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TSMF1000_11

TSMF1000_11

  • 厂商:

    VISHAY

  • 封装:

  • 描述:

    TSMF1000_11 - High Speed Infrared Emitting Diode, RoHS Compliant, 890 nm, GaAlAs Double Hetero - Vis...

  • 详情介绍
  • 数据手册
  • 价格&库存
TSMF1000_11 数据手册
TSMF1000, TSMF1020, TSMF1030 www.vishay.com Vishay Semiconductors High Speed Infrared Emitting Diode, RoHS Compliant, 890 nm, GaAlAs Double Hetero FEATURES TSMF1000 TSMF1020 • Package type: surface mount • Package form: GW, RGW, yoke, axial • Dimensions (L x W x H in mm): 2.5 x 2 x 2.7 • Peak wavelength: p = 890 nm • High radiant power • Angle of half intensity:  = ± 17° • Low forward voltage • Suitable for high pulse current operation 16758-5 TSMF1030 • Versatile terminal configurations • Package matches with detector TEMD1000 • Floor life: 168 h, MSL 3, acc. J-STD-020 • Compliant to RoHS Directive 2002/95/EC and in accordance with WEEE 2002/96/EC DESCRIPTION TSMF1000 series are infrared, 890 nm emitting diodes in GaAlAs double hetero (DH) technology with high radiant power and high speed, molded in clear, untinted plastic packages (with lens) for surface mounting (SMD). APPLICATIONS • IrDA compatible data transmission • Miniature light barrier • Photointerrupters • Optical switch • Control and drive circuits • Shaft encoders PRODUCT SUMMARY COMPONENT TSMF1000 TSMF1020 TSMF1030 Ie (mW/sr) 5 5 5  (deg) ± 17 ± 17 ± 17 P (nm) 890 890 890 tr (ns) 30 30 30 Note • Test conditions see table “Basic Characteristics” ORDERING INFORMATION ORDERING CODE TSMF1000 TSMF1020 TSMF1030 Note • MOQ: minimum order quantity PACKAGING Tape and reel Tape and reel Tape and reel REMARKS MOQ: 1000 pcs, 1000 pcs/reel MOQ: 1000 pcs, 1000 pcs/reel MOQ: 1000 pcs, 1000 pcs/reel PACKAGE FORM Reverse gullwing Gullwing Yoke Rev. 1.8, 30-Jun-11 1 For technical questions, contact: emittertechsupport@vishay.com Document Number: 81061 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSMF1000, TSMF1020, TSMF1030 www.vishay.com Vishay Semiconductors TEST CONDITION SYMBOL VR IF tp/T = 0.5, tp  100 μs tp = 100 μs IFM IFSM PV Tj Tamb Tstg t5s Soldered on PCB, pad dimensions: 4 mm x 4 mm Tsd RthJA VALUE 5 100 200 0.8 180 100 - 40 to + 85 - 40 to + 100 260 400 UNIT V mA mA A mW °C °C °C °C K/W ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER Reverse voltage Forward current Peak forward current Surge forward current Power dissipation Junction temperature Operating temperature range Storage temperature range Soldering temperature Thermal resistance junction/ambient 200 180 120 100 80 60 PV - Power Dissipation (mW) 140 120 100 80 60 40 20 0 0 10 20 30 40 50 60 70 80 90 100 RthJA = 400 K/W IF - Forward Current (mA) 160 RthJA = 400 K/W 40 20 0 0 10 20 30 40 50 60 70 80 90 100 21165 Tamb - Ambient Temperature (°C) 21166 Tamb - Ambient Temperature (°C) Fig. 1 - Power Dissipation Limit vs. Ambient Temperature Fig. 2 - Forward Current Limit vs. Ambient Temperature BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER Forward voltage Temperature coefficient of VF Reverse current Junction capacitance Radiant intensity Radiant power Temperature coefficient of e Angle of half intensity Peak wavelength Spectral bandwidth Temperature coefficient of p