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TSOP75D25

TSOP75D25

  • 厂商:

    VISHAY

  • 封装:

  • 描述:

    TSOP75D25 - IR Receiver Modules for 3D Synchronization Signals - Vishay Siliconix

  • 数据手册
  • 价格&库存
TSOP75D25 数据手册
TSOP75D25 Vishay Semiconductors IR Receiver Modules for 3D Synchronization Signals FEATURES • Center frequency at 25 kHz to reduce interference with IR remote control signals at 30 kHz to 56 kHz • Package can be used with IR emitters with wavelength 830 nm as well as standard 940 nm • Very low supply current and stand-by mode • Photo detector and preamplifier in one package 20953 • Internal filter for PCM frequency • Supply voltage range: 2.5 V to 5.5 V • Improved immunity against modulated light sources MECHANICAL DATA Pinning: 1, 4 = GND, 2 = VS, 3 = OUT • Insensitive to supply voltage ripple and noise • Taping available for topview and sideview assembly • Compliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC DESCRIPTION The TSOP75D25 is an SMD IR receiver module for 3D sychronisation signals. The receiver is designed to operate at a carrier frequency of 25 kHz and a wavelength of 830 nm to avoid interference with standard remote control systems at 940 nm and 30 kHz to 56 kHz. The TSOP75D25 can receive continuously transmitted signal patterns with a minimum burst length of 6 cycles and frame rates up to 200 Hz. The circuit provides good suppression of optical noise from CFLs, LCD backlight and plasma panels. PARTS TABLE CARRIER FREQUENCY 25 kHz GOOD NOISE SUPPRESSION AND FAST BURST RATE TSOP75D25 BLOCK DIAGRAM 2 30 k Ω Band pass Demodulator VS 3 Input AGC OUT 1, 4 PIN 20445-1 APPLICATION CIRCUIT 17170_5 R1 IR receiver VS Circuit C1 OUT GND VO µC GND + VS Transmitter with TSALxxxx Control circuit GND R1 and C1 are recommended for protection against EOS. Components should be in the range of 33 Ω < R1 < 1 kΩ, C1 > 0.1 µF. Document Number: 83311 Rev. 1.0, 31-Mar-10 www.vishay.com 1 TSOP75D25 Vishay Semiconductors IR Receiver Modules for 3D Synchronization Signals ABSOLUTE MAXIMUM RATINGS PARAMETER Supply voltage (pin 2) Supply current (pin 2) Output voltage (pin 3) Output current (pin 3) Junction temperature Storage temperature range Operating temperature range Power consumption Tamb ≤ 85 °C TEST CONDITION SYMBOL VS IS VO IO Tj Tstg Tamb Ptot VALUE - 0.3 to + 6 3 - 0.3 to (VS + 0.3) 5 100 - 25 to + 85 - 25 to + 85 10 UNIT V mA V mA °C °C °C mW Note • Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliability. ELECTRICAL AND OPTICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER Supply current (pin 2) Supply voltage Transmission distance Output voltage low (pin 3) Minimum irradiance Maximum irradiance Directivity Ev = 0, test signal see fig. 1, IR diode TSAL6200, IF = 250 mA IOSL = 0.5 mA, Ee = 0.7 mW/m2, test signal see fig. 1 Pulse width tolerance: tpi - 80 μs < tpo < tpi + 160 μs, test signal see fig. 1 tpi - 80 μs < tpo < tpi + 160 μs, test signal see fig. 1 Angle of half transmission distance TEST CONDITION Ev = 0, VS = 3.3 V Ev = 40 klx, sunlight SYMBOL ISD ISH VS d VOSL Ee min. Ee max. ϕ1/2 30 ± 50 0.15 2.5 45 100 0.35 MIN. 0.27 TYP. 0.35 0.45 5.5 MAX. 0.45 UNIT mA mA V m mV mW/m2 W/m2 deg TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) Ee Optical Test Signal (IR diode TSAL6200, IF = 0.4 A, N = 6 pulses, f = fO, t = 10 ms) 1.5 1.4 tpo - Output Pulse Width (ms) Output Pulse Width 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.1 1 10 