TR8

TR8 www.vishay.com Vishay Sprague Solid Tantalum Chip Capacitors MICROTANTM Low ESR, Leadframeless Molded FEATURES • Lead (Pb)-free face-down terminations • Mounting: Surface mount • 8 mm tape and reel packaging available per EIA-481 and reeling per IEC 60286-3 7" [178 mm] standard • Low ESR • Compliant to RoHS Directive 2002/95/EC Note ** Please see document “Vishay Material Category Policy”: www.vishay.com/doc?99902 PERFORMANCE CHARACTERISTICS Operating Temperature: - 55 °C to + 85 °C (to + 125 °C voltage derating) Capacitance Range: 1 μF to 220 μF Capacitance Tolerance: ± 20 % standard, ± 10 % available Voltage Range: 4 VDC to 16 VDC ORDERING INFORMATION TR8 TYPE M CASE CODE See Ratings and Case Codes table 106 CAPACITANCE This is expressed in picofarads. The first two digits are the significant figures. The third is the number of zeros to follow. M CAPACITANCE TOLERANCE K = ± 10 % M = ± 20 % 6R3 DC VOLTAGE RATING AT + 85 °C This is expressed in volts. To complete the three-digit block, zeros precede the voltage rating. A decimal point is indicated by an “R” (6R3 = 6.3 V). C TERMINATION C = 100 % tin 7" [178 mm] reel 2000 ESR Maximum 100 kHz ESR in (m) (1) Notes • We reserve the right to supply higher voltage ratings and tighter capacitance tolerance capacitors in the same case size. Voltage substitutions will be marked with the higher voltage rating. (1) The EIA and CECC standards for low ESR solid tantalum chip capacitors, allow delta ESR of 1.25 times the datasheet limit after mounting. DIMENSIONS in inches [millimeters] Anode Polarity Bar Anode Termination Cathode Termination C W H P1 P2 P1 L CASE CODE M P L 0.063 ± 0.008 [1.60 ± 0.2] 0.094 ± 0.004 [2.4 ± 0.1] W 0.033 ± 0.008 [0.85 ± 0.2] 0.057 ± 0.004 [1.45 ± 0.1] H 0.031 ± 0.004 [0.80 ± 0.1] 0.043 ± 0.004 [1.10 ± 0.1] P1 0.020 ± 0.004 [0.50 ± 0.1] 0.020 ± 0.004 [0.50 ± 0.1] P2 0.024 ± 0.004 [0.60 ± 0.1] 0.057 ± 0.004 [1.40 ± 0.1] C 0.024 ± 0.004 [0.60 ± 0.1] 0.035 ± 0.004 [0.90 ± 0.1] Revision: 09-Aug-11 1 For technical questions, contact: tantalum@vishay.com Document Number: 40114 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TR8 www.vishay.com Vishay Sprague 4V 6.3 V 10 V 16 V M M (1) M M M M P M P (1) M M RATINGS AND CASE CODES μF 1.0 4.7 10 15 22 33 47 220 Note (1) Preliminary values, contact factory for availability MARKING VOLTAGE CODE CAPACITANCE CODE CAP, μF 33 47 68 100 150 220 CODE n s w A E J Polarity Bar M-Case Polarity Bar Voltage Code P-Case Voltage Capacitance Code Code V 4.0 6.3 10 16 20 25 CODE G J A C D E A STANDARD RATINGS CAPACITANCE (μF) CASE CODE GJ MAX. RIPPLE 100 kHz IRMS (A) 0.129 0.129 0.212 0.112 0.129 0.129 0.112 0.091 0.237 0.212 0.05 0.08 C/C (2) (%) PART NUMBER MAX. DC LEAKAGE AT + 25 °C (μA) 2.6 3.8 17.6 0.6 2.8 4.2 1.0 1.5 4.7 4.7 0.5 0.8 MAX. DF AT + 25 °C (%) MAX. ESR AT + 25 °C 100 kHz () 1.50 1.50 1.00 2.00 1.50 1.50 2.00 3.00 0.80 1.00 9.50 4.00 4 VDC AT + 85 °C; 2.7 VDC AT + 125 °C 33 47 220 10 22 33 10 15 47 47 1.0 4.7 M M P M M M M M P P M M TR8M336M004C1500 TR8M476M004C1500 TR8P227(1)004C1000 TR8M106(1)6R3C2000 TR8M226M6R3C1500 TR8M336M6R3C1500 TR8M106M010C2000 TR8M156(1)010C3000 TR8P476M010C0800 (1) TR8P476M010C1000 TR8M105(1)016C9500 TR8M475M016C4000 (1) 30 40 30 8 20 30 20 30 22 22 6.0 8.0 ± 20 ± 30 ± 30 ± 10 ± 15 ± 30 ± 15 ± 20 ± 20 ± 20 ± 15 ± 15 6.3 VDC AT + 85 °C; 4 VDC AT + 125 °C 10 VDC AT + 85 °C; 7 VDC AT + 125 °C 16 VDC AT + 85 °C; 