Size Note 1 G Bottom Cover Tape User Feed Direction TM8 CASE TAPE SIZE SIZE K M 8 mm 8 mm A0 B0 D0 P0 P1 P2 E F W T 0.033 ± 0.002 0.053 ± 0.002 0.06 ± 0.004 0.157 ± 0.004 0.078 ± 0.004 0.079 ± 0.002 0.069 ± 0.004 0.0138 ± 0.002 0.315 ± 0.008 0.03 ± 0.002 [0.85 ± 0.05] [1.35 ± 0.05] [1.5 ± 0.1] [4.0 ± 0.1] [2.0 ± 0.1] [2.0 ± 0.05] [1.75 ± 0.1] [3.5 ± 0.05] [8.0 ± 0.2] [0.75 ± 0.05] 0.041 ± 0.002 0.071 ± 0.002 0.06 ± 0.004 0.157 ± 0.004 0.157 ± 0.004 0.079 ± 0.002 0.069 ± 0.004 0.0138 ± 0.002 0.315 ± 0.008 0.037 ± 0.002 [1.05 ± 0.05] [1.8 ± 0.05] [1.5 ± 0.1] [4.0 ± 0.1] [4.0 ± 0.1] [2.0 ± 0.05] [1.75 ± 0.1] [3.5 ± 0.05] [8.0 ± 0.2] [0.95 ± 0.05] STANDARD PACKAGING QUANTITY SERIES CASE CODE K M P Q D E F L N R T W 7" REEL 5000 4000 3000 4000 2500 2500 2500 2500 2500 2500 2500 2500 QTY (PCS/REEL) 1/2 REEL 2500 2000 1500 2000 1250 1250 1250 1250 1250 1250 1250 1250 SMALL REEL 300 300 300 300 300 300 300 300 300 300 300 300 TM8 POWER DISSIPATION SERIES CASE CODE K M P Q D E F L N R T W For technical questions, contact: tantalum@vishay.com MAXIMUM PERMISSIBLE POWER DISSIPATION AT + 25 °C (W) IN FREE AIR 0.015 0.025 0.045 0.045 0.084 0.090 0.110 0.035 0.075 0.045 0.084 0.040 Document Number: 40133 Revision: 22-Jun-10 TM8 www.vishay.com 44 TM8 Solid Tantalum Chip Capacitors MICROTANTM High Reliability, Low DCL, Leadframeless Molded RECOMMENDED REFLOW PROFILES Tp °C TL °C Temperature (°C) Ts MAX. °C (tL) (tp) Vishay Sprague Ts MAX. °C Preheat (ts) 25 °C All Case Codes t, s TYPE TM8 TP TP lead (Pb)-free Sn/Pb 260 °C tP TL TL TS MIN. TS MIN. TS MAX. TS MAX. tS tS lead (Pb)-free Sn/Pb lead (Pb)-free Sn/Pb lead (Pb)-free Sn/Pb lead (Pb)-free Sn/Pb 217 °C 183 °C 150 °C 100 °C 200 °C 150 °C 60 to 150 tL 225 °C 10 60 to 90 60 PAD DIMENSIONS in inches [millimeters] B D C A CASE CODE TM8 K M P Q D E F L N R T W A (MIN.) B (NOM.) C (NOM.) D (NOM.) 0.028 (0.70) 0.039 (1.00) 0.063 (1.60) 0.065 (1.60) 0.115 (2.90) 0.115 (2.90) 0.150 (3.80) 0.059 (1.50) 0.118 (3.00) 0.059 (1.50) 0.118 (3.00) 0.059 (1.50) 0.018 (0.45) 0.028 (0.70) 0.031 (0.80) 0.050 (1.30) 0.070 (1.80) 0.070 (1.80) 0.070 (1.80) 0.031 (0.80) 0.067 (1.70) 0.031 (0.80) 0.067 (1.70) 0.031 (0.80) 0.024 (0.60) 0.24 (0.60) 0.047 (1.20) 0.040 (1.00) 0.070 (1.80) 0.120 (3.00) 0.140 (3.60) 0.039 (1.00) 0.051 (1.30) 0.039 (1.00) 0.051 (1.30) 0.039 (1.00) 0.059 (1.50) 0.080 (2.00) 0.110 (2.80) 0.142 (3.60) 0.213 (5.40) 0.260 (6.60) 0.283 (7.20) 0.102 (2.60) 0.185 (4.70) 0.102 (2.60) 0.185 (4.70) 0.102 (2.60) Document Number: 40133 Revision: 22-Jun-10 For technical questions, contact: tantalum@vishay.com www.vishay.com 45 TM8 Vishay Sprague GUIDE TO APPLICATION 1. A-C Ripple Current: The maximum allowable ripple current shall be determined from the formula: I rms = where, P= P --------------R ESR 7. 7.1 Solid Tantalum Chip Capacitors MICROTANTM High Reliability, Low DCL, Leadframeless Molded 6. Printed Circuit Board Materials: Molded capacitors are compatible with commonly used printed circuit board materials (alumina substrates, FR4, FR5, G10, PTFE-fluorocarbon and porcelanized steel). Attachment: Solder Paste: The recommended thickness of the solder paste after application is 0.007" ± 0.001" [0.178 mm ± 0.025 mm]. Care should be exercised in selecting the solder paste. The metal purity should be as high as practical. The flux (in the paste) must be active enough to remove the oxides formed on the metallization prior to the exposure to soldering heat. In practice this can be aided by extending the solder preheat time at temperatures below the liquidous state of the solder. Soldering: Capacitors can be attached by conventional soldering techniques; vapor phase, convection reflow, infrared reflow, wave soldering and hot plate