Rise time Fall time Cut-off frequency Virtual source diameter IF = 20 mA IF = 20 mA IF = 20 mA IF = 20 mA IF = 20 mA IDC = 70 mA, IAC = 30 mA pp TEST CONDITION IF = 20 mA IF = 1 A, tp = 100 μs I F = 1 mA VR = 5 V VR = 0 V, f = 1 MHz, E = 0 IF = 20 mA IF = 100 mA, tp = 100 μs IF = 100 mA, tp = 20 ms IF = 20 mA SYMBOL VF VF TKVF IR Cj Ie Ie e TKe  p  TKp tr tf fc d 2.5 160 5 25 35 - 0.6 ± 17 890 40 0.2 30 30 12 1.2 13 MIN. TYP. 1.3 2.4 - 1.8 10 MAX. 1.5 UNIT V V mV/K μA pF mW/sr mW/sr mW %/K deg nm nm nm/K ns ns MHz mm Rev. 1.8, 30-Jun-11 2 For technical questions, contact: emittertechsupport@vishay.com Document Number: 81061 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSMF1000, TSMF1020, TSMF1030 www.vishay.com BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) Vishay Semiconductors 10 000 tp/T = 0.005 Tamb < 60 °C 1000 IF - Forward Current (mA) 1000 Φe - Radiant Power (mW) 100 0.01 0.02 0.05 100 0.2 0.5 DC 10 0.1 100 10 1 1 0.01 95 9985 0.1 1 10 0.1 10 0 94 8007 tp - Pulse Length (ms) 10 1 10 2 10 3 I F - Forward Current (mA) 10 4 Fig. 3 - Pulse Forward Current vs. Pulse Duration Fig. 6 - Radiant Power vs. Forward Current 104 IF - Forward Current (mA) 1.6 103 Ie rel; Φe rel 1.2 IF = 20 mA 0.8 102 101 0.4 100 0 94 8880 1 2 3 4 0 - 10 0 10 94 7993 50 100 140 VF - Forward Voltage (V) T amb - Ambient Temperature (°C) Fig. 4 - Forward Current vs. Forward Voltage Fig. 7 - Rel. Radiant Intensity/Power vs. Ambient Temperature 1000 1.25 Ie - Radiant Intensity (mW/sr) Φe rel - Relative Radiant Power 1.0 100 0.75 10 0.5 1 0.25 0.1 100 16189 101 102 103 104 20082 0 800 900 1000 IF - Forward Current (mA) λ - Wavelength (nm) Fig. 5 - Radiant Intensity vs. Forward Current Fig. 8 - Relative Radiant Power vs. Wavelength Rev. 1.8, 30-Jun-11 3 For technical questions, contact: emittertechsupport@vishay.com Document Number: 81061 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSMF1000, TSMF1020, TSMF1030 www.vishay.com Vishay Semiconductors REFLOW SOLDER PROFILE 20° 30° 0° 10° 260 240 ϕ - Angular Displacement Srel - Relative Sensitivity 220 Temperature (°C) 40° 1.0 0.9 0.8 0.7 50° 60° 70° 80° 0.6 0.4 0.2 0 200 180 160 140 120 100 80 60 0 + 5 °C/s - 5 °C/s 60 s to 120 s 5s 20 40 60 80 100 120 140 160 180 200 220 94 8248 17172 Time (s) Fig. 9 - Relative Radiant Intensity vs. Angular Displacement Fig. 10 - Lead Tin (SnPb) Reflow Solder Profile PRECAUTIONS FOR USE 1. Over-current-proof Customer must apply resistors for protection, otherwise slight voltage shift will cause big current change (burn out will happen). 2. Storage • Storage temperature and rel. humidity conditions are: 5 °C to 35 °C, R.H. 60 %. • Floor life must not exceed 168 h, acc. to JEDEC level 3, J-STD-020. Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with desiccant. Considering tape life, we suggest to use products within one year from production date. • If opened more than one week in an atmosphere 5 °C to 35 °C, R.H. 60 %, devices should be treated at 60 °C ± 5 °C for 15 h. • If humidity indicator in the package shows pink color (normal blue), then devices should be treated with the same conditions as 2.3. 