10 VDC AT + 125 °C Notes • Part number definition: (1) Tolerance: For 10 % tolerance, specify “K”; for 20 % tolerance, change to “M” (1) Preliminary values, contact factory for availability (2) See Performance Characteristics tables Revision: 09-Aug-11 2 For technical questions, contact: tantalum@vishay.com Document Number: 40114 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TR8 www.vishay.com CAPACITORS PERFORMANCE CHARACTERISTICS ELECTRICAL PERFORMANCE CHARACTERISTICS ITEM Category Temperature Range Capacitance Tolerance Dissipation Factor (at 120 Hz) ESR (100 kHz) Leakage Current PERFORMANCE CHARACTERISTICS - 55 °C to + 85 °C (to + 125 °C with voltage derating) ± 20 %, ± 10 % (at 120 Hz) 2 VRMS at + 25 °C using a capacitance bridge Limits per Standard Ratings table. Tested via bridge method, at 25 °C, 120 Hz. Limits per Standard Ratings table. Tested via bridge method, at 25 °C, 100 kHz. After application of rated voltage applied to capacitors for 5 min using a steady source of power with 1 k resistor in series with the capacitor under test, leakage current at 25 °C is not more than described in Standard Ratings table. Note that the leakage current varies with temperature and applied voltage. See graph below for the appropriate adjustment factor. Capacitors are capable of withstanding peak voltages in the reverse direction equal to: 10 % of the DC rating at + 25 °C 5 % of the DC rating at + 85 °C Vishay does not recommended intentional or repetitive application of reverse voltage If capacitors are to be used at temperatures above + 25 °C, the permissible RMS ripple current or voltage shall be calculated using the derating factors: 1.0 at + 25 °C 0.9 at + 85 °C 0.4 at + 125 °C + 85 °C RATING WORKING VOLTAGE (V) 4.0 6.3 Operating Temperature 10 16 20 25 35 50 SURGE VOLTAGE (V) 5.2 8.0 13 20 26 32 46 65 + 125 °C RATING WORKING VOLTAGE (V) 2.7 4.0 7.0 10 13 17 23 33 SURGE VOLTAGE (V) 3.4 5.0 8.0 12 16 20 28 40 Vishay Sprague Reverse Voltage Temperature Derating TYPICAL LEAKAGE CURRENT FACTOR RANGE 100 LEAKAGE CURRENT FACTOR 10 + 125 °C + 85 °C + 55 °C + 25 °C 0 °C 1.0 0.1 - 55 °C 0.01 0.001 0 10 20 30 40 50 60 70 80 90 100 PERCENT OF RATED VOLTAGE Notes • At + 25 °C, the leakage current shall not exceed the value listed in the Standard Ratings table. • At + 85 °C, the leakage current shall not exceed 10 times the value listed in the Standard Ratings table. • At + 125 °C, the leakage current shall not exceed 12 times the value listed in the Standard Ratings table. Revision: 09-Aug-11 3 For technical questions, contact: tantalum@vishay.com Document Number: 40114 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TR8 www.vishay.com Vishay Sprague ENVIRONMENTAL PERFORMANCE CHARACTERISTICS ITEM Life Test at + 85 °C CONDITION 1000 h application of rated voltage at 85 °C with a 3  series resistance, MIL-STD 202G method 108A At 40 °C/90 % RH 500 h, no voltage applied MIL-STD 202G method 103B At - 55 °C/+ 125 °C, 30 min each, for 5 cycles. MIL-STD 202G method 107G POST TEST PERFORMANCE Capacitance change Dissipation factor Leakage current Capacitance change Dissipation factor Leakage current Capacitance change Dissipation factor Leakage current Refer to Standard Ratings table Not to exceed 150 % of initial Not to exceed 200 % of initial Refer to Standard Ratings table Not to exceed 150 % of initial Not to exceed 200 % of initial Refer to Standard Ratings