UG5JT, UGF5JT, UGB5JT Series
New Product
Vishay Semiconductors
formerly General Semiconductor
Reverse Voltage 500 to 600V Forward Current 5.0A Reverse Recovery Time 25ns
Ultrafast Rectifiers
ITO-220AC (UGF5 Series)
0.405 (10.27) 0.383 (9.72) 0.188 (4.77) 0.172 (4.36) 0.110 (2.80) 0.100 (2.54) 0.140 (3.56) DIA. 0.130 (3.30) 0.131 (3.39) DIA. 0.122 (3.08)
TO-220AC (UG5 Series)
0.415 (10.54) MAX. 0.154 (3.91) 0.370 (9.40) 0.360 (9.14) 0.148 (3.74) 0.113 (2.87) 0.103 (2.62) 0.145 (3.68) 0.135 (3.43) 0.410 (10.41) 0.390 (9.91) PIN 1 0.160 (4.06) 0.140 (3.56) 2 1.148 (29.16) 1.118 (28.40) 0.110 (2.79) 0.100 (2.54) 0.560 (14.22) 0.530 (13.46)
CASE 1
0.185 (4.70) 0.175 (4.44) DIA. 0.055 (1.39) 0.045 (1.14) 0.600 (15.5) 0.580 (14.5)
0.676 (17.2) 0.646 (16.4) 0.350 (8.89) 0.330 (8.38)
PIN 2
0.635 (16.13) 0.625 (15.87)
0.350 (8.89) 0.330 (8.38)
0.603 (15.32) 0.573 (14.55) 0.560 (14.22) 0.530 (13.46)
0.191 (4.85) 0.171 (4.35) 0.060 (1.52)
PIN 1 PIN 2
0.110 (2.80) 0.100 (2.54)
PIN 1 PIN 2
0.205 (5.20) 0.195 (4.95)
0.037 (0.94) 0.027 (0.69)
0.022 (0.55) 0.014 (0.36)
0.105 (2.67) 0.095 (2.41) 0.205 (5.20) 0.195 (4.95) 0.037 (0.94) 0.027 (0.68) 0.022 (0.56) 0.014 (0.36)
TO-263AB (UGB5 Series)
0.411 (10.45) 0.380 (9.65) 0.245 (6.22) MIN K 0.055 (1.40) 0.047 (1.19) 1 K 2 0.624 (15.85) 0.591 (15.00) 0-0.01 (0-0.254) 0.190 (4.83) 0.160 (4.06) 0.055 (1.40) 0.045 (1.14)
Mounting Pad Layout TO-263AB
0.42 (10.66)
0.360 (9.14) 0.320 (8.13)
0.33 (8.38) 0.63 (17.02)
Dimensions in inches and (millimeters)
0.110 (2.79) 0.090 (2.29) 0.027 (0.686) 0.037 (0.940) 0.105 (2.67)
PIN 1 PIN 2 K - HEATSINK
0.021 (0.53) 0.014 (0.36) 0.140 (3.56) 0.110 (2.79)
0.08 (2.032) 0.24 (6.096)
0.095 (2.41)
0.12 (3.05)
0.205 (5.20) 0.195 (4.95)
Features
• Plastic package has Underwriters Laboratories Flammability Classification 94V-0 • Ideally suited for freewheeling diode and power factor correction applications • Soft recovery characteristics • Excellent high temperature switching • Optimized to reduce switching losses • Glass passivated chip junction
Mechanical Data
Case: JEDEC TO-220AC, ITO-220AC & TO-263AB molded plastic body Terminals: Plated leads, solderable per MIL-STD-750, Method 2026 High temperature soldering in accordance with CECC 802 / Reflow guaranteed Polarity: As marked Mounting Position: Any Mounting Torque: 10 in-lbs maximum Weight: 0.08 oz., 2.24 g
www.vishay.com 1
Document Number 88764 02-Jul-02
UG5JT, UGF5JT, UGB5JT Series
Vishay Semiconductors
formerly General Semiconductor
Maximum Ratings
Parameter
(TC = 25°C unless otherwise noted)
Symbol VRRM VRWM VRMS VDC IF(AV) IFSM TJ, TSTG VISOL
UG5HT 500 400 350 500 5.0 65 –55 to +150 4500 3500(2) 1500(3)
(1)
UG5JT 600 480 420 600
Unit V V V V A A °C V
Maximum repetitive peak reverse voltage Maximum working reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) at TC = 100°C Operating junction and storage temperature range RMS Isolation voltage (UGF types only) from terminals to heatsink with t = 1.0 second, RH ≤ 30%