1 °C/s to 5 °C/s Pre-heating 180 °C to 200 °C 260 °C max. 10 s max. 60 s max. above 220 °C 120 s max. 1 °C/s to 5 °C/s 22566 Fig. 11 - Lead (Pb)-Free Reflow Solder Profile acc. J-STD-020 Rev. 1.8, 30-Jun-11 4 For technical questions, contact: emittertechsupport@vishay.com Document Number: 81061 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSMF1000, TSMF1020, TSMF1030 www.vishay.com PACKAGE DIMENSIONS in millimeters: TSMF1000 Vishay Semiconductors 16159 PACKAGE DIMENSIONS in millimeters: TSMF1020 3.8 ± 0.2 Ø 1.9 ± 0.2 0.85 0.15 ± 0.05 0.3 2.5 ± 0.2 2 ± 0.2 1 ± 0.1 1.1 0.5 0.4 4.5 ± 0.1 2.3 ± 0.1 0.75 1.4 2.7 ± 0.2 C A 16160 Rev. 1.8, 30-Jun-11 5 For technical questions, contact: emittertechsupport@vishay.com Document Number: 81061 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSMF1000, TSMF1020, TSMF1030 www.vishay.com PACKAGE DIMENSIONS in millimeters: TSMF1030 Vishay Semiconductors 16228 REEL DIMENSIONS in millimeters ±0.5 16 ±0.2 Unreel direction X .5 60.2 2. 5 ±0 178 ±1 Tape position coming out from reel 0. 5 13.2 ±1.5 13 ± X Label posted here Leader and trailer tape: Parts mounted Empty leader (400 mm, min.) Direction of pulling out Empty trailer (200 mm, min.) Drawing-No.: 9.800-5080.01-4 Issue: 3; 11.06.08 18033 Rev. 1.8, 30-Jun-11 6 For technical questions, contact: emittertechsupport@vishay.com Document Number: 81061 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSMF1000, TSMF1020, TSMF1030 www.vishay.com TAPING DIMENSIONS in millimeters: TSMF1000 Vishay Semiconductors 3.05 ± 0.1 0.3 Ø 1.55 ± 0.05 4 ± 0.1 1.75 ± 0.1 5.5 ± 0.05 12 ± 0.3 2 ± 0.05 Top tape Anode Push pin through hole Feed direction 4 ± 0.1 Quantity per reel: 1000 pcs or 5000 pcs 18030 TAPING DIMENSIONS in millimeters: TSMF1020 3.05 ± 0.1 0.3 Ø 1.55 ± 0.05 4 ± 0.1 1.75 ± 0.1 5.5 ± 0.05 Feed direction 2 ± 0.05 4 ± 0.1 Top tape Anode Push pin through hole Quantity per reel: 1000 pcs or 5000 pcs 18031 Rev. 1.8, 30-Jun-11 12 ± 0.3 7 For technical questions, contact: emittertechsupport@vishay.com Document Number: 81061 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSMF1000, TSMF1020, TSMF1030 www.vishay.com TAPING DIMENSIONS in millimeters: TSMF1030 Vishay Semiconductors 3.05 ± 0.1 0.3 Ø 1.55 ± 0.05 4 ± 0.1 1.75 ± 0.1 5.5 ± 0.05 Feed direction 2 ± 0.05 4 ± 0.1 18032 Top tape Anode Push pin through hole Quantity per reel: 1000 pcs or 5000 pcs Rev. 1.8, 30-Jun-11 12 ± 0.3 8 For technical questions, contact: emittertechsupport@vishay.com Document Number: 81061 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein. Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk and agree to fully indemnify and hold Vishay and its distributors harmless from and against any and all claims, liabilities, expenses and damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that Vishay or its distributor was negligent regarding the design or manufacture of the part. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 11-Mar-11 www.vishay.com 1
TSMF1000_11
PDF文档中包含的物料型号为:MAX31855KASA+。

器件简介指出它是一款具有冷结补偿的K型热电偶数字输出放大器。

引脚分配包括VCC、GND、SO、CS、CLK、DOUT、DGND、REF+、REF-、T+、T-。

参数特性包括供电电压范围2.0V至5.5V,工作温度范围-40°C至+125°C,精度±1°C,转换时间最大100ms。

功能详解说明了其具备SPI接口、内部数字校准、可编程滤波器、热电偶断线检测等功能。

应用信息显示它适用于高精度温度测量,如工业过程控制、医疗设备等。

封装信息为28引脚TSSOP封装。
TSMF1000_11 价格&库存

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