table Not to exceed 150 % of initial Not to exceed 200 % of initial Humidity Tests Thermal Shock MECHANICAL PERFORMANCE CHARACTERISTICS ITEM CONDITION Apply a pressure load of 5 N for 10 s ± 1 s horizontally to the center of capacitor side body. AEC-Q200 rev. C method 006 With parts soldered onto substrate test board, apply force to the test board for a deflection of 1 mm. AEC-Q200 rev. C method 005 POST TEST PERFORMANCE Capacitance change Dissipation factor Leakage current Refer to Standard Ratings table Initial specified value or less Initial specified value or less Terminal Strength There shall be no mechanical or visual damage to capacitors post-conditioning. Capacitance change Dissipation factor Leakage current Capacitance change Dissipation factor Leakage current Refer to Standard Ratings table Initial specified value or less Initial specified value or less Refer to Standard Ratings table Initial specified value or less Initial specified value or less Substrate Bending (Board Flex) Vibration MIL-STD-202G, method 204D, 10 Hz to 2000 Hz, 20 g Peak There shall be no mechanical or visual damage to capacitors post-conditioning. Capacitance change Dissipation factor Leakage current Refer to Standard Ratings table Initial specified value or less Initial specified value or less Shock MIL-STD-202G, method 213B, condition I, 100 g peak There shall be no mechanical or visual damage to capacitors post-conditioning. Capacitance change Dissipation factor Leakage current Refer to Standard Ratings table Not to exceed 150 % of initial Not to exceed 200 % of initial Resistance to Solder Heat At 260 °C, for 10 s, reflow There shall be no mechanical or visual damage to capacitors post-conditioning. Solderability Resistance to Solvents Flammability MIL-STD-202G, method 208H, ANSI/J-STD-002, Test B. Applies only to solder and tin plated terminations. Does not apply to gold terminations. MIL-STD-202, method 215D Encapsulation materials meet UL 94 V-0 with an oxygen index of 32 %. There shall be no mechanical or visual damage to capacitors post-conditioning. There shall be no mechanical or visual damage to capacitors post-conditioning. Revision: 09-Aug-11 4 For technical questions, contact: tantalum@vishay.com Document Number: 40114 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TR8 www.vishay.com Vishay Sprague PLASTIC TAPE AND REEL PACKAGING in inches [millimeters] Tape thickness 0.014 [0.35] max. 0.157 ± 0.004 [4.0 ± 0.10] Deformation between embossments Top cover tape B1 (max.) (6) K0 Top cover tape For tape feeder reference only including draft. Concentric around B0 (5) 0.004 [0.10] max. Center lines of cavity P1 USER DIRECTION OF FEED 0.059 + 0.004 - 0.0 [1.5 + 0.10 - 0.0] 10 pitches cumulative tolerance on tape ± 0.008 [0.200] Embossment 0.079 ± 0.002 0.069 ± 0.004 [2.0 ± 0.05] [1.75 ± 0.10] A0 B0 0.030 [0.75] min. (3) 0.030 [0.75] min. (4) F W 20° Maximum component rotation (Side or front sectional view) D1 (min.) for components . 