VBUS54DD-HS4-G4-08

VBUS54DD-HS4 Vishay Semiconductors 4-Line BUS-port ESD-protection FEATURES 5 6 4 • Ultra compact LLP1010-6M package • Low package height < 0.4 mm • 4-line USB ESD-protection • Low leakage current • Low load capacitance CD = 0.8 pF • ESD-protection acc. IEC 61000-4-2 ± 15 kV contact discharge ± 15 kV air discharge • Pin plating NiPdAu (e4) no whisker growth • Compliant to RoHS Directive 2002/95/EC and in accordance to WEEE 2002/96/EC 1 2 3 20897 20896 MARKING (example only) XY 20932 Dot = Pin 1 marking X = date code Y = type code (see table below) ORDERING INFORMATION DEVICE NAME VBUS54DD-HS4 ORDERING CODE VBUS54DD-HS4-G4-08 TAPED UNITS PER REEL 5000 (8 mm tape on 7" reel) MINIMUM ORDER QUANTITY 5000 PACKAGE DATA DEVICE NAME VBUS54DD-HS4 PACKAGE NAME LLP1010-6M TYPE CODE D WEIGHT 1.07 mg MOLDING COMPOUND FLAMMABILITY RATING UL 94 V-0 MOISTURE SENSITIVITY LEVEL MSL level 1 (according J-STD-020) SOLDERING CONDITIONS 260 °C/10 s at terminals ABSOLUTE MAXIMUM RATINGS PARAMETER Peak pulse current Peak pulse power ESD immunity Operating temperature Storage temperature TEST CONDITIONS Pin 1, 3, 4 or 5 to Pin 2 or 6 acc. IEC 61000-4-5; tP = 8/20 μs/single shot Pin 1, 3, 4 or 5 to Pin 2 or 6 acc. IEC 61000-4-5, 8/20 μs/single shot Contact discharge acc. IEC 61000-4-2; 10 pulses Air discharge acc. IEC 61000-4-2; 10 pulses Junction temperature SYMBOL IPPM PPP VESD TJ Tstg VALUE 3 57 ± 15 ± 15 - 40 to + 125 - 55 to + 150 UNIT A W kV kV °C °C ** Please see document “Vishay Material Category Policy”: www.vishay.com/doc?99902 Document Number: 83384 Rev. 1.0, 18-Apr-11 For technical questions, contact: ESDprotection@vishay.com www.vishay.com 1 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VBUS54DD-HS4 Vishay Semiconductors 4-Line BUS-port ESD-protection ELECTRICAL CHARACTERISTICS VBUS54DD-HS4 (pin 1, 3, 4 or 5 to pin 2 or 6) PARAMETER Protection paths Reverse stand off voltage Reverse current Reverse breakdown voltage Reverse clamping voltage Forward clamping voltage Capacitance TEST CONDITIONS/REMARKS Number of lines which can be protected at IR = 0.1 μA at VIN = VRWM = 5.5 V at IR = 1 mA at IPP = 3 A; acc. IEC 610000-4-5 at IF = 3 A; acc. IEC 610000-4-5 VIN = 0 V; any other I/O pin at 3.3 V VIN = 2.5 V; any other I/O pin at 3.3 V SYMBOL Nchannel VRWM IR VBR VC VF CD MIN. 5.5 6.9 TYP. < 0.01 8 16 3.5 0.8 0.5 MAX. 4 0.1 8.7 19 4.5 1 0.8 UNIT lines V μA V V V pF pF Note • Ratings at 25 °C, ambient temperature unless otherwise specified. APPLICATION NOTE With the VBUS54DD-HS4 a double, high speed USB-port or up to 4 other high speed signal or data lines can be protected against transient voltage signals. Negative transients will be clamped close below the ground level while positive transients will be clamped close above the working range. The high speed data lines, D1+, D2+, D1- and D2-, are connected to pin 1, 3, 4, and 5, pin 2 or 6 are connected to ground. As long as the signal voltage on the data lines is between the ground- and the break down level, the low input capacitance of each channel offers a very high isolation to ground and to the other data lines. But as soon as any transient signal exceeds this working range, the VBUS054DD-HS4 clamps