102 103 104 105 λ = 950 nm, Optical Test Signal, Fig.1 Input Burst Length tpi *) T t *) tpi ≥ 6/fo is recommended for optimal function Output Signal VO VOH VOL td 1) 1) 14337-1 3/fO < td < 9/fO 2) tpi - 80 µs < tpo < tpi + 160 µs tpo 2) t 22020 Ee - Irradiance (mW/m2) Fig. 1 - Output Active Low Fig. 2 - Pulse Length and Sensitivity in Dark Ambient www.vishay.com 2 Document Number: 83311 Rev. 1.0, 31-Mar-10 TSOP75D25 IR Receiver Modules for 3D Synchronization Signals Vishay Semiconductors Ee Optical Test Signal Ee min. - Threshold Irradiance (mW/m2) 4 Correlation with Ambient Light Sources: 2 3.5 10 W/m = 1.4 kLx (Std. illum. A, T = 2855 K) 10 W/m2 = 8.2 kLx (Daylight, T = 5900 K) 3 2.5 2 1.5 1 0.5 0 0.01 Wavelength of Ambient Illumination: λ = 950 nm 600 µs t = 60 ms Output Signal, (see fig. 4) 600 µs t 94 8134 VO VOH VOL t on t off t 20757 0.1 1 10 100 Ee - Ambient DC Irradiance (W/m2) Fig. 3 - Output Function Fig. 6 - Sensitivity in Bright Ambient Ee min. - Threshold Irradiance (mW/m2) 0.8 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 1 10 100 1000 f = 30 kHz f = fo f = 20 kHz f = 10 kHz f = 100 Hz Ton, Toff - Output Pulse Width (ms) 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0.1 1 Ton Toff λ = 950 nm, Optical Test Signal, Fig. 1 10 100 1000 10 000 20753 22021 Ee - Irradiance (mW/m2) VsRMS - AC Voltage on DC Supply Voltage (mV) Fig. 4 - Output Pulse Diagram Fig. 7 - Sensitivity vs. Supply Voltage Disturbances 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0.7 16925 500 E e min./Ee - Rel. Responsivity E - Max. Field Strength (V/m) 450 400 350 300 250 200 150 100 50 0 f = f0 ± 5 % Δ f(3 dB) = f0/10 0.9 1.1 1.3 0 20747 500 1000 1500 2000 2500 3000 f/f0 - Relative Frequency f - EMI Frequency (MHz) Fig. 5 - Frequency Dependence of Responsivity Fig. 8 - Sensitivity vs. Electric Field Disturbances Document Number: 83311 Rev. 1.0, 31-Mar-10 www.vishay.com 3 TSOP75D25 Vishay Semiconductors IR Receiver Modules for 3D Synchronization Signals 0° 0.9 0.8 10° 20° 30° Max. Envelope Duty Cycle f = 25 kHz, Ee = 3 mW/m² 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 10 20 30 40 50 60 70 80 21427 40° 1.0 0.9 constant irradiance 0.8 50° 60° 70° variable irradiance 0.6 0.4 0.2 0 0.2 0.4 0.6 80° 22022 Burst Length (number of cycles/burst) drel - Relative Transmission Distance Fig. 9 - Maximum Envelope Duty Cycle vs. Burst Length Fig. 12 - Horizontal Directivity Ee min. - Threshold Irradiance (mW/m2) 0.3 0.25 0° 10° 20° 30° 40° 0.2 1.0 0.15 0.1 0.05 0 - 30 - 10 10 30 50 70 90 21428 0.9 0.8 50° 60° 70° 80° 20755 Tamb - Ambient Temperature (°C) drel - Relative Transmission Distance Fig. 10 - Sensitivity vs. Ambient Temperature Fig. 13 - Vertical Directivity 1.0 0.2 S(λ)rel - Relative Spectral Sensitivity 0.8 Ee min. - Sensitivity (mW/m2) 0.18 0.16 0.14 0.12 0.1 0.08 0.06 0.04 0.02 0.6 0.4 0.2 0 700 22102 0 800 900 1000 1100 20756 2 2.5 3 3.5 4 4.5 5 5.5 6 λ - Wavelength (nm) VS - Supply Voltage (V) Fig. 11 - Relative Spectral Sensitivity vs. Wavelength Fig. 14 - Sensitivity vs. Supply Voltage www.vishay.com 4 Document Number: 83311 Rev. 1.0, 31-Mar-10 TSOP75D25 IR Receiver Modules for 3D Synchronization Signals SUITABLE DATA FORMAT The TSOP75D25 is designed to suppress spurious output pulses due to noise or disturbance signals. Data and disturbance signals can be distinguished by the devices according to carrier frequency, burst length and envelope duty cycle. The data signal should be close