methods. The Soldering Profile charts show recommended time/temperature conditions for soldering. Preheating is recommended. The recommended maximum ramp rate is 2 °C per second. Attachment with a soldering iron is not recommended due to the difficulty of controlling temperature and time at temperature. The soldering iron must never come in contact with the capacitor. RESR = 2. Power dissipation in watts at + 25 °C as given in the table in paragraph number 5 (power dissipation). The capacitor equivalent series resistance at the specified frequency. A-C Ripple Voltage: The maximum allowable ripple voltage shall be determined from the formula: P V rms = Z --------------R ESR or, from the formula: V rms = I rms × Z where, P= Power dissipation in watts at + 25 °C as given in the table in paragraph number 5 (power dissipation). The capacitor equivalent series resistance at the specified frequency. The capacitor impedance at the specified frequency. 7.2 RESR = Z= 2.1 The sum of the peak AC voltage plus the applied DC voltage shall not exceed the DC voltage rating of the capacitor. The sum of the negative peak AC voltage plus the applied DC voltage shall not allow a voltage reversal exceeding 10 % of the DC working voltage at + 25 °C. Reverse Voltage: These capacitors are capable of withstanding peak voltages in the reverse direction equal to 10 % of the DC rating at + 25 °C, 5 % of the DC rating at + 85 °C and 1 % of the DC rating at + 125 °C. Temperature Derating: If these capacitors are to be operated at temperatures above + 25 °C, the permissible rms ripple current or voltage shall be calculated using the derating factors as shown: TEMPERATURE + 25 °C + 85 °C + 125 °C DERATING FACTOR 1.0 0.9 0.4 7.2.1 Backward and Forward Compatibility: Capacitors with SnPb or 100 % tin termination finishes can be soldered using SnPb or lead (Pb)-free soldering processes. 8. Cleaning (Flux Removal) After Soldering: Molded capacitors are compatible with all commonly used solvents such as TES, TMS, Prelete, Chlorethane, Terpene and aqueous cleaning media. However, CFC/ODS products are not used in the production of these devices and are not recommended. Solvents containing methylene chloride or other epoxy solvents should be avoided since these will attack the epoxy encapsulation material. When using ultrasonic cleaning, the board may resonate if the output power is too high. This vibration can cause cracking or a decrease in the adherence of the termination. DO NOT EXCEED 9W/l at 40 kHz for 2 minutes. Recommended Mounting Pad Geometries: Proper mounting pad geometries are essential for successful solder connections. These dimensions are highly process sensitive and should be designed to minimize component rework due to unacceptable solder joints. The dimensional configurations shown are the recommended pad geometries for both wave and reflow soldering techniques. These dimensions are intended to be a starting point for circuit board designers and may be fine tuned if necessary based upon the peculiarities of the soldering process and/or circuit board design. Document Number: 40133 Revision: 22-Jun-10 2.2 3. 4. 8.1 9. 5. Power Dissipation: Power dissipation will be affected by the heat sinking capability of the mounting surface. Non-sinusoidal ripple current may produce heating effects which differ from those shown. It is important that the equivalent Irms value be established when calculating permissible operating levels. (Power Dissipation calculated using + 25 °C temperature rise.) www.vishay.com 46 For technical questions, contact: tantalum@vishay.com Legal Disclaimer Notice Vishay Disclaimer All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 18-Jul-08 www.vishay.com 1