the transient to ground or to the avalanche break down voltage level. t w i n U S B P o r t 20897-1 VBUS D1+ D15 6 4 R E C E I V E R IC 1 2 3 D2+ D2GND TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) 120 % 100 % 80 % 60 % 20 µs to 50 % 40 % 20 % 0% 0 20548 8 µs to 100 % Rise time = 0.7 ns to 1 ns Discharge Current IESD 40 100 % 80 % 60 % 53 % IPPM 40 % 27 % 20 % 0% - 10 0 10 20 30 40 50 60 70 80 90 100 20557 10 20 30 Time (µs) Time (ns) Fig. 1 - 8/20 μs Peak Pulse Current Wave Form acc. IEC 61000-4-5 www.vishay.com 2 Fig. 2 - ESD Discharge Current Wave Form acc. IEC 61000-4-2 (330 /150 pF) Document Number: 83384 Rev. 1.0, 18-Apr-11 For technical questions, contact: ESDprotection@vishay.com This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VBUS54DD-HS4 4-Line BUS-port ESD-protection Vishay Semiconductors 1.0 0.9 0.8 0.7 f = 1 MHz 20 Measured acc. IEC 61000-4-5 (8/20µs - wave form) 15 CD (pF) VC (V) 0.6 0.5 0.4 0.3 0.2 0.1 0 0 Pin 1, 3, 4 or 5 to pin 2 and 6 (one of pin 1, 3, 4 or 5 connected to 3.3 V) 10 VC 5 Pin 1, 3, 4 or 5 to pin 2 and 6 0 1 2 3 4 5 6 -5 0 1 2 3 4 VR (V) Fig. 3 - Typical Capacitance CD vs. Reverse Voltage VR IPP (A) Fig. 6 - Typical Peak Clamping Voltage VC vs. Peak Pulse Current IPP 100 120 100 Acc. IEC 61000-4-2 + 8 kV contact discharge 10 80 IF (mA) 1 VC-ESD (V) Pin 1, 3, 4 or 5 to pin 2 and 6 60 40 20 0.1 0.01 0 Pin 2 and 6 to pin 1, 3, 4, or 5 0.001 0.5 0.6 0.7 0.8 0.9 1.0 1.1 - 20 - 10 0 10 20 30 40 50 60 70 80 90 VF (V) Fig. 4 - Typical Forward Current IF vs. Forward Voltage VF t (ns) Fig. 7 - Typical Clamping Performance at + 8 kV Contact Discharge (acc. IEC 61000-4-2) 9 8 7 Pin 1, 3, 4 or 5 to pin 2 and 6 6 180 160 140 120 Acc. IEC 61000-4-2 - 8 kV contact discharge VC-ESD (V) VR (V) 100 80 60 40 20 0 Pin 1, 3, 4 or 5 to pin 2 and 6 5 4 3 2 1 0 0.01 0.1 1 101 102 103 104 - 20 - 10 0 10 20 30 40 50 60 70 80 90 IR (µA) Fig. 5 - Typical Reverse Voltage VR vs. Reverse Current IR t (ns) Fig. 8 - Typical Clamping Performance at - 8 kV Contact Discharge (acc. IEC 61000-4-2) Document Number: 83384 Rev. 1.0, 18-Apr-11 For technical questions, contact: ESDprotection@vishay.com www.vishay.com 3 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VBUS54DD-HS4 Vishay Semiconductors 4-Line BUS-port ESD-protection PACKAGE DIMENSIONS in millimeters (Inches): LLP1010-6M 0.22 (0.009) exp. DAP 0.35 (0.014) bsc 0.2 (0.008) 0.25 (0.010) 0.15 (0.006) 0.1 (0.004) 0.5 (0.020) exp. DAP 0.7 (0.028) ref. 0.4 (0.016) 0.33 (0.013) 0.03 (0.001) Pin 1 marking 1.05 (0.041) 0.95 (0.037) 1.05 (0.041) 0.95 (0.037) Foot print recommendation: 0.3 (0.012) 0.175 (0.007) 0.05 (0.002) 0 (0.000) 0.35 (0.014) 0.35 (0.014) 0.5 (0.020) 0.125 (0.005) ref. Solder resist mask Solder pad Soldermask opening ± 0.03 measured middle of the package Document no.:S8-V-3906.04-004 (4) Created - Date: 17.July.2007 Rev. 4 - Date: 09. Sep. 2008 20899 0.7 (0.028) 0.22 (0.009) www.vishay.com 4 For technical questions, contact: ESDprotection@vishay.com Document Number: 83384 Rev. 1.0, 18-Apr-11 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. 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No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 11-Mar-11 www.vishay.com 1