to the band-pass center frequency (e.g. 25 kHz) and fulfill the conditions in the table below. When a data signal is applied to the TSOP75D25 in the presence of a disturbance signal, the sensitivity of the receiver is reduced to insure that no spurious pulses are present at the output. Some examples of disturbance signals which are suppressed are • DC light (e.g. from tungsten bulb or sunlight) • Continuous signals at any frequency • Strongly or weakly modulated noise from fluorescent lamps with electronic ballasts (see figure 15 or figure 16) 16920 Vishay Semiconductors IR Signal IR Signal from Fluorescent Lamp with Low Modulation 0 5 10 15 20 Time (ms) Fig. 15 - IR Signal from Fluorescent Lamp with Low Modulation IR Signal from Fluorescent Lamp with High Modulation IR Signal 0 16921 5 10 15 20 Time (ms) Fig. 16 - IR Signal from Fluorescent Lamp with High Modulation TSOP75D25 Minimum burst length After each burst of length a minimum gap time is required of For bursts greater than a minimum gap time in the data stream is needed of Maximum rate of short bursts (constant irradiance) Maximum rate of short bursts (variable irradiance) 6 cycles/burst 6 to 24 cycles ≥ 6 cycles 24 cycles > 4 x burst length 2000 bursts/s 220 bursts/s Document Number: 83311 Rev. 1.0, 31-Mar-10 www.vishay.com 5 TSOP75D25 Vishay Semiconductors IR Receiver Modules for 3D Synchronization Signals STAND-BY MODE OF THE TSOP75D25 If an application requires an ultra low average supply current in order to save battery life, the TSOP75D25 can be operated with an intermittent supply voltage. A typical application circuit shown in fig. 17. TSOP75D.. Battery Supply Input RC data Low Power Microcontroller IR Receiver (memorizing the gain level during standby) RS 3 MΩ Output IR Rec. SBY other input and output lines VS = 2.5 V to 5.5 V 22023-2 Fig. 17 - Application Circuit for the TSOP75D25 with Intermittent Supply Voltage To receive a continuous data signal while using the TSOP75D25 with an intermittent supply voltage, the receiver must be activated in advance of the expected data frame as shown in figure 18. The transmitted IR synchronizing pattern The standby is deactivated in advance of the expected data frame Output signal of the microcontroller to control the standby mode of the IR Receiver Synchronizing pattern, sent by the TV Standby on Standby off Output signal of the TSOP75D25 valid sync. 22024-2 pattern Data is valid only 2 ms after the standby off signal Fig. 18 - Signal Timing in Power Saving Mode with Continuous Receiving Function In normal operation without using the stand-by feature, the gain level of the TSOP75D25 returns to a default level after the device is disconnected from supply voltage and reconnected again. A settling time of up to 100 ms is necessary until the gain has settled to an optimum level that is well matched to the ambient noise level. Using the device in stand-by mode, the TSOP75D25 memorizes its gain setting while in standby. On re-activation, the gain immediately returns to the correct level present before stand-by. This operation insures that there are no spurious pulses on power-up due to mismatch between the gain level and the ambient light conditions. www.vishay.com 6 Document Number: 83311 Rev. 1.0, 31-Mar-10 TSOP75D25 IR Receiver Modules for 3D Synchronization Signals Vishay Semiconductors ELECTRICAL AND OPTICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER Serial resistor to activate the