VLMC3100

VLMC310. Vishay Semiconductors Low Current SMD LED PLCC-2 FEATURES • SMD LED with exceptional brightness • Compatible with automatic placement equipment e3 • EIA and ICE standard package • Compatible with infrared, vapor phase and wave solder processes according to CECC 00802 and J-STD-020C • Available in 8 mm tape • Low profile package • Non-diffused lens: excellent for coupling to light pipes and backlighting • Very low power consumption • Luminous intensity ratio in one packaging unit IVmax/IVmin ≤ 2.0 • Lead (Pb)-free device • Preconditioning: according to Jedec level 2a • Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC APPLICATIONS • Automotive: backlighting in dashboards and switches • Telecommunication: indicator and backlighting in telephone and fax • Indicator and backlight for audio and video equipment • Indicator and backlight for battery driven equipment • Small indicator for outdoor applications • Indicator and backlight in office equipment • Flat backlight for LCDs, switches and symbols • General use 19225 DESCRIPTION These new devices have been designed to meet the increasing demand for low current SMD LEDs. The package of the VLMC310. is the PLCC-2 (equivalent to a size B tantalum capacitor). It consists of a lead frame which is embedded in a white thermoplast. The reflector inside this package is filled up with clear epoxy. PRODUCT GROUP AND PACKAGE DATA • Product group: LED • Package: SMD PLCC-2 • Product series: low current • Angle of half intensity: ± 60° PARTS TABLE PART VLMC3100 VLMC3101 COLOR, LUMINOUS INTENSITY Green, IV > 0.71 mcd Green, IV > 1.12 mcd TECHNOLOGY GaP on GaP GaP on GaP Document Number 81649 Rev. 1.1, 18-Sep-07 www.vishay.com 1 VLMC310. Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS1) VLMC310. PARAMETER Reverse voltage 2) TEST CONDITION SYMBOL VR IF VALUE 6 7 0.5 20 100 - 40 to + 100 - 40 to + 100 260 500 UNIT V mA A mW °C °C °C °C K/W DC Forward current Surge forward current Power dissipation Junction temperature Operating temperature range Storage temperature range Soldering temperature Thermal resistance junction/ ambient t≤5s mounted on PC board (pad size > 16 mm2) tp ≤ 10 µs IFSM PV Tj Tamb Tstg Tsd RthJA Note: 1) Tamb = 25 °C unless otherwise specified 2) Driving the LED in reverse direction is suitable for a short term application OPTICAL AND ELECTRICAL CHARACTERISTICS1) VLMC310., GREEN PARAMETER Luminous intensity 2) Dominant wavelength Peak wavelength Angle of half intensity Forward voltage Reverse voltage Junction capacitance Note: 1) T amb = 25 °C unless otherwise specified 2) in one Packing Unit IVmax/IVmin ≤ 2.0 TEST CONDITION IF = 2 m A IF = 2 m A IF = 2 m A IF = 2 m A IF = 2 m A IR = 10 µA VR = 0, f = 1 MHz PART VLMC3100 VLMC3101 SYMBOL IV IV λd λp ϕ VF VR Cj 6 MIN 0.71 1.12 562 565 ± 60 1.9 15 50 2.4 TYP. 1.6 1.6 575 MAX UNIT mcd mcd nm nm deg V V pF COLOR CLASSIFICATION GREEN GROUP 3 4 5 6 7 8 Note: Wavelengths are tested at a current pulse duration of 25 ms and an accuracy of ± 1 nm. DOM. WAVELENGTH (NM) MIN. 562 564 566 568 570 572 MAX. 565 567 569 571 573 575 LUMINOUS INTENSITY CLASSIFICATION GROUP STANDARD E1 E2 F1 Note: Luminous intensity is tested at a current pulse duration of 25 ms and an accuracy of ± 11 %. The above Type Numbers represent the order groups which include only a few brightness groups. Only one group will be shipped on each reel (there will be no mixing of two groups on each reel). In order to ensure availability, single brightness groups will not be orderable. In a similar manner for colors where wavelength groups are measured and binned, single wavelength groups will be shipped on any one reel. In order to ensure availability, single wavelength groups will not be orderable. 