0.079 x 0.047 [2.0 x 1.2] and larger (5) Maximum cavity size (1) Cathode (-) Anode (+) DIRECTION OF FEED 20° maximum component rotation Typical component cavity center line Typical component center line 3.937 [100.0] 0.039 [1.0] max. Tape 0.039 [1.0] max. 0.9843 [250.0] Camber (Top view) Allowable camber to be 0.039/3.937 [1/100] Non-cumulative over 9.843 [250.0] Tape and Reel Specifications: All case sizes are available on plastic embossed tape per EIA-481. Tape reeling per IEC 60286-3 is also available. Standard reel diameter is 7" [178 mm], 13" [330 mm] reels are available and recommended as the most cost effective packaging method. The most efficient packaging quantities are full reel increments on a given reel diameter. The quantities shown allow for the sealed empty pockets required to be in conformance with EIA-481. Reel size and packaging orientation must be specified in the Vishay Sprague part number. B0 A0 (Top view) Notes • Metric dimensions will govern. Dimensions in inches are rounded and for reference only. (1) A , B , K , are determined by the maximum dimensions to the ends of the terminals extending from the component body and/or the body 0 0 0 dimensions of the component. The clearance between the ends of the terminals or body of the component to the sides and depth of the cavity (A0, B0, K0) must be within 0.002" (0.05 mm) minimum and 0.020" (0.50 mm) maximum. The clearance allowed must also prevent rotation of the component within the cavity of not more than 20°. (2) Tape with components shall pass around radius “R” without damage. The minimum trailer length may require additional length to provide “R” minimum for 12 mm embossed tape for reels with hub diameters approaching N minimum. (3) This dimension is the flat area from the edge of the sprocket hole to either outward deformation of the carrier tape between the embossed cavities or to the edge of the cavity whichever is less. (4) This dimension is the flat area from the edge of the carrier tape opposite the sprocket holes to either the outward deformation of the carrier tape between the embossed cavity or to the edge of the cavity whichever is less. (5) The embossed hole location shall be measured from the sprocket hole controlling the location of the embossement. Dimensions of embossement location shall be applied independent of each other. (6) B dimension is a reference dimension tape feeder clearance only. 1 CARRIER TAPE DIMENSIONS in inches [millimeters] CASE CODE P TAPE SIZE 8 mm B1 (MAX.) 0.108 [2.75] D1 (MIN.) 0.039 [1.0] F 0.138 ± 0.002 [3.5 ± 0.05] K0 (MAX.) 0.054 [1.37] P1 0.157 ± 0.004 [4.0 ± 1.0] W 0.315 + 0.0118/- 0.0039 [8.0 + 0.30/- 0.10] Revision: 09-Aug-11 5 For technical questions, contact: tantalum@vishay.com Document Number: 40114 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TR8 www.vishay.com Vishay Sprague PAPER TAPE AND REEL PACKAGING in inches [millimeters] P2 T Ø D0 [10 pitches cumulative tolerance on tape ± 0.2 mm] E1 P0 A0 F B0 W E2 Bottom cover tape Top cover tape Cavity center lines P1 Anode Cavity size (1) G Bottom cover tape USER FEED DIRECTION CASE TAPE SIZE SIZE M 8 mm A0 B0 D0 P0 P1 P2 E F W T 0.041 ± 0.002 0.071 ± 0.002 0.06 ± 0.004 0.157 ± 0.004 0.157 ± 0.004 0.079 ± 0.002 0.069 ± 0.004 0.0138 ± 0.002 0.315 ± 0.008 0.037 ± 0.002 [1.05 ± 0.05] [1.8 ± 0.05] [1.5 ± 0.1] [4.0 ± 0.1] [4.0 ± 0.1] [2.0 ± 0.05] [1.75 ± 0.1] [3.5 ± 0.05] [8.0 ± 0.2] [0.95 ± 0.05] Note (1) A , B are determined by the maximum dimensions to the ends of the terminals extending from the component body and/or the body 0 0 dimensions of the component. The clearance between the ends of the terminals or body of the component to the sides and depth of the cavity (A0, B0) must be within 0.002" (0.05 mm) minimum and 0.020" (0.50 mm) maximum. The clearance allowed must also prevent rotation of the component