VLMB31..
Vishay Semiconductors
Standard SMD LED PLCC-2
FEATURES • SMD LED with exceptional brightness • Luminous intensity categorized • Compatible with automatic placement e3 equipment • EIA and ICE standard package • Compatible with IR reflow, vapor phase and wave solder processes according to CECC 00802 and J-STD-020C • Available in 8 mm tape • Low profile package • Non-diffused lens: excellent for coupling to light pipes and backlighting • Low power consumption • Luminous intensity ratio in one packaging unit IVmax/IVmin ≤ 1.6 • Lead (Pb)-free device • Preconditioning: according to JEDEC level 2a • ESD-withstand voltage: up to 1 kV according to JESD22-A114-B • Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC APPLICATIONS • Automotive: backlighting in dashboards and switches • Telecommunication: indicator and backlighting in telephone and fax • Indicator and backlight for audio and video equipment • Indicator and backlight in office equipment • Flat backlight for LCDs, switches and symbols • General use
19225
DESCRIPTION The package of the VLMB31..-series is the PLCC-2. It consists of a lead frame which is embedded in a white thermoplast. The reflector inside this package is filled up with clear epoxy.
PRODUCT GROUP AND PACKAGE DATA • Product group: LED • Package: SMD PLCC-2 • Product series: standard • Angle of half intensity: ± 60°
PARTS TABLE
PART VLMB31J2L2-GS08 VLMB31J2L2-GS18 VLMB31K2L2-GS08 VLMB31K2L2-GS18 VLMB31J2K2-GS08 VLMB31J2K2-GS18 COLOR, LUMINOUS INTENSITY Blue, IV = (5.6 to 18) mcd Blue, IV = (5.6 to 18) mcd Blue, IV = (9 to 18) mcd Blue, IV = (9 to 18) mcd Blue, IV = (5.6 to 11.2) mcd Blue, IV = (5.6 to 11.2) mcd TECHNOLOGY InGaN on SiC InGaN on SiC InGaN on SiC InGaN on SiC InGaN on SiC InGaN on SiC
Document Number 81621 Rev. 1.1, 23-Oct-07
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VLMB31..
Vishay Semiconductors
ABSOLUTE MAXIMUM RATINGS1) VLMB31..
PARAMETER Reverse voltage2) DC Forward current Surge forward current Power dissipation Junction temperature Operating temperature range Storage temperature range Thermal resistance junction/ ambient mounted on PC board (pad size > 16 mm2) Tamb ≤ 60 °C tp ≤ 10 µs TEST CONDITION SYMBOL VR IF IFSM PV Tj Tamb Tstg RthJA VALUE 5 20 0.2 84 100 - 40 to + 100 - 40 to + 100 350 UNIT V mA A mW °C °C °C K/W
Note: 1) Tamb = 25 °C, unless otherwise specified 2) Driving LED in reverse direction is suitable for short term application
OPTICAL AND ELECTRICAL CHARACTERISTICS1) VLMB31.., BLUE
PARAMETER Luminous intensity2) Dominant wavelength Peak wavelength Angle of half intensity Forward voltage Reverse voltage Temperature coefficient of VF Temperature coefficient of IV TEST CONDITION IF = 10 mA IF = 10 mA IF = 10 mA IF = 10 mA IF = 20 mA IR = 10 µA IF = 10 mA IF = 10 mA PART VLMB31J2L2 VLMB31K2L2 VLMB31J2K2 SYMBOL IV IV IV λd λp ϕ VF VR TCV TCI 5 -4 - 0.4 MIN 5.6 9 5.6 458 466 428 ± 60 3.9 4.5 TYP MAX 18 18 11.2 472 UNIT mcd mcd mcd nm nm deg V V mV/K %/K
Note: 1) T amb = 25 °C, unless otherwise specified 2) In one packing unit I Vmax/IVmin ≤ 1.6
LUMINOUS INTENSITY CLASSIFICATION
GROUP STANDARD J K L 2 1 2 1 2 LIGHT INTENSITY (MCD) OPTIONAL MIN 5.6 7.1 9 11.2 14 MAX 7.1 9 11.2 14 18
COLOR CLASSIFICATION
BLUE GROUP 2 3 4 DOM. WAVELENGTH (NM) MIN. 458 462 466 MAX. 464 468 472
Note: Luminous intensity is tested at a current pulse duration of 25 ms and an accuracy of ± 11 %. The above type numbers represent the order groups which include only a few brightness groups. Only one group will be shipped on each reel (there will be no mixing of two groups on each reel). In order to ensure availability, single brightness groups will not be orderable. In a similar manner for colors where wavelength groups are measured and binned, single wavelength groups will be shipped on any one reel. In order to ensure availability, single wavelength groups will not be orderable.
Note: Wavelengths are tested at a current pulse duration of 25 ms and an accuracy of ± 1 nm.
CROSSING TABLE
VISHAY VLMB31J2L2 VLMB31K2L2 VLMB31J2K2 OSRAM LBT676J2L2 LBT676K2L2 LBT676J2K2
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Document Number 81621 Rev. 1.1, 23-Oct-07
VLMB31..