1 2 1 LIGHT INTENSITY (MCD) OPTIONAL MIN 0.71 0.90 1.12 MAX 0.90 1.12 1.40 www.vishay.com 2 Document Number 81649 Rev. 1.1, 18-Sep-07 VLMC310. Vishay Semiconductors TYPICAL CHARACTERISTICS Tamb = 25 °C, unless otherwise specified 10 I v rel - Relative Luminous Intensity 1.6 Green 1.2 IF - Forward Current (mA) 8 6 0.8 4 2 0 0 20 40 60 80 100 0.4 I F = 2 mA 0 0 20 40 60 80 100 95 10842 Tamb - Ambient Temperature (°C) 95 10057 Tamb - Ambient Temperature (°C) Figure 1. Forward Current vs. Ambient Temperature Figure 4. Rel. Luminous Intensity vs. Ambient Temperature 0° 10° 20° IV rel - Relative Luminous Intensity I v rel - Specific Luminous Intensity 30° 2.4 green 2.0 1.6 1.2 0.8 0.4 0 40° 1.0 0.9 0.8 0.7 50° 60° 70° 80° 0.4 0.2 0 0.2 0.4 0.6 0.6 95 10319 16486 10 1 20 0.5 50 0.2 100 0.1 200 0.05 500 I F/mA 0.02 tp/T Figure 2. Rel. Luminous Intensity vs. Angular Displacement Figure 5. Rel. Lumin. Intensity vs. Forw. Current/Duty Cycle 100 100 I v rel - Relative Luminous Intensity I F - Forward Current (mA) Green 10 Green 10 1 1 0.1 0.1 0 95 10056 tp/T= 0.001 tp = 10 µs 1 2 3 4 5 0.01 0.1 95 10059 1 10 100 VF - Forward Voltage (V) I F - Forward Current (mA) Figure 3. Forward Current vs. Forward Voltage Figure 6. Relative Luminous Intensity vs. Forward Current Document Number 81649 Rev. 1.1, 18-Sep-07 www.vishay.com 3 VLMC310. Vishay Semiconductors 1.2 IVrel - Relative Luminous Intensity green 1.0 0.8 0.6 0.4 0.2 0 520 540 560 580 600 620 95 10038 λ - Wavelength (nm) Figure 7. Relative Intensity vs. Wavelength PACKAGE DIMENSIONS in millimeters Mounting Pad Layout 1.2 area covered with solder resist 2.6 (2.8) 4 1.6 (1.9) 20541 www.vishay.com 4 4 Document Number 81649 Rev. 1.1, 18-Sep-07 VLMC310. Vishay Semiconductors METHOD OF TAPING/POLARITY AND TAPE AND REEL SMD LED (VLM3 - SERIES) Vishay’s LEDs in SMD packages are available in an antistatic 8 mm blister tape (in accordance with DIN IEC 40 (CO) 564) for automatic component insertion. The blister tape is a plastic strip with impressed component cavities, covered by a top tape. Identification Adhesive Tape REEL PACKAGE DIMENSION IN MM FOR SMD LEDS, TAPE OPTION GS18 (= 8000 PCS.) PREFERRED 120° 10.4 8.4 4.5 3.5 2.5 1.5 13.00 12.75 62.5 60.0 Blister Tape Label: Vishay Type Group Tape Code Production Code Quantity 321 329 14.4 max. 18857 Figure 10. Reel Dimensions - GS18 Component Cavity 94 8670 SOLDERING PROFILE IR Reflow Soldering Profile for Lead (Pb)-free Soldering Preconditioning acc. to JEDEC Level 2a TAPING OF VLM.3.. 300 3.5 3.1 2.2 2.0 250 Temperature (°C) 200 255 °C 240 °C 217 °C max. 30 s max. 260 °C 245 °C 5.75 5.25 3.6 3.4 1.85 1.65 4.0 3.6 8.3 7.7 150 max. 120 s 100 50 0 max. ramp up 3 °C/s max. ramp down 6 °C/s max. 100 s 1.6 1.4 4.1 3.9 2.05 1.95 4.1 3.9 0.25 94 8668 0 19885 50 100 150 Time (s) 200 250 300 Figure 8. Tape Dimensions in mm for PLCC-2 max. 2 cycles allowed Figure 11. Vishay Lead (Pb)-free Reflow Soldering Profile (acc. to J-STD-020C) REEL PACKAGE DIMENSION IN MM FOR SMD LEDS, TAPE OPTION GS08 (= 1500 PCS.) 120° TTW Soldering 300 250 Temperature (°C) 5s 235 °C...260 °C first wave ca. 200 K/s 100 °C...130 °C 100 50 0 0 50 (acc. to CECC00802) 948626-1 Lead Temperature second wave ca. 2 K/s full line: typical dotted line: process limits 10.0 9.0 200 150 4.5 3.5 2.5 1.5 13.00 12.75 63.5 60.5 2 K/s forced cooling 100 Time (s) 150 ca. 5 K/s Identification Label: Vishay Type Group Tape Code Production Code Quantity 200 250 180 178 14.4 max. 94 8665 Figure 12. Double Wave Soldering of Opto Devices (all Packages) Figure 9. Reel Dimensions - GS08 Document Number 81649 Rev. 1.1, 18-Sep-07 www.vishay.com 5 VLMC310. Vishay Semiconductors BAR CODE PRODUCT LABEL EXAMPLE: 106 A H VISHAY 37 B C D E F G 20127 A) Type of component B) Manufacturing plant C) SEL - selection code (bin): e.g.: J1 = code for luminous intensity group D) Date code year/week E) Day code (e.g. 3: Wednesday) F) Batch no. G) Total quantity H) Company code DRY PACKING The reel is packed in an anti-humidity bag to protect the devices from absorbing moisture during transportation and storage. Aluminum bag RECOMMENDED METHOD OF STORAGE Dry box storage is recommended as soon as the aluminium bag has been opened to prevent moisture absorption. The following conditions should be observed, if dry boxes are not available: • Storage temperature 10 °C to 30 °C • Storage humidity ≤ 60 % RH max. After more than 672 h under these conditions moisture content will be too high for reflow soldering. In case of moisture absorption, the devices will recover to the former condition by drying under the following condition: 192 h at 40 °C + 5 °C/ - 0 °C and < 5 % RH (dry air/ nitrogen) or 96 h at 60 °C + 5 °C and < 5 % RH for all device containers or 24 h at 100 °C + 5 °C not suitable for reel or tubes. An EIA JEDEC standard JESD22-A112 level 2a label is included on all dry bags. LEVEL This bag contains MOISTURE –SENSITIVE DEVICES CAUTION 2a 1. Shelf life in sealed bag 12 months at