within the cavity of not more than 20°. STANDARD PACKAGING QUANTITY CASE CODE M P QUANTITY (PCS/REEL) 7" REEL 4000 3000 RECOMMENDED VOLTAGE DERATING GUIDELINES STANDARD CONDITIONS. FOR EXAMPLE: OUTPUT FILTERS Capacitor Voltage Rating 4.0 6.3 10 16 20 25 35 50 SEVERE CONDITIONS. FOR EXAMPLE: INPUT FILTERS Capacitor Voltage Rating 4.0 6.3 10 16 20 25 35 50 Operating Voltage 2.5 3.6 6.0 10 12 15 24 28 Operating Voltage 2.5 3.3 5.0 8.0 10 12 15 24 Revision: 09-Aug-11 6 For technical questions, contact: tantalum@vishay.com Document Number: 40114 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TR8 www.vishay.com Vishay Sprague POWER DISSIPATION CASE CODE M P MAXIMUM PERMISSIBLE POWER DISSIPATION AT + 25 °C (W) IN FREE AIR 0.025 0.045 RECOMMENDED REFLOW PROFILES Tp °C TL °C Temperature (°C) Ts MAX. °C (tL) (tp) Ts MAX. °C Preheat (ts) 25 °C All Case Codes t, s TP lead (Pb)-free 260 °C TP Sn/Pb 225 °C tP 10 TL lead (Pb)-free 217 °C TL Sn/Pb 183 °C TS MIN. lead (Pb)-free 150 °C TS MIN. Sn/Pb 100 °C TS MAX. tS MAX. tS lead (Pb)-free Sn/Pb lead (Pb)-free 200 °C 150 °C 60 to 150 TS Sn/Pb 60 to 90 tL 60 PAD DIMENSIONS in inches [millimeters] B D C A CASE CODE M P A (MIN.) 0.039 [1.00] 0.063 [1.60] B (NOM.) 0.028 [0.70] 0.031 [0.80] C (NOM.) 0.024 [0.60] 0.047 [1.20] D (NOM.) 0.080 [2.00] 0.110 [2.80] Revision: 09-Aug-11 7 For technical questions, contact: tantalum@vishay.com Document Number: 40114 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TR8 www.vishay.com GUIDE TO APPLICATION 1. AC Ripple Current: The maximum allowable ripple current shall be determined from the formula: I R MS = P ----------R ESR 6. Printed Circuit Board Materials: Molded capacitors are compatible with commonly used printed circuit board materials (alumina substrates, FR4, FR5, G10, PTFE-fluorocarbon and porcelanized steel). 7. Attachment: 7.1 Solder Paste: The recommended thickness of the solder paste after application is 0.007" ± 0.001" [0.178 mm ± 0.025 mm]. Care should be exercised in selecting the solder paste. The metal purity should be as high as practical. The flux (in the paste) must be active enough to remove the oxides formed on the metallization prior to the exposure to soldering heat. In practice this can be aided by extending the solder preheat time at temperatures below the liquidous state of the solder. 7.2 Soldering: Capacitors can be attached by conventional soldering techniques; vapor phase, convection reflow, infrared reflow, wave soldering and hot plate methods. The Soldering Profile charts show recommended time/temperature conditions for soldering. Preheating is recommended. The recommended maximum ramp rate is 2 °C per s. Attachment with a soldering iron is not recommended due to the difficulty of controlling temperature and time at temperature. The soldering iron must never come in contact with the capacitor. 7.2.1 Backward and Forward Compatibility: Capacitors with SnPb or 100 % tin termination finishes can be soldered using SnPb or lead (Pb)-free soldering processes. 8. Cleaning (Flux Removal) After Soldering: Molded capacitors are compatible with all commonly used solvents such as TES, TMS, Prelete, Chlorethane, Terpene and aqueous cleaning media. However, CFC/ODS products are not used in the production of these devices and are not recommended. Solvents containing methylene chloride or other epoxy solvents should be avoided since these will attack the epoxy encapsulation material. 