standby mode Standby supply current Latency time for standby-off (delay until there is a valid respose) TEST CONDITION VS = 3 V VS = 5 V VS = 3 V, RS = 1.5 MΩ VS = 5 V, RS = 3 MΩ VS > 2.5 V, dark ambient, output is valid VS > 2.5 V, 10 kLux dayligth, output is valid VS > 2.5 V, dark ambient Duration of standby-off period VS > 2.5 V, 10 kLux daylight, AGC1 or AGC3 device VS > 2.5 V, 10 kLux daylight, AGC2 or AGC4 device SYMBOL RS RS ISBY ISBY tdelay tdelay tSBY_OFF tSBY_OFF tSBY_OFF 1 4 3 ms MIN. 1.2 2 1 1 TYP. 1.5 3 1.4 1.4 0.4 1.5 MAX. 2 4 2 2 0.8 ms 2.5 UNIT MΩ μA TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) 2.5 Latency Time after Standby-off until there is a valid Output Signal 2 Latency Time (ms) 1.5 1 0.5 0 0.1 22025 1 10 100 Ambient Daylight Brightness (kLux) Fig. 1 - Delay Time after Standby-off until the TSOP75D25 is ready to receive Data Document Number: 83311 Rev. 1.0, 31-Mar-10 www.vishay.com 7 TSOP75D25 Vishay Semiconductors IR Receiver Modules for 3D Synchronization Signals PACKAGE DIMENSIONS in millimeters 6.8 6.6 ± 0.1 (3.4) mold residue mold residue 2.2 2.5 3.2 3 (1.8) 0.8 GND Vs Out (0.635) 1.27 (3x) GND (1) 0.5 ± 0.1 (4x) technical drawings according to DIN specifications 3x 1.27 = 3.81 (2.2) Tool separation line Pick and place area Not indicated tolerances ± 0.15 1.2 ± 0.2 (1.65) Proposed hole layout from component side (for reference only) 2.2 3 x 1.27 = 3.81 (R 1.3) Marking area 1.27 Drawing-No.: 6.550-5297.01-4 Issue: 3; 02.09.09 21576 1.8 0.8 ASSEMBLY INSTRUCTIONS Reflow Soldering • Reflow soldering must be done within 72 h while stored under a max. temperature of 30 °C, 60 % RH after opening the dry pack envelope • Set the furnace temperatures for pre-heating and heating in accordance with the reflow temperature profile as shown in the diagram. Excercise extreme care to keep the maximum temperature below 260 °C. The temperature shown in the profile means the temperature at the device surface. Since there is a temperature difference between the component and the circuit board, it should be verified that the temperature of the device is accurately being measured • Handling after reflow should be done only after the work surface has been cooled off www.vishay.com 8 Document Number: 83311 Rev. 1.0, 31-Mar-10 Manual Soldering • Use a soldering iron of 25 W or less. Adjust the temperature of the soldering iron below 300 °C • Finish soldering within 3 s • Handle products only after the temperature has cooled off TSOP75D25 IR Receiver Modules for 3D Synchronization Signals VISHAY LEAD (Pb)-FREE REFLOW SOLDER PROFILE 300 250 200 255 °C 240 °C 217 °C max. 260 °C 245 °C Vishay Semiconductors T (°C) max. 20 s 150 max. 120 s 100 max. Ramp Up 3 °C/s 50 0 0 19800 max. 100 s max. Ramp Down 6 °C/s 50 100 150 t (s) 200 250 300 max. 2 cycles allowed TAPING VERSION TSOP..TT Dimensions in millimeters 4° 0.3 7.1 16 1.75 7.5 3.3 4° Ø 1.5 2 3.35 Ø 1.5 min. 4 Direction of feed 8 Drawing-No.: 9.700-5338.01-4 Issue: 3; 09.06.09 21578 technical drawings according to DIN specifications Document Number: 83311 Rev. 1.0, 31-Mar-10 www.vishay.com 9 TSOP75D25 Vishay Semiconductors IR Receiver Modules for 3D Synchronization Signals TAPING VERSION TSOP..TR Dimensions in millimeters 4° 0.3 7.1 16 7.5 1.75 2.8 4° 1.34 ref. Ø 1.5 Ø 1.5 min 8 2 3.3 Direction of feed technical drawings according to DIN specifications Drawing-No.: 9.700-5337.01-4 Issue: 1; 16.10.08 21577 www.vishay.com 10 4 Document Number: 