VLMF3100-GS08

VLMF310. Vishay Semiconductors Standard SMD LED PLCC-2 FEATURES • SMD LED with exceptional brightness • Luminous intensity categorized • Compatible with automatic placement e3 equipment • EIA and ICE standard package • Compatible with IR reflow, vapor phase and wave solder processes according to CECC 00802 and J-STD-020B • Available in 8 mm tape • Low profile package • Non-diffused lens: excellent for coupling to light pipes and backlighting • Low power consumption • Luminous intensity ratio in one packaging unit IVmax/IVmin ≤ 1.6 • Lead (Pb)-free device • Preconditioning: acc. to JEDEC level 2a APPLICATIONS • Automotive: backlighting in dashboards and switches • Telecommunication: indicator and backlighting in telephone and fax • Indicator and backlight for audio and video equipment • Indicator and backlight in office equipment • Flat backlight for LCDs, switches and symbols • General use 19225 DESCRIPTION This device has been designed to meet the increasing demand for AlInGaP technology. The package of the VLMF310. is the PLCC-2 (equivalent to a size B tantalum capacitor). It consists of a lead frame which is embedded in a white thermoplast. The reflector inside this package is filled up with clear epoxy. PRODUCT GROUP AND PACKAGE DATA • Product group: LED • Package: SMD PLCC-2 • Product series: standard • Angle of half intensity: ± 60° PARTS TABLE PART VLMF3100-GS08 VLMF3100-GS18 VLMF3101-GS08 VLMF3101-GS18 COLOR, LUMINOUS INTENSITY Soft orange, IV > 28 mcd Soft orange, IV > 28 mcd Soft orange, IV = (45 to 112) mcd Soft orange, IV = (45 to 112) mcd TECHNOLOGY AllnGaP on GaAs AllnGaP on GaAs AllnGaP on GaAs AllnGaP on GaAs Document Number 81235 Rev. 1.1, 31-Aug-07 www.vishay.com 1 VLMF310. Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS1) VLMF310. PARAMETER Reverse voltage2) DC Forward current Surge forward current Power dissipation Junction temperature Operating temperature range Storage temperature range Thermal resistance junction/ ambient mounted on PC board (pad size > 16 mm2) Tamb ≤ 85 °C tp ≤ 10 µs TEST CONDITION SYMBOL VR IF IFSM PV Tj Tamb Tstg RthJA VALUE 5 30 0.1 80 125 - 40 to + 100 - 40 to + 100 400 UNIT V mA A mW °C °C °C K/W Note: 1) T amb = 25 °C, unless otherwise specified 2) Driving LED in reverse direction is suitable for short term application OPTICAL AND ELECTRICAL CHARACTERISTICS1) VLMF310., SOFT ORANGE PARAMETER Luminous intensity Dominant wavelength Peak wavelength Angle of half intensity Forward voltage Reverse voltage Junction capacitance Note: In one Packing Unit IVmax/IVmin ≤ 1.6 1) Tamb = 25 °C, unless otherwise specified TEST CONDITION IF = 10 mA IF = 10 mA IF = 10 mA IF = 10 mA IF = 20 mA IR = 10 µA VR = 0, f = 1 MHz PART VLMF3100 VLMF3101 SYMBOL IV IV λd λp ϕ VF VR Cj 5 15 MIN 28 45 598 605 590 ± 60 2.0 2.6 TYP. 90 112 611 MAX UNIT mcd mcd nm nm deg V V pF LUMINOUS INTENSITY CLASSIFICATION GROUP STANDARD M N P Q R S 1 2 1 2 1 2 1 2 1 2 1 2 22.4 28.0 35.5 45 56 71 90 112 140 180 224 28.0 35.5 45 56 71 90 112 140 180 224 280 LIGHT INTENSITY (MCD) OPTIONAL MIN MAX In a similar manner for colors where wavelength groups are measured and binned, single wavelength groups will be shipped on any one reel. In order to ensure availability, single wavelength groups will not be orderable. CROSSING TABLE VISHAY VLMF3100 VLMF3101 OSRAM LOT676 LOT676R1S1 COLOR CLASSIFICATION SOFT ORANGE GROUP 1 2 3 4 5 6 DOM. WAVELENGTH (NM) MIN. 598 600 602 604 606 608 MAX. 601 603 605 607 609 611 Note: Luminous intensity is tested at a current pulse duration of 25 ms and an accuracy of ± 11 %. The above type numbers represent the order groups which include only a few brightness groups. Only one group will be shipped on each reel (there will be no mixing of two groups on each reel). In order to ensure availability, single brightness groups will not be orderable. www.vishay.com 2 Document Number 81235 Rev. 1.1, 31-Aug-07 VLMF310. Vishay Semiconductors TYPICAL CHARACTERISTICS Tamb = 25 °C, unless otherwise specified 40 35 I V rel - Relative Luminous Intensity 0 10 20 30 40 50 60 70 80 90 100 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 10 20 30 40 50 60 70 80 90 100 IF - Forward Current (mA) 30 25 20 15 10 5 0 16615 Tamb - Ambient Temperature (°C) 95 10883 Tamb - Ambient Temperature (°C) Figure 1. Forward Current vs. Ambient Temperature for InGaN Figure 4. Rel. Luminous Intensity vs. Ambient Temperature 0° 10° 20° 30° 2.0 IV rel - Relative Luminous Intensity IV rel - Relative Luminous Intensity 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 1 2 5 10 20 50 40° 1.0 0.9 0.8 0.7 50° 60° 70° 80° 0.6 0.4 0.2 0 0.2 0.4 0.6 95 10319 IF (mA) tP/T 96 11589 1 0.5 0.2 0.1 0.05 0.02 Figure 2. Rel. Luminous Intensity vs. Angular Displacement Figure 5. Rel. Lumin. Intensity vs. Forw. Current/Duty Cycle 100 10 IV rel - Relative Luminous Intensity IF - Forward Current (mA) 1 10 0.1 1 1.0 95 10878 0.01 1.5 2.0 2.5 3.0 96 11588 1 10 100 VF - Forward Voltage (V) IF - Forward Current (mA) Figure 3. Forward Current vs. Forward Voltage Figure 6. Relative Luminous Intensity vs. Forward Current Document Number 81235 Rev. 1.1, 31-Aug-07 www.vishay.com 3 VLMF310. Vishay Semiconductors 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 560 570 580 590 600 610 620 630 640 650 660 95 10885 1000.00 soft orange t p /T = 0.01 I FM - Forward Current (mA) 0.02 0.05 0.1 100.00 0.2 0.5 1 10.00 0.01 I rel - Relative Intensity 0.10 1.00 10.00 100.00 λ - Wavelength (nm) 16620 t p - Pulse Length (ms) Figure 7. Relative Intensity vs. Wavelength Figure 9. Forward Current vs. Pulse Length 2.10 VFrel - Forward Voltage (V) 2.05 2.00 1.95 1.90 1.85 1.80 1.75 1.70 1.65 1.60 0 10 20 I F = 20 mA soft orange 30 40 50 60 70 80 90 100 16619 Tamb - Ambient Temperature (°C) Figure 8. Forward Voltage vs. Ambient Temperature PACKAGE DIMENSIONS in millimeters 3.5 ± 0.2 1.75 ± 0.10 technical drawings according to DIN specifications 0.9 Mounting Pad Layout Pin identification 1.2 area covered with solder resist 2.6 (2.8) + 0.15 2.2 C A 2.8 4 1.6 (1.9) ? 2.4 3 + 0.15 Drawing-No.: 6.541-5025.01-4 Issue: 8; 22.11.05 95 11314-1 www.vishay.com 4 4 Document Number 81235 Rev. 1.1, 31-Aug-07 VLMF310. Vishay Semiconductors METHOD OF TAPING/POLARITY AND TAPE AND REEL SMD LED (VLM3 - SERIES) Vishay’s LEDs in SMD packages are available in an antistatic 8 mm blister tape (in accordance with DIN IEC 40 (CO) 564) for automatic component insertation. The blister tape is a plastic strip with impressed component cavaties, covered by a top tape. REEL PACKAGE DIMENSION IN MM FOR SMD LEDS, TAPE OPTION GS18 (= 8000 PCS.) PREFERRED 120° 10.4 8.4 4.5 3.5 2.5 1.5 13.00 12.75 62.5 60.0 Adhesive Tape Identification Label: Vishay Type Group Tape Code Production Code Quantity Blister Tape 321 329 14.4 max. 18857 Figure 12. Reel Dimensions - GS18 Component Cavity 94 8670 SOLDERING PROFILE IR Reflow Soldering Profile for lead (Pb)-free soldering Preconditioning acc. to JEDEC Level 2a TAPING OF VLM.3.. 300 3.5 3.1 2.2 2.0 250 Temperature (°C) 200 255 °C 240 °C 217 °C max. 30 s max. 260 °C 245 °C 5.75 5.25 3.6 3.4 1.85 1.65 4.0 3.6 8.3 7.7 150 max. 120 s 100 50 0 max. ramp up 3 °C/s max. ramp down 6 °C/s max. 100 s 1.6 1.4 4.1 3.9 2.05 1.95 4.1 3.9 0.25 94 8668 0 19885 50 100 150 Time (s) 200 250 300 Figure 10. Tape Dimensions in mm for PLCC-2 max. 2 cycles allowed REEL PACKAGE DIMENSION IN MM FOR SMD LEDS, TAPE OPTION GS08 (= 1500 PCS.) 120° 10.0 9.0 Figure 13. Vishay Leadfree Reflow Soldering Profile (acc. to J-STD-020B) TTW Soldering 300 250 Temperature (°C) 200 150 100 50 0 235 °C...260 °C first wave ca. 200 K/s 100 °C...130 °C 5s (acc. to CECC00802) 948626-1 Lead Temperature second wave ca. 2 K/s full line: typical dotted line: process limits 4.5 3.5 2.5 1.5 13.00 12.75 63.5 60.5 Identification Label: Vishay Type Group Tape Code Production Code Quantity 2 K/s forced cooling ca. 5 K/s 180 178 14.4 max. 94 8665 0 50 100 Time (s) 150 200 250 Figure 11. Reel Dimensions - GS08 Figure 14. Double Wave Soldering of Opto Devices (all Packages) Document Number 81235 Rev. 1.1, 31-Aug-07 www.vishay.com 5 VLMF310. Vishay Semiconductors BAR CODE PRODUCT LABEL EXAMPLE: RECOMMENDED METHOD OF STORAGE Dry box storage is recommended as soon as the aluminum bag has been opened to prevent moisture absorption. The following conditions should be observed, if dry boxes are not available: • Storage temperature 10 °C to 30 °C • Storage humidity ≤ 60 % RH max. After more than 672 h under these conditions moisture content will be too high for reflow soldering. In case of moisture absorption, the devices will recover to the former condition by drying under the following condition: 192 h at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/ nitrogen) or 96 h at 60 °C + 5 °C and < 5 % RH for all device containers or 24 h at 100 °C + 5 °C not suitable for reel or tubes. An EIA JEDEC Standard JESD22-A112 level 2a label is included on all dry bags. LEVEL This bag contains MOISTURE –SENSITIVE DEVICES 106 A H VISHAY 37 BC D E F G 19905 A) Type of component B) Manufacturing Plant C) SEL - selection code (bin): e.g.: N2 = code for luminous intensity group 3 = code for color group D) Date code year/week E) Day code (e. g. 1: Monday) F) Batch no. G) Total quantity H) Company code DRY PACKING The reel is packed in an anti-humidity bag to protect the devices from absorbing moisture during transportation and storage. CAUTION 2a 1. Shelf life in sealed bag 12 months at