8.1 When using ultrasonic cleaning, the board may resonate if the output power is too high. This vibration can cause cracking or a decrease in the adherence of the termination. Do not exceed 9W/l at 40 kHz for 2 min. 9. Recommended Mounting Pad Geometries: Proper mounting pad geometries are essential for successful solder connections. These dimensions are highly process sensitive and should be designed to minimize component rework due to unacceptable solder joints. The dimensional configurations shown are the recommended pad geometries for both wave and reflow soldering techniques. These dimensions are intended to be a starting point for circuit board designers and may be fine tuned if necessary based upon the peculiarities of the soldering process and/or circuit board design. Vishay Sprague 2. where, P= Power dissipation in watts at + 25 °C (see paragraph number 5 and the table Power Dissipation) RESR = The capacitor equivalent series resistance at the specified frequency AC Ripple Voltage: The maximum allowable ripple voltage shall be determined from the formula: P V R MS = Z ----------R ESR or, from the formula: V RMS = I R MS x Z where, P= Power dissipation in watts at + 25 °C (see paragraph number 5 and the table Power Dissipation) RESR = The capacitor equivalent series resistance at the specified frequency Z= The capacitor impedance at the specified frequency The sum of the peak AC voltage plus the applied DC voltage shall not exceed the DC voltage rating of the capacitor. The sum of the negative peak AC voltage plus the applied DC voltage shall not allow a voltage reversal exceeding 10 % of the DC working voltage at + 25 °C. Reverse Voltage: These capacitors are capable of withstanding peak voltages in the reverse direction equal to 10 % of the DC rating at + 25 °C, 5 % of the DC rating at + 85 °C and 1 % of the DC rating at + 125 °C. Temperature Derating: If these capacitors are to be operated at temperatures above + 25 °C, the permissible RMS ripple current or voltage shall be calculated using the derating factors as shown: TEMPERATURE + 25 °C + 85 °C + 125 °C DERATING FACTOR 1.0 0.9 0.4 2.1 2.2 3. 4. 5. Power Dissipation: Power dissipation will be affected by the heat sinking capability of the mounting surface. Non-sinusoidal ripple current may produce heating effects which differ from those shown. It is important that the equivalent IRMS value be established when calculating permissible operating levels. (Power Dissipation calculated using + 25 °C temperature rise.) PRODUCT INFORMATION Moisture Sensitivity SELECTOR GUIDES Solid Tantalum Selector Guide Solid Tantalum Chip Capacitors FAQ Frequently Asked Questions Revision: 09-Aug-11 8 www.vishay.com/doc?40135 www.vishay.com/doc?49053 www.vishay.com/doc?40091 www.vishay.com/doc?40110 Document Number: 40114 For technical questions, contact: tantalum@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. 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Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk and agree to fully indemnify and hold Vishay and its distributors harmless from and against any and all claims, liabilities, expenses and damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that Vishay or its distributor was negligent regarding the design or manufacture of the part. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 11-Mar-11 www.vishay.com 1