Electrical Characteristics (T
Parameter Maximum instantaneous forward voltage(4) Maximum DC reverse current at VRWM Maximum reverse recovery time at IF = 0.5A, IR = 1.0A, Irr = 0.25A
C
= 25°C unless otherwise noted)
Symbol IF = 5A, TJ = 25°C IF = 5A, TJ = 125°C TJ = 25°C TJ = 100°C TJ = 125°C VF IR trr trr S IRM IRM tfr
UG5HT 1.75 1.50 30 800 4.0 25 50 0.9 3.0 9.0 500
UG5JT
Unit V µA µA mA ns ns — A A ns
Maximum reverse recovery time at IF = 1.0A, di/dt = 50A/µs, VR = 30V, Irr = 0.1 IRM Typical softness factor (tb/ta) IF = 5.0A, di/dt = 240A/µs, VR = 400V, Irr = 0.1 IRM Maximum reverse recovery current at IF = 5.0A, di/dt = 40A/µs, VR = 400V, TC = 125°C Maximum reverse recovery current at IF = 5.0A, di/dt = 240A/µs, VR = 400V, TC = 125°C Peak forward recovery time at IF = 5.0A, di/dt = 64A/µs, VF = 1.1VF max
Thermal Characteristics (T
Parameter
C
= 25°C unless otherwise noted)
Symbol RθJC
UG5 3.0
UGF5 5.5
UGB5 3.0
Unit °C/W
Typical thermal resistance from junction to case
Notes: (1) Clip mounting (on case), where lead does not overlap heatsink with 0.110” offset (3) Screw mounting with 4-40 screw, where washer diameter is ≤ 4.9 mm (0.19”)
(2) Clip mounting (on case), where leads do overlap heatsink (4) Pulse test: 300µs pulse width, 1% duty cycle
Ordering Information
Product UG5HT & UG5JT UGF5HT & UGF5JT UGB5HT & UGB5JT Case TO-220AC ITO-220AC TO-263AB Package Code 45 45 31 45 81 Package Option Anti-Static tube, 50/tube, 2K/carton Anti-Static tube, 50/tube, 2K/carton 13” reel, 800/reel, 4.8K/carton Anti-Static tube, 50/tube, 2K/carton Anti-Static 13” reel, 800/reel, 4.8K/carton
www.vishay.com 2
Document Number 88764 02-Jul-02
UG5JT, UGF5JT, UGB5JT Series
Vishay Semiconductors
formerly General Semiconductor
Ratings and Characteristic Curves (TA = 25°C unless otherwise noted)
Fig. 1 -- Forward Current Derating Curve
8 100
Fig. 2 -- Maximum Non-Repetitive Peak Forward Surge Current
Peak Forward Surge Current (A)
175
Average Forward Rectified Current (A)
7 6 5 UG5, UGB5 4 UGF5 3 2 1 0 0 25 50 75 100 125 150
80
60
40
20
0 1 10 100
Case Temperature (°C)
Number of Cycles at 60 HZ
Fig. 3 -- Typical Reverse Characteristics
10000 100
Fig. 4 -- Typical Instantaneous Forward Characteristics
Instantaneous Forward Current (A)
Instantaneous Reverse Current (µA)
1000
TJ = 125°C TJ = 100°C
10 TJ = 25°C Pulse Width = 300µs 1% Duty Cycle
100
1
10 TJ = 25°C 1 0 20 40 60 80 100
0.1
0.01 0.5
1
1.5
2
2.5
Percent of Rated Peak Reverse Voltage (%)
Instantaneous Forward Voltage (V)
Fig. 5 -- Typical Junction Capacitance
Stored Charge/Reverse Recovery Time (nC/ns)
100 TJ = 25°C f = 1.0MHZ Vsig = 50 mvp-p 180 160 140 120 100
Fig. 6 -- Reverse Switching Characteristics
Qrr trr IF = 5.0A Vr = 30V 240A/µs di/dt = 60A/µs 80 60 40 20 0 25 50 75 100 125 150 240A/µs
Junction Capacitance (pF)
10
50A/µs 60A/µs
1 1 10 100
Reverse Voltage (V) Document Number 88764 02-Jul-02
Tj -- Junction Temperature (°C) www.vishay.com 3
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