Vishay Semiconductors
TYPICAL CHARACTERISTICS Tamb = 25 °C, unless otherwise specified
25 20 15 10 5 0 0
20916
100
IF - Forward Current (mA)
IF - Forward Current (mA)
10
1 10 20 30 40 50 60 70 80 90 100 110 Tamb - Ambient Temperature (°C)
15846
0
1
2
3
4
5
6
7
8
VF - Forward Voltage (V)
Figure 1. Forward Current vs. Ambient Temperature for InGaN
Figure 4. Forward Current vs. Forward Voltage
0°
10°
20° 30°
IV rel - Relative Luminous Intensity
10
IV rel - Relative Luminous Intensity
40° 1.0 0.9 0.8 0.7 50° 60° 70° 80° 0.6 0.4 0.2 0 0.2 0.4 0.6
1
0.1
0.01
95 10319
1
20447
10 IF - Forward Current (mA)
100
Figure 2. Relative Luminous Intensity
Figure 5. Specific Luminous Flux vs. Forward Current
1.2
476
blue
IV rel - Relative Luminous Intensity
1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 400
blue Dominant Wavelength λ (nm) ı 474
472
470
468
420 440 460 480 500 520 540 560
16814
0
10
20
30
40
50
16069
λ - Wavelength (nm)
IF - Forward Current (mA)
Figure 3. Relative Intensity vs. Wavelength
Figure 6. Dominant Wavelength vs. Forward Current
Document Number 81621 Rev. 1.1, 23-Oct-07
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VLMB31..
Vishay Semiconductors
PACKAGE DIMENSIONS in millimeters
3.5 ± 0.2
1.75 ± 0.10
technical drawings according to DIN specifications
0.9
Mounting Pad Layout Pin identification 1.2 area covered with solder resist
2.6 (2.8)
+ 0.15
2.2
C
A
2.8
4 1.6 (1.9)
?
2.4
3
+ 0.15
Drawing-No.: 6.541-5025.01-4 Issue: 8; 22.11.05
95 11314-1
METHOD OF TAPING/POLARITY AND TAPE AND REEL SMD LED (VLM3 - SERIES) Vishay’s LEDs in SMD packages are available in an antistatic 8 mm blister tape (in accordance with DIN IEC 40 (CO) 564) for automatic component insertion. The blister tape is a plastic strip with impressed component cavities, covered by a top tape. TAPING OF VLM.3..
3.5 3.1
4
2.2 2.0
5.75 5.25 3.6 3.4 8.3 7.7
4.0 3.6
Adhesive Tape
1.85 1.65
1.6 1.4
4.1 3.9
2.05 1.95
4.1 3.9
0.25
Blister Tape
94 8668
Figure 7. Tape Dimensions in mm for PLCC-2
Component Cavity
94 8670
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Document Number 81621 Rev. 1.1, 23-Oct-07
VLMB31..
Vishay Semiconductors
REEL PACKAGE DIMENSION IN MM FOR SMD LEDS, TAPE OPTION GS08 (= 1500 PCS.)
10.0 9.0
REEL PACKAGE DIMENSION IN MM FOR SMD LEDS, TAPE OPTION GS18 (= 8000 PCS.) PREFERRED
10.4 8.4
120°
120°
4.5 3.5 2.5 1.5
13.00 12.75 63.5 60.5
4.5 3.5 2.5 1.5
13.00 12.75 62.5 60.0
Identification Label: Vishay Type Group Tape Code Production Code Quantity
Identification Label: Vishay Type Group Tape Code Production Code Quantity
180 178
14.4 max.
94 8665
321 329
14.4 max.
18857
Figure 8. Reel Dimensions - GS08
Figure 9. Reel Dimensions - GS18
SOLDERING PROFILE
IR Reflow Soldering Profile for Lead (Pb)-free Soldering
Preconditioning acc. to JEDEC Level 2a
BAR CODE PRODUCT LABEL EXAMPLE:
300 250 Temperature (°C) 200 max. 30 s 150 max. 120 s 100 50 0 0
19885
255 °C 240 °C 217 °C
max. 260 °C 245 °C
106 A H VISHAY 37
max. 100 s
max. ramp up 3 °C/s
max. ramp down 6 °C/s
B
50 100 150 Time (s) 200 250 300
C
D
E
F
G
20147
max. 2 cycles allowed
Figure 10. Vishay Lead (Pb)-free Reflow Soldering Profile (acc. to J-STD-020C)
TTW Soldering 300 250 Temperature (°C) 200 150 100 50 0 0 50 100 Time (s) 150 200 250 2 K/s forced cooling ca. 5 K/s 235 °C...260 °C first wave ca. 200 K/s 100 °C...130 °C second wave ca. 2 K/s full line: typical dotted line: process limits 5s
(acc. to CECC00802) 948626-1
Lead Temperature
A) Type of component B) Manufacturing Plant C) SEL - selection code (bin): e.g.: P2 = code for luminous intensity group 3 = code for color group D) Date code year/week E) Day code (e.g. 2: Tuesday) F) Batch no. G) Total quantity H) Company code
Figure 11. Double Wave Soldering of Opto Devices (all Packages)
Document Number 81621 Rev. 1.1, 23-Oct-07
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VLMB31..
Vishay Semiconductors
DRY PACKING The reel is packed in an anti-humidity bag to protect the devices from absorbing moisture during transportation and storage.
LEVEL This bag contains MOISTURE –SENSITIVE DEVICES
CAUTION
2a
1. Shelf life in sealed bag 12 months at
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