83311 Rev. 1.0, 31-Mar-10 TSOP75D25 IR Receiver Modules for 3D Synchronization Signals REEL DIMENSIONS in millimeters Vishay Semiconductors 16734 LEADER AND TRAILER Dimensions in millimeters Trailer no devices devices Leader no devices End Start min. 200 min. 400 96 11818 COVER TAPE PEEL STRENGTH According to DIN EN 60286-3 0.1 N to 1.3 N 300 mm/min. ± 10 mm/min. 165° to 180° peel angle LABEL Standard bar code labels for finished goods The standard bar code labels are product labels and used for identification of goods. The finished goods are packed in final packing area. The standard packing units are labeled with standard bar code labels before transported as finished goods to warehouses. The labels are on each packing unit and contain Vishay Semiconductor GmbH specific data. www.vishay.com 11 Document Number: 83311 Rev. 1.0, 31-Mar-10 TSOP75D25 Vishay Semiconductors IR Receiver Modules for 3D Synchronization Signals VISHAY SEMICONDUCTOR GmbH STANDARD BAR CODE PRODUCT LABEL (finished goods) PLAIN WRITTING Item-description Item-number Selection-code LOT-/serial-number Data-code Plant-code Quantity Accepted by Packed by Mixed code indicator Origin LONG BAR CODE TOP Item-number Plant-code Sequence-number Quantity Total length SHORT BAR CODE BOTTOM Selection-code Data-code Batch-number Filter Total length ABBREVIATION INO SEL BATCH COD PTC QTY ACC PCK MIXED CODE xxxxxxx+ TYPE N N X N TYPE X N X LENGTH 18 8 3 10 3 (YWW) 2 8 Company logo LENGTH 8 2 3 8 21 LENGTH 3 3 10 1 17 DRY PACKING The reel is packed in an anti-humidity bag to protect the devices from absorbing moisture during transportation and storage. Aluminum bag Label In case of moisture absorption, the devices will recover to the former condition by drying under the following condition: 192 h at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/nitrogen) or 96 h at 60 °C + 5 °C and < 5 % RH for all device containers or 24 h at 125 °C + 5 °C not suitable for reel or tubes. An EIA JEDEC standard JESD22-A112 level 4 label is included on all dry bags. Reel 15973 FINAL PACKING The sealed reel is packed into a cardboard box. A secondary cardboard box is used for shipping purposes. RECOMMENDED METHOD OF STORAGE Dry box storage is recommended as soon as the aluminum bag has been opened to prevent moisture absorption. The following conditions should be observed, if dry boxes are not available: • Storage temperature 10 °C to 30 °C • Storage humidity ≤ 60 % RH max. After more than 72 h under these conditions moisture content will be too high for reflow soldering. www.vishay.com 12 16943 Example of JESD22-A112 level 4 label Document Number: 83311 Rev. 1.0, 31-Mar-10 TSOP75D25 IR Receiver Modules for 3D Synchronization Signals ESD PRECAUTION Proper storage and handling procedures should be followed to prevent ESD damage to the devices especially when they are removed from the antistatic shielding bag. Electro-static sensitive devices warning labels are on the packaging. Vishay Semiconductors VISHAY SEMICONDUCTORS STANDARD BAR CODE LABELS The Vishay Semiconductors standard bar code labels are printed at final packing areas. The labels are on each packing unit and contain Vishay Semiconductors specific data. 16962 Document Number: 83311 Rev. 1.0, 31-Mar-10 www.vishay.com 13 Legal Disclaimer Notice Vishay Disclaimer All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 18-Jul